AMD XCV600E-7FG676C0773

Overview

XCV600E-7FG676C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 985,882 system gates, 15,552 logic cells, and 72 block RAMs (294,912 bits), designed for high-speed digital signal processing, telecom infrastructure, and PCI-compliant interface bridging in commercial-temperature environments.

For engineers reviewing the XCV600E-7FG676C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, SelectRAM+ memory configuration, and FPGA-level clock management for deterministic place-and-route planning.

Technical Context

The XCV600E-7FG676C implements a 48 × 72 CLB array with eight fully digital Delay-Locked Loops (DLLs), each supporting 4× frequency multiplication and zero-delay LVPECL/LVDS clock conversion to any I/O standard. Its SelectI/O+ technology enables up to 404 user I/O pins across 8 banks, with per-bank VCCO and VREF constraints governing mixed-standard interfacing.

Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–6 input functions, and dual synchronous/asynchronous set/reset. Block RAMs are true dual-port 4096-bit modules arranged in columns every 12 CLB columns, with independent port width configuration and dedicated routing to CLBs.

Key Specifications

Pinout & Package

Package: Fine Pitch Ball Grid Array (FG676) with 676 balls, 1.0 mm pitch, and 27 mm × 27 mm body size. Thermal pad on underside requires solder paste stencil design per Xilinx PCB guidelines.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV600E-7FG676C, the -8 variant delivers marginally improved timing closure at identical cost and footprint, while the XCV800E-7 offers scalable logic density within the same mechanical and thermal envelope-both retain full toolchain compatibility with Xilinx Foundation and Alliance Series software.

Availability

XCV600E-7FG676C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging subsystems, and industrial motion control applications requiring stable component supply amid long product lifecycles.

Supply support for XCV600E-7FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGA architecture and developed the Virtex family as high-performance programmable logic for demanding system-level applications.

The Virtex-E product line was engineered specifically for high-bandwidth, low-latency digital systems requiring integrated clock management, flexible I/O banking, and scalable memory hierarchy-targeting telecom, test equipment, and high-end embedded control.

FAQ

What is the maximum LVDS data rate supported by XCV600E-7FG676C?

XCV600E-7FG676C supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 Table 2 and Section "Differential Signalling Support". This rate applies to source-synchronous interfaces using dedicated LVDS I/O pairs; actual achievable throughput depends on PCB layout, termination, and clock stability. The device's DLLs enable precise phase alignment for reliable capture at this rate.

Is XCV600E-7FG676C pin-compatible with other Virtex-E devices in the FG676 package?

Yes, XCV600E-7FG676C shares identical FG676 pinout with XCV400E-7FG676C and XCV800E-7FG676C per DS022-4 Module 4 pinout tables. However, I/O bank assignments and VCCO/VREF pin allocations differ across densities-migration requires verification of bank voltage constraints and unused pin states (e.g., pin J10 is NC in XCV600E but functional in XCV800E).

Does XCV600E-7FG676C support JTAG boundary scan for production testing?

Yes, XCV600E-7FG676C includes full IEEE 1149.1 boundary scan logic with TCK, TMS, TDI, and TDO pins mapped to dedicated FG676 balls. This enables in-system programming, interconnect testing, and post-configuration verification-critical for high-reliability manufacturing. Scan chain integrity is factory-tested per DS022-1 Module 1.

What is the role of the die-temperature sensor diode in XCV600E-7FG676C?

The die-temperature sensor diode in XCV600E-7FG676C provides analog voltage output proportional to junction temperature, accessible via dedicated analog monitoring pins. It enables real-time thermal management in fan-controlled systems or thermal shutdown logic-especially important in high-density telecom applications where ambient temperatures exceed 70 °C.

Can XCV600E-7FG676C implement true dual-port memory without external logic?

Yes, XCV600E-7FG676C's block SelectRAM modules are true dual-port (TDP) 4096-bit RAMs with independent address, data, and control lines per port. Each of the 72 blocks supports concurrent read/write operations at up to 200 MHz, enabling FIFOs, ping-pong buffers, and memory-mapped peripherals without external SRAM or glue logic.