AMD XCV600E-7HQ240I

Overview

XCV600E-7HQ240I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 985,882 system gates, 15,552 logic cells, and 512 user I/O pins in a 240-pin High Heat Dissipation (HQ) BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 294,912 bits of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 33/66 MHz interfaces for high-speed communications infrastructure and test equipment.

For engineers reviewing the XCV600E-7HQ240I datasheet, pinout, applications, or equivalent options, this device delivers verified 130 MHz internal performance (four LUT levels), 240 MHz synchronous system clock capability, and 3.3 V PCI-compliant I/O - critical for FPGA-based protocol bridging, real-time signal processing, and reconfigurable computing platforms requiring industrial temperature operation (–40°C to +100°C).

Technical Context

The XCV600E-7HQ240I implements a flexible CLB architecture with four logic cells per configurable logic block, each containing 4-input LUTs, dedicated carry chains, and dual flip-flops with independent clock enable and synchronous/asynchronous set/reset. Its eight DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and 4× frequency multiplication - enabling precise timing control across multiple voltage domains.

I/O functionality is organized into eight banks with bank-specific VCCO and VREF supply requirements; supported standards include LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, and LVPECL. Input buffers for LVTTL/LVCMOS2/PCI are powered by VCCO (not VCCINT), and differential I/O pairs support up to 344 pairs with aggregate bandwidth >100 Gb/s.

Key Specifications

Pinout & Package

The XCV600E-7HQ240I is housed in a 240-pin High Heat Dissipation (HQ) Ball Grid Array package with 1.27 mm pitch, designed for thermal efficiency in high-density PCB layouts. Pin assignments follow Xilinx's standardized Virtex-E pinout convention with dedicated global clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM_B, DONE), JTAG boundary-scan interface (TCK/TMS/TDI/TDO), and eight I/O banks (Bank 0–7) each with independent VCCO and VREF supply connections.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV600E-7HQ240I, the –8 speed grade offers improved timing closure at higher frequencies but no change in I/O count or memory size, while the XCV800E-7HQ240I retains identical packaging and thermal profile but doubles logic capacity - making it suitable for scalable platform designs where footprint compatibility is mandatory.

Availability

XCV600E-7HQ240I is available at Aetrix Electronics and suitable for high-reliability industrial motion control, telecom infrastructure, automated test equipment, and real-time signal processing applications requiring stable component supply across extended product lifecycles.

Supply support for XCV600E-7HQ240I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, adaptive SoC, and ACAP solutions since 1984 for aerospace, defense, communications, and industrial markets.

The Virtex-E family was engineered for high-performance, low-power reconfigurable computing - targeting applications demanding >200 MHz system clocks, mixed-voltage I/O, and integrated memory subsystems without external controllers.

FAQ

What is the core supply voltage requirement for the XCV600E-7HQ240I?

The XCV600E-7HQ240I requires a regulated 1.8 V ±3% supply on VCCINT for its internal logic, CLBs, block RAM, and DLL circuits. This lower voltage versus prior Virtex families reduces dynamic power consumption while maintaining performance. Decoupling capacitors must be placed per Xilinx DS022-3 recommendations to ensure stable operation under switching loads.

Does the XCV600E-7HQ240I support PCI 66 MHz operation?

Yes, the XCV600E-7HQ240I is fully compliant with 3.3 V PCI specifications for both 33 MHz and 66 MHz operation. Its I/O buffers meet PCI electrical requirements including output drive strength, slew rate control, and input threshold levels. No external termination resistors are needed for standard PCI bus implementations.

How many differential I/O pairs does the XCV600E-7HQ240I support?

The XCV600E-7HQ240I supports up to 344 differential I/O pairs, enabled through its SelectI/O+™ technology. These pairs can be configured for LVDS, BLVDS, or LVPECL signaling, delivering aggregate bandwidth exceeding 100 Gb/s. Each pair consumes two adjacent pins within the same I/O bank and requires matched trace lengths for signal integrity.

Can the XCV600E-7HQ240I be configured via JTAG only?

Yes, the XCV600E-7HQ240I supports IEEE 1149.1 JTAG boundary-scan configuration in addition to master serial (SPROM), slave serial, and SelectMAP™ modes. JTAG enables in-system programming, debugging, and verification without requiring external configuration PROMs - ideal for development and field updates.

What is the maximum block RAM capacity of the XCV600E-7HQ240I?

The XCV600E-7HQ240I contains 72 block RAM modules totaling 294,912 bits of true dual-port synchronous memory. Each block is 4096 bits with independently configurable port widths (1–36 bits), supporting simultaneous read/write operations essential for FIFOs, frame buffers, and coefficient tables in signal processing pipelines.