AMD XCV600E-7FG676I

Overview

XCV600E-7FG676I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 985,882 system gates and 15,552 logic cells in a 48 × 72 CLB array. It features eight digital Delay-Locked Loops (DLLs), 294,912 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces - deployed in high-speed communications infrastructure and test equipment.

For engineers reviewing the XCV600E-7FG676I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration modes, and industrial-temperature (-40°C to +100°C) operation requirements.

Technical Context

The XCV600E-7FG676I implements a regular array architecture with Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.

I/O functionality is organized into eight banks, each requiring shared VCCO for output standards and optional VREF for input thresholds. Supported standards include LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, and LVPECL - with differential I/O pairs up to 247 and total user I/O count of 444 in the FG676 package.

Key Specifications

Pinout & Package

Package: Fine Pitch Ball Grid Array (FG676) with 676 balls, 1.0 mm pitch, and industrial temperature rating (–40°C to +100°C). Pinout conforms to DS022-4 Module 4 pin tables; bank assignments and dedicated clock pins (GCLK0–GCLK3) are fixed per physical location.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic applications.

Compared with XCV600E-7FG676I, the -6 variant trades 7% timing margin for lower cost and power, while the XCV800E-7FG676I extends logic capacity by 33% within identical packaging - enabling scalable architecture without PCB redesign.

Availability

XCV600E-7FG676I is available at Aetrix Electronics and suitable for high-reliability industrial motion control, medical imaging data acquisition, and telecom infrastructure requiring stable component supply across extended lifecycle programs.

Supply support for XCV600E-7FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGAs and developed the Virtex family for high-performance reconfigurable computing, delivering silicon-proven architectures for aerospace, defense, and wired infrastructure.

The Virtex-E product line was engineered to replace ASICs in prototyping and low-volume production, emphasizing 1.8 V core efficiency, integrated DLLs, and multi-standard I/O for system-level integration without external clock synthesizers or level shifters.

FAQ

What is the maximum differential I/O pair count supported by XCV600E-7FG676I?

XCV600E-7FG676I supports up to 247 differential I/O pairs in the FG676 package, as confirmed in Table 1 of DS022-1 (v2.3). This count is constrained by physical pin allocation and bank partitioning - not logic resource limits. Each differential pair consumes two adjacent pins within the same I/O bank and requires matched trace lengths in PCB layout.

Does XCV600E-7FG676I support LVPECL clock inputs?

Yes, XCV600E-7FG676I supports LVPECL clock inputs up to 300+ MHz, as specified in the Features section of DS022-1. LVPECL signals must be applied to dedicated global clock pins (GCLK0–GCLK3) with proper AC-coupling and termination to 50 Ω to VCCO – 2 V. The internal DLL converts these directly to any supported I/O standard without external level shifting.

How many block RAM blocks are integrated in XCV600E-7FG676I?

XCV600E-7FG676I integrates 72 block SelectRAM memory blocks totaling 294,912 bits, per Table 4 in DS022-2 (v2.8). Each block is a true dual-port 4096-bit RAM with independent address/control per port, configurable for depths from 16 to 4096 words and widths up to 72 bits - enabling flexible FIFO, cache, or frame buffer implementations.

Is XCV600E-7FG676I pin-compatible with other Virtex-E devices in FG676 packaging?

XCV600E-7FG676I is pin-compatible with XCV400E-7FG676I and XCV800E-7FG676I in the same FG676 package, as stated in DS022-1 Section "Virtex-E Compared to Virtex Devices". However, I/O bank assignments and VREF pin usage differ across densities - requiring updated constraint files and careful review of DS022-4 pinout tables before migration.

What is the industrial temperature range for XCV600E-7FG676I?

XCV600E-7FG676I operates across an industrial temperature range of –40°C to +100°C (junction temperature), indicated by the 'I' suffix in its ordering code. This rating is validated per DS022-3 DC and switching characteristics testing and requires adherence to thermal derating curves above 85°C ambient when mounted on standard 4-layer PCBs with 2 oz copper.