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AMD XCV600E-7HQ240C
- Part No.:
- XCV600E-7HQ240C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 240-BFQFP Exposed Pad
- Datasheet:
-
XCV600E-7HQ240C.pdf
- Description:
- IC FPGA 158 I/O 240QFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,414
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Product details
Overview
XCV600E-7HQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 985,882 system gates and 15,552 logic cells in a 48 × 72 CLB array. It delivers 130 MHz internal performance (four LUT levels), supports PCI 3.3 V/33–66 MHz compliance, and operates within 0°C to +85°C commercial temperature range. It is used in high-speed communication interface design requiring flexible I/O and embedded memory.
For engineers reviewing the XCV600E-7HQ240C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL timing behavior, SelectRAM+ memory configuration, and package-specific routing limitations - all confirmed for the HQ240 package and -7 speed grade.
Technical Context
The XCV600E-7HQ240C implements a regular FPGA architecture with configurable logic blocks (CLBs), input/output blocks (IOBs), eight fully digital Delay-Locked Loops (DLLs), and block SelectRAM columns placed every 12 CLB columns. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for wide-input functions, and dual-port synchronous RAM capability per block.
I/O functionality is organized into eight banks, each supporting mixed standards only when sharing the same VCCO voltage (e.g., LVTTL and PCI33_3 at 3.3 V); VREF-dependent inputs (e.g., SSTL3, HSTL) require shared threshold voltage per bank. The device uses 0.18 μm 6-layer metal CMOS process, with 1.8 V VCCINT and 3.3 V/2.5 V/1.8 V I/O supply flexibility.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 985,882 - defines total logic capacity for gate-equivalent synthesis targeting ASIC replacement |
| Logic Cells | 15,552 - base unit for place-and-route resource allocation and timing closure estimation |
| CLB Array | 48 × 72 - determines maximum routable logic density and floorplanning granularity |
| User I/O Pins | 158 - confirmed maximum for HQ240 package; constrained by I/O banking and VCCO/VREF pin allocation |
| Block RAM Bits | 294,912 - organized as 72 × 4096-bit true dual-port blocks for independent read/write addressing |
| DLL Count | 8 - enables zero-delay clock distribution, DDR duty-cycle correction, and frequency multiplication up to 4× |
| Speed Grade | -7 - specifies worst-case timing parameters including 4.3 ns register-to-register delay (TREG) |
| Operating Temperature | 0°C to +85°C - commercial-grade thermal envelope validated for board-level reliability without derating |
Pinout & Package
Package: HQ240 - High Heat Dissipation plastic quad flat pack with 240 leads, 0.5 mm pitch, and exposed thermal pad. Designed for convection-cooled industrial and telecom applications requiring thermal stability under sustained logic activity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Inputs | Dedicated low-skew clock inputs routed to all DLLs; require LVPECL/LVDS-compatible termination for >300 MHz operation |
| VCCINT | Core Logic Supply | 1.8 V ±3% supply for CLBs, RAM, and routing; decoupling required within 10 mm of each pin |
| VCCO_0–VCCO_7 | I/O Bank Power | Bank-specific VCCO pins (e.g., VCCO_0 for Bank 0) set output drive voltage and input buffer reference |
| VREF_0–VREF_7 | I/O Threshold Reference | Bank-specific analog reference for SSTL/HSTL inputs; must be externally sourced and stable to ±1% |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test interface; supports in-system configuration and post-silicon validation |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards (LVTTL, LVCMOS2/18, SSTL3/2, HSTL I/III/IV, LVDS, BLVDS, LVPECL) with per-bank VCCO/VREF control |
| SelectRAM+™ Memory | 294,912 bits of true dual-port block RAM + 221,184 bits distributed RAM; enables pipelined memory access at 200 MHz |
| SelectLink™ DDR Interface | Hardened DDR link logic between Virtex-E devices; eliminates external serializer/deserializer for inter-FPGA data transfer |
| Digital DLLs | Eight DLLs provide jitter-free clock deskew, 50% duty cycle correction for DDR, and 2×–4× frequency multiplication without external PLL |
| Arithmetic Optimization | Dedicated carry chains and AND/XOR gates per slice accelerate adder and multiplier implementation with predictable timing |
| Thermal Monitoring | Integrated die-temperature sensor diode enables real-time thermal throttling in high-density designs |
Applications
| High-Speed Serial Interface | PCI Express Endpoint |
|---|---|
Use Scenario: Implementing source-synchronous SerDes links for backplane interconnect using LVDS or LVPECL I/O standards. IC Role / Device Role / Timing Role: FPGA acts as protocol-agnostic physical layer transceiver with DLL-synchronized sampling and DDR-aligned transmit paths. Use Value: Achieves 622 Mb/s per differential pair without external clock recovery ICs, reducing BOM count and board area. |
Use Scenario: Building a PCIe 1.0 endpoint controller for add-in cards in industrial servers with legacy PCI compatibility. IC Role / Device Role / Timing Role: Configurable logic handles TLP encoding/decoding, DMA arbitration, and BAR address mapping while maintaining strict PCI timing. Use Value: Leverages 3.3 V PCI-compliant I/O and 130 MHz internal timing to meet 66 MHz PCI bus setup/hold requirements. |
| Memory Controller Hub | DSP Acceleration Engine |
Use Scenario: Managing burst-mode access to ZBT SRAM and DDR SDRAM in radar signal processing subsystems. IC Role / Device Role / Timing Role: FPGA serves as memory controller with programmable latency compensation, bank interleaving, and ECC generation. Use Value: Uses 200 MHz ZBT SRAM interface and true dual-port block RAM to sustain >1.66 Tb/s aggregate memory bandwidth. |
