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AMD XCV800-4BG432C
- Part No.:
- XCV800-4BG432C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 432-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV800-4BG432C.pdf
- Description:
- IC FPGA 316 I/O 432MBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,127
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Product details
Overview
XCV800-4BG432C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 888,439 system gates, 21,168 logic cells in a 56×84 CLB array, and 316 user I/O pins in a 432-ball BGA package. It integrates four delay-locked loops (DLLs), 4 primary global clock nets, and 28 × 4,096-bit dual-ported block RAMs. It targets high-speed digital signal processing, PCI-66 MHz interface design, and reconfigurable embedded control systems.
For engineers reviewing the XCV800-4BG432C datasheet, pinout, applications, or equivalent options, key selection criteria include its 200 MHz system performance ceiling, hot-swappable Compact PCI compliance, SelectIO™ support for 16 interface standards, and die-temperature sensor diode for thermal monitoring in dense PCB layouts.
Technical Context
The XCV800-4BG432C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing-enabling efficient place-and-route for large synchronous designs. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5–19-input functions, and LUTs configurable as 16-bit RAM, 32-bit RAM, or 16-bit shift registers.
Each IOB supports independent input/output flip-flops with programmable polarity, synchronous/asynchronous set/reset, and optional weak-keeper circuits. I/O banking enforces voltage domain separation: eight banks require shared VCCO per bank (3.3 V, 2.5 V, or 1.5 V), and VREF-dependent standards (e.g., HSTL, SSTL) must be grouped within the same bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 888,439 - defines maximum combinational logic capacity for ASIC replacement or complex state-machine implementation |
| Logic Cells | 21,168 - provides granular, register-rich resources for pipelined datapaths and control logic |
| User I/O Pins | 316 - enables high-pin-count interfaces such as DDR memory buses or multi-lane serial protocols |
| Block RAM Bits | 114,688 - delivers 28 × 4,096-bit synchronous dual-ported RAM blocks for FIFOs, buffers, or lookup tables |
| Max System Clock | 200 MHz - supports synchronous timing closure for high-throughput data acquisition or real-time control loops |
| PCI Compliance | 66-MHz PCI Compliant - allows direct integration into industrial PC/CompactPCI backplanes without glue logic |
| Process Technology | 0.22 μm 5-layer metal CMOS - ensures predictable timing, low static power, and full factory test coverage |
Pinout & Package
Package: 432-ball Fine-Pitch Ball Grid Array (BG432), RoHS-compliant, commercial temperature range (0°C to +85°C). Pinout conforms to Xilinx DS003-4 (v4.0) Module 4, with dedicated configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), four global clock inputs (GCLK0–GCLK3), and eight I/O banks (Bank 0–7) each requiring isolated VCCO and optional VREF.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Connects directly to DLL inputs; feeds four low-skew clock distribution networks across the device |
| INIT, PROGRAM, CCLK, DIN, DONE | Configuration Interface | Supports master serial PROM boot mode; CCLK drives internal configuration shift register at up to 20 MHz |
| VCCINT | Core Supply | 2.5 V ± 3% supply for CLBs and routing; decoupling required per Xilinx layout guidelines |
| VCCO_0–VCCO_7 | I/O Bank Supply | Independent 3.3 V / 2.5 V / 1.5 V supplies per bank; determines output drive strength and compatible I/O standards |
| VREF_0–VREF_7 | I/O Threshold Reference | Required only for VREF-dependent inputs (HSTL, SSTL); must be stable and noise-filtered per bank |
| TCK, TMS, TDI, TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port; enables in-system programming and verification |
Key Features
| Feature | Design Value |
|---|---|
| Dual-ported Block RAM | 28 × 4,096-bit RAMs with independent read/write clocks and widths-enables simultaneous data ingestion and processing in streaming applications |
| SelectIO™ Interface | Support for 16 I/O standards including LVTTL, LVCMOS2, HSTL Class IV, and SSTL3-eliminates level-shifter ICs in mixed-voltage systems |
| Delay-Locked Loops (DLLs) | Four dedicated DLLs with zero-hold-time input paths-enables precise clock deskew and phase alignment for source-synchronous interfaces |
| Carry Chain Arithmetic | Dedicated fast-carry logic per CLB slice-reduces propagation delay in adders, counters, and accumulators by >40% vs. LUT-based carry |
| Configurable LUT RAM | Each 4-input LUT usable as 16×1-bit synchronous RAM or 16-bit shift register-provides distributed storage for pipeline stages or pattern matching |
Applications
| High-Speed Data Acquisition | CompactPCI Hot-Swappable Module |
|---|---|
Use Scenario: Real-time digitization of analog sensor signals at 100+ MSPS with on-FPGA filtering and buffering before PCIe transfer. IC Role / Device Role / Timing Role: Configurable logic fabric processes samples in parallel; block RAM stores transient waveforms; DLLs synchronize ADC capture clocks. Use Value: Eliminates external FIFO and timing controller ICs; reduces latency by 3.2 ns vs. discrete logic solutions. | Use Scenario: Industrial control module that must be inserted/removed from live CompactPCI backplane without system reset. IC Role / Device Role / Timing Role: FPGA implements hot-swap controller state machine, monitors bus presence detect (PRSNT#), and manages power sequencing. Use Value: Meets PICMG 2.1 hot-swap specification; avoids 500 ms system downtime during field maintenance. |
| PCI-66 MHz Bridge Interface | Reconfigurable Protocol Converter |
