AMD XCV600E-7FG900I

Overview

XCV600E-7FG900I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 985,882 system gates and 15,552 logic cells in a 48 × 72 CLB array. It features eight digital Delay-Locked Loops (DLLs), 72 block RAMs totaling 294,912 bits, and supports LVDS, LVPECL, and PCI-compliant I/O up to 622 Mb/s - deployed in high-speed communications infrastructure and test equipment.

For engineers reviewing the XCV600E-7FG900I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration modes, and speed-grade–specific performance data for synchronous system clock rates up to 240 MHz.

Technical Context

The XCV600E-7FG900I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected via a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset.

I/O functionality is organized into eight banks, each supporting mixed standards only when sharing VCCO (e.g., LVTTL + PCI33_3 at 3.3 V) or VREF (e.g., SSTL3 I & II at 1.5 V). The device uses VCCINT = 1.8 V for core logic and VCCO-supplied I/O buffers - with LVDS/LVPECL inputs accepting 300+ MHz differential clocks and outputs driving up to 24 mA source / 48 mA sink.

Key Specifications

Pinout & Package

Package: Fine Pitch Ball Grid Array (FG900) with 900 balls, 1.0 mm pitch, and thermal-enhanced construction suitable for industrial temperature operation (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV600E-7FG900I, the -6 variant trades 2.3% timing margin for cost reduction, while the XCV800E-7FG900I adds 33% logic capacity and 33% block RAM within identical mechanical and thermal constraints - enabling scalable design reuse without layout revision.

Availability

XCV600E-7FG900I is available at Aetrix Electronics and suitable for high-reliability industrial motion control, optical transport equipment, automated test systems, and PCI-based data acquisition requiring stable component supply across extended product lifecycles.

Supply support for XCV600E-7FG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGAs and developed the Virtex family as high-performance programmable logic solutions for telecommunications, aerospace, and industrial markets.

The Virtex-E product line was engineered to deliver 30% higher speed and 25% lower power than prior Virtex devices using 0.18 μm process technology - targeting applications demanding high I/O bandwidth, embedded memory, and deterministic clock management.

FAQ

What is the maximum differential I/O pair count supported by XCV600E-7FG900I?

XCV600E-7FG900I supports up to 247 differential I/O pairs as specified in Table 1 of DS022-1. This capacity is realized in the FG900 package where physical pin count and bank allocation permit full utilization of LVDS and LVPECL signaling resources without violating VCCO/VREF banking rules.

Does XCV600E-7FG900I support true dual-port block RAM operation?

Yes, XCV600E-7FG900I implements true dual-port block RAM with independent address, data, and control lines on both ports. Each of its 72 block RAMs (4096 bits each) allows simultaneous read and write operations - essential for ping-pong buffering and asynchronous data rate adaptation in communication systems.

How many Delay-Locked Loops (DLLs) does XCV600E-7FG900I include, and what are their key capabilities?

XCV600E-7FG900I integrates eight fully digital DLLs. Each supports clock multiply (up to 4×), divide, duty-cycle correction to 50%, and zero-delay conversion of high-speed LVPECL/LVDS inputs to any I/O standard - enabling robust DDR interface timing and multi-domain clock distribution without external PLLs.

Is XCV600E-7FG900I pin-compatible with other Virtex-E devices in the FG900 package?

XCV600E-7FG900I shares the FG900 package footprint and ball map with XCV400E-7FG900I and XCV800E-7FG900I. However, pin functions differ across densities due to varying CLB counts and I/O bank allocations - requiring design-specific pin assignment validation even when mechanical fit is identical.

What I/O standards are supported by XCV600E-7FG900I for 3.3 V operation?

XCV600E-7FG900I supports LVTTL, PCI33_3, PCI66_3, SSTL3 I/II, CTT, AGP-2X, and LVPECL at 3.3 V VCCO per I/O bank. These standards share the same VCCO supply rail and are mutually compatible within a bank - enabling mixed-signal interface consolidation on a single FPGA.