AMD XCV600E-7FG676C

Overview

XCV600E-7FG676C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 985,882 system gates and 15,552 logic cells in a 48 × 72 CLB array. It features eight digital Delay-Locked Loops (DLLs), up to 404 user I/O pins in FG676 package, and supports LVDS (622 Mb/s), LVPECL, and PCI 33/66 MHz interfaces. It is used in high-speed communication line cards requiring deterministic clock management and multi-standard I/O interfacing.

For engineers reviewing the XCV600E-7FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include its -7 speed grade (4.3 ns register-to-register delay), 1.8 V core voltage, dual-port block RAM capacity (294,912 bits), and compatibility with SelectI/O+ standards including SSTL3, HSTL, and BLVDS across eight I/O banks.

Technical Context

The XCV600E-7FG676C implements a regular FPGA architecture with configurable logic blocks (CLBs) containing four logic cells each, distributed RAM (221,184 bits), and 72 dedicated 4096-bit block RAMs supporting true dual-port operation. Its eight DLLs provide zero-delay clock conversion, 50% duty-cycle correction for DDR, and frequency multiplication up to 4×.

It uses a 0.18 μm 6-layer metal CMOS process with 3 V-tolerant I/Os powered by bank-specific VCCO (1.5–3.3 V), and supports mixed-voltage I/O banking where LVTTL/LVCMOS inputs are powered by VCCO-not VCCINT-enabling flexible interface coexistence within defined voltage domains.

Key Specifications

Pinout & Package

Package: Fine Pitch Ball Grid Array (FG676) with 676 balls, 1.0 mm pitch, RoHS-compliant, thermal-enhanced design suitable for industrial PCB assembly and thermal management.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV600E-7FG676C, the -6 variant trades 7% speed for lower cost and power, while the XCV800E-7FG676C adds 39% more logic cells within identical mechanical and thermal constraints-making both viable alternatives depending on whether timing headroom or logic capacity is the limiting factor.

Availability

XCV600E-7FG676C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, medical imaging, and high-speed test equipment requiring stable component supply over extended product lifecycles.

Supply support for XCV600E-7FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and development tools for high-performance digital system design.

The Virtex-E family was designed for high-speed, high-density reconfigurable logic applications in communications and computing, emphasizing I/O flexibility, clock management, and memory hierarchy over raw gate count.

FAQ

What is the maximum differential I/O pair count supported by XCV600E-7FG676C?

The XCV600E-7FG676C supports up to 247 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This capacity enables implementation of multiple high-speed serial links such as LVDS or BLVDS interfaces while maintaining signal integrity through controlled impedance routing on the PCB. The actual usable count depends on I/O banking constraints and VCCO/VREF allocation per bank.

Does XCV600E-7FG676C support 5 V tolerant I/O?

No, XCV600E-7FG676C does not support native 5 V tolerant I/O. Its I/O pins are 3 V tolerant, and can be made 5 V tolerant only with an external 100 Ω series resistor per pin, as stated in the "Virtex-E Compared to Virtex Devices" section. PCI 5 V signaling is explicitly unsupported, and no internal clamping diodes connect to 5 V rails.

How many DLLs are integrated into XCV600E-7FG676C and what are their primary functions?

XCV600E-7FG676C integrates eight fully digital Delay-Locked Loops (DLLs). Their primary functions include zero-delay clock conversion from high-speed LVPECL/LVDS inputs, 50% duty-cycle correction for DDR applications, clock multiplication up to 4×, and phase alignment across multiple clock domains. Each DLL operates independently and supports clock mirroring for balanced tree distribution.

Is XCV600E-7FG676C pin-compatible with earlier Virtex family FPGAs?

XCV600E-7FG676C is not bitstream-compatible with Virtex family devices, but the same device in the same package is pin-compatible with minor exceptions. As noted in DS022-1, pin J10 is "No Connect" and pin J30 is "VREF option only" specifically for XCV600E, requiring verification against Module 4 pinout tables before migration from Virtex designs.

What memory resources are available on XCV600E-7FG676C for embedded data buffering?

XCV600E-7FG676C provides 294,912 bits of synchronous block RAM (72 × 4096-bit true dual-port blocks) and 221,184 bits of distributed RAM implemented in CLBs. This hierarchical memory supports simultaneous read/write operations, deep FIFOs, coefficient storage, and line buffers-enabling full-frame image processing or protocol stack buffering without external memory chips.