Use Scenario: Offloading FFT, FIR filtering, and beamforming computations from host CPU in wireless baseband units. IC Role / Device Role / Timing Role: Configurable arithmetic pipeline with dedicated carry chains and block RAM buffers executes 16-bit fixed-point operations at 133+ MHz. Use Value: Delivers deterministic latency and parallelism unattainable with general-purpose processors, enabling real-time RF channel processing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV600E-6HQ240C | Slower -6 speed grade: 4.6 ns TREG vs. 4.3 ns; lower maximum system clock (220 MHz vs. 240 MHz) | Suitable for cost-sensitive designs where timing margin exceeds 0.3 ns; not recommended for 622 Mb/s LVDS interfaces | Select when design meets timing with margin and thermal/power budget favors lower-speed bin |
| XCV600E-7FG256C | Different package: 256-pin fine-pitch BGA (FG256) with 176 user I/O; no thermal pad; higher pin density but reduced thermal dissipation | Better suited for space-constrained PCBs where heat spreaders are impractical; requires tighter layout tolerances for signal integrity | Choose for compact form factor applications where thermal load is <2 W and routing congestion dominates I/O count |
Compared with XCV600E-6HQ240C and XCV600E-7FG256C, the XCV600E-7HQ240C uniquely balances thermal robustness (via HQ240 thermal pad), timing headroom (-7 grade), and I/O count (158 pins) - making it optimal for sustained high-speed I/O operation in commercial-temperature telecom infrastructure.
Availability
XCV600E-7HQ240C is available at Aetrix Electronics and suitable for high-speed serial interface design, PCI-compliant peripheral development, memory controller implementation, DSP acceleration, and radar signal processing requiring stable component supply across extended production cycles.
Supply support for XCV600E-7HQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.
The Virtex-E family was designed for high-speed, high-density applications demanding advanced I/O flexibility, embedded memory, and deterministic timing - targeting communications infrastructure, military/aerospace systems, and high-end test equipment.
FAQ
What is the maximum differential I/O pair count supported by XCV600E-7HQ240C?
The XCV600E-7HQ240C supports up to 247 differential I/O pairs, as specified in Table 1 of DS022-1. However, the HQ240 package physically limits usable I/O to 158 single-ended pins, meaning the practical differential pair count is constrained by pin availability and I/O banking rules - typically ≤79 pairs depending on VCCO/VREF allocation per bank.
Does XCV600E-7HQ240C support 5 V tolerant I/O?
No, the XCV600E-7HQ240C does not support native 5 V tolerant I/O. Its I/O pins are 3 V tolerant, and can be made 5 V tolerant only with an external 100 Ω series resistor per pin, as documented in the Virtex-E data sheet. PCI 5 V signaling is explicitly unsupported.
How many DLLs are available in XCV600E-7HQ240C and what are their key functions?
The XCV600E-7HQ240C contains eight fully digital Delay-Locked Loops (DLLs). These provide zero-delay clock conversion from high-speed LVPECL/LVDS inputs, 50% duty cycle correction for DDR applications, clock multiplication (up to 4×), and skew compensation across global clock networks - all without external components.
Is XCV600E-7HQ240C pin-compatible with earlier Virtex family devices?
The XCV600E-7HQ240C is not bitstream-compatible with Virtex family devices, but the same device in the same HQ240 package is pin-compatible with Virtex devices with minor exceptions - specifically, pin J10 is "No Connect" and pin J30 is "VREF option only" in XCV600E, per Module 4 pinout tables.
What memory resources are integrated into XCV600E-7HQ240C?
The XCV600E-7HQ240C integrates 294,912 bits of synchronous block RAM (72 × 4096-bit true dual-port blocks) and 221,184 bits of distributed RAM implemented in LUTs. This enables concurrent read/write operations, bus-width conversion, and high-bandwidth memory access up to 200 MHz for ZBT SRAM and DDR SDRAM interfacing.
XCV600E-7HQ240C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 240-BFQFP Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3456
- Number of Logic Elements/Cells:
- 15552
- Total RAM Bits:
- 294912
- Number of I/O:
- 158
- Number of Gates:
- 985882
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 240-PQFP (32x32)
XCV600E-7HQ240C FAQ
1.How can I place an order for XCV600E-7HQ240C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV600E-7HQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV600E-7HQ240C reliable?
The price and inventory of XCV600E-7HQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV600E-7HQ240C is usually 5 days.
3.What payment methods are accepted for XCV600E-7HQ240C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV600E-7HQ240C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV600E-7HQ240C?
XCV600E-7HQ240C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV600E-7HQ240C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV600E-7HQ240C?
For technical support, including XCV600E-7HQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV600E-7HQ240C requirements.
6.How does Aetrix verify that XCV600E-7HQ240C is sourced from the original manufacturer or authorized distributors?
All XCV600E-7HQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV600E-7HQ240C meets industry standards.
7.What is the process for return or replacement of XCV600E-7HQ240C?
All XCV600E-7HQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV600E-7HQ240C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV600E-7HQ240C part is unused and in its original packaging.
Return procedure for XCV600E-7HQ240C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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