Use Scenario: Bridging legacy ISA peripherals to modern PCI bus in medical imaging equipment. IC Role / Device Role / Timing Role: Implements PCI target interface with 66 MHz timing compliance; handles address decoding, burst transfers, and parity generation. Use Value: Achieves 264 MB/s peak throughput; replaces ASIC with field-upgradable logic for regulatory recertification. | Use Scenario: Converting proprietary sensor bus protocol to SPI/I²C for microcontroller host in aerospace telemetry unit. IC Role / Device Role / Timing Role: FPGA parses variable-length command frames, performs CRC validation, and maps payload to standard serial interface timing. Use Value: Supports firmware updates via JTAG to adapt to new sensor revisions-no hardware change required. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV800-6BG432C | Faster speed grade (-6 vs. -4); 15% higher max clock frequency (230 MHz vs. 200 MHz) due to tighter timing margins | Better suited for designs requiring worst-case 180+ MHz register-to-register paths or tighter setup/hold windows | Select XCV800-6BG432C when timing closure fails at -4 grade; same pinout and configuration interface |
| XCV1000-4BG432C | Higher density (1.12M gates vs. 888k); adds 4 more block RAMs (32 vs. 28) and 6,480 additional logic cells | Enables larger state machines or multi-channel processing; requires revised floorplan but identical BG432 footprint | Choose XCV1000-4BG432C for scalability path where future feature expansion is anticipated |
Compared with XCV800-4BG432C, the -6 speed grade offers higher timing margin for aggressive clocking, while XCV1000-4BG432C provides headroom for logic growth-both retain identical I/O count, package, and configuration architecture, enabling incremental upgrades without PCB redesign.
Availability
XCV800-4BG432C is available at Aetrix Electronics and suitable for high-reliability industrial control, medical imaging subsystems, and legacy PCI infrastructure requiring stable component supply through extended lifecycle management.
Supply support for XCV800-4BG432C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures used in aerospace, telecom, and high-performance computing.
The Virtex family was engineered for high-speed, high-density reconfigurable logic applications demanding both computational throughput and I/O flexibility-targeting systems where ASIC development cost or time-to-market constraints prohibit custom silicon.
FAQ
What is the maximum operating frequency supported by XCV800-4BG432C?
XCV800-4BG432C supports synchronous system clock rates up to 200 MHz, including I/O timing, as verified under worst-case conditions in DS003-1 (v4.0). This applies to register-to-register paths and I/O interfaces compliant with PCI-66 MHz and HSTL Class IV standards. Actual achievable frequency depends on design placement, routing, and clock domain structure.
Does XCV800-4BG432C support hot-swap functionality for CompactPCI systems?
Yes, XCV800-4BG432C is explicitly designed for hot-swappable CompactPCI applications. Its I/O architecture meets PICMG 2.1 requirements, and its configuration logic supports safe insertion/removal while the backplane remains powered. The device includes dedicated PRSNT# detection and power-rail sequencing control logic in its IOBs.
How many block RAMs does XCV800-4BG432C integrate, and what are their configurations?
XCV800-4BG432C integrates 28 block SelectRAM units, each providing 4,096 bits of synchronous dual-ported memory. Each block supports independent read/write port widths (1–16 bits) and depths (256–4096), enabling flexible FIFO, buffer, or lookup table implementations without consuming CLB resources.
What I/O standards are supported by XCV800-4BG432C's SelectIO™ interface?
XCV800-4BG432C supports 16 I/O standards via SelectIO™, including LVTTL (5 V tolerant), LVCMOS2, PCI-3.3 V, HSTL Class I/III/IV, SSTL3/SSTL2 Classes I & II, GTL/GTL+, and CTT. Voltage domain separation is enforced per I/O bank, requiring shared VCCO and optional VREF within each bank.
Is XCV800-4BG432C still in active production, and what is its lifecycle status?
XCV800-4BG432C is marked as obsolete/under obsolescence per Xilinx DS003-1 (v4.0) dated March 2013. It is no longer manufactured, but Aetrix Electronics maintains legacy inventory with full traceability and offers lifecycle coordination support-including last-time buy planning and migration path analysis to newer Xilinx or AMD FPGA families.
XCV800-4BG432C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 432-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4704
- Number of Logic Elements/Cells:
- 21168
- Total RAM Bits:
- 114688
- Number of I/O:
- 316
- Number of Gates:
- 888439
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 432-MBGA (40x40)
XCV800-4BG432C FAQ
1.How can I place an order for XCV800-4BG432C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV800-4BG432C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV800-4BG432C reliable?
The price and inventory of XCV800-4BG432C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV800-4BG432C is usually 5 days.
3.What payment methods are accepted for XCV800-4BG432C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV800-4BG432C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV800-4BG432C?
XCV800-4BG432C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV800-4BG432C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV800-4BG432C?
For technical support, including XCV800-4BG432C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV800-4BG432C requirements.
6.How does Aetrix verify that XCV800-4BG432C is sourced from the original manufacturer or authorized distributors?
All XCV800-4BG432C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV800-4BG432C meets industry standards.
7.What is the process for return or replacement of XCV800-4BG432C?
All XCV800-4BG432C units undergo pre-shipment inspection (PSI). If there is an issue with XCV800-4BG432C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV800-4BG432C part is unused and in its original packaging.
Return procedure for XCV800-4BG432C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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