AMD XCV600E-8FG676C

Overview

XCV600E-8FG676C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 985,882 system gates, 15,552 logic cells, and 72 block RAMs (294,912 bits), designed for high-speed digital signal processing, communications infrastructure, and embedded reconfigurable computing applications requiring >240 MHz synchronous operation and LVDS/LVPECL I/O interfaces.

For engineers reviewing the XCV600E-8FG676C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing parameters, block RAM configuration modes, and package-specific thermal and routing characteristics essential for PCB layout, power integrity planning, and high-speed interface validation.

Technical Context

The XCV600E-8FG676C implements a regular array of Configurable Logic Blocks (CLBs) with dual-slice architecture, each containing four 4-input LUTs, dedicated carry chains, and edge-triggered flip-flops with independent clock enable and synchronous/asynchronous set/reset. It integrates eight fully digital Delay-Locked Loops (DLLs) supporting 50% duty cycle generation, clock multiplication up to 4×, and zero-delay conversion of LVPECL/LVDS inputs to any I/O standard.

I/O functionality is organized into eight banks with per-bank VCCO and VREF supply domains; each bank supports mixed standards only if sharing identical VCCO (e.g., 3.3 V PCI/LVTTL/SSTL3), and input standards requiring VREF (e.g., SSTL2, HSTL) must use a single shared VREF voltage per bank. The FG676 package provides 444 user I/O pins across these banks.

Key Specifications

Pinout & Package

Package: Fine Pitch Ball Grid Array (FG676), 27 × 27 mm, 1.0 mm pitch, RoHS-compliant, thermally enhanced with exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV600E-8FG676C, the -7 variant trades 8% timing margin for lower cost and power, while the XCV800E-8FG676C adds 32% logic capacity and 33% RAM within identical footprint - both require no PCB changes but demand revalidation of timing closure and thermal dissipation.

Availability

XCV600E-8FG676C is available at Aetrix Electronics and suitable for wireless infrastructure, high-speed test instrumentation, medical imaging systems, and industrial control applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for XCV600E-8FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered FPGA architecture and EDA toolchains for high-performance digital design.

The Virtex-E family was engineered for high-speed reconfigurable computing in communications and signal processing, emphasizing I/O flexibility, clock management, and memory hierarchy to replace ASICs in evolving protocols.

FAQ

What is the maximum operating temperature range for the XCV600E-8FG676C?

The XCV600E-8FG676C is rated for commercial temperature range: junction temperature (Tj) from 0 °C to +85 °C. This specification is defined in the ordering code suffix 'C' and confirmed in DS022-1 v2.3 Section 4. The device must be thermally managed to stay within this range during sustained operation, especially under full I/O loading and 1.8 V core supply conditions.

Does the XCV600E-8FG676C support LVDS input and output simultaneously on the same I/O bank?

Yes, the XCV600E-8FG676C supports LVDS input and output simultaneously on the same I/O bank, provided the bank's VCCO is set to 2.5 V and no conflicting standards requiring different VREF voltages are used. LVDS does not require VREF, so it can coexist with other 2.5 V standards like SSTL2 or LVCMOS2 in the same bank per DS022-2 Table 2.

How many dedicated global clock pins does the XCV600E-8FG676C have?

The XCV600E-8FG676C has eight dedicated global clock input pins: GCLK0 through GCLK7. These pins connect directly to the eight DLLs and are routed with minimal skew across the die. Their locations are fixed in the FG676 pinout (Module 4 of DS022-4), and each must be terminated per LVPECL or LVDS specifications depending on the input standard used.

Can the XCV600E-8FG676C be configured via JTAG after power-up?

Yes, the XCV600E-8FG676C supports IEEE 1149.1 JTAG boundary-scan configuration in slave serial mode. Configuration data can be loaded through TDI/TDO after power-up and initialization, enabling in-system programming and debug. This capability is documented in DS022-1 Section "Configuration Modes" and requires proper TCK/TMS/TE pin handling per JTAG timing requirements.

What is the total block RAM capacity of the XCV600E-8FG676C in kilobytes?

The XCV600E-8FG676C contains 72 block RAMs, each 4096 bits, totaling 294,912 bits - equivalent to 36.0 kB. This value is explicitly listed in Table 4 of DS022-2 (v2.8) and corresponds to 9 kB per quadrant in the device's physical RAM column layout (Table 3). All 72 blocks are user-accessible and support true dual-port operation.