AMD XCV800-4BG432I
- Part No.:
- XCV800-4BG432I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 432-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV800-4BG432I.pdf
- Description:
- IC FPGA 316 I/O 432MBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCV800-4BG432I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 888,439 system gates, 21,168 logic cells in a 56×84 CLB array, and 316 user I/O pins in a 432-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (114,688 bits of block RAM + distributed LUT RAM), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.
For engineers reviewing the XCV800-4BG432I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and SelectIO™ standard compatibility for high-speed interface design and legacy Virtex migration planning.
Technical Context
The XCV800-4BG432I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock networks. Its CLBs contain dual-slice logic with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift register - each slice supporting independent synchronous/asynchronous set/reset and clock enable.
I/O functionality is organized into eight banks, each requiring shared VCCO and single VREF voltage; supported standards include LVTTL (5 V tolerant), HSTL Class IV (200 MHz), SSTL3, and GTL+, with per-pin programmable drive strength (up to 24 mA source / 48 mA sink) and slew rate control. Configuration occurs via master serial, slave serial, SelectMAP™, or JTAG modes using external PROM or host controller.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 888,439 - defines total combinational logic capacity for gate-equivalent synthesis targeting. |
| Logic Cells | 21,168 - actual count of configurable logic cells (CLBs × 4.5 LC/CLB), used for place-and-route resource estimation. |
| User I/O Pins | 316 - maximum available bidirectional user I/O in BG432 package, constrained by I/O banking rules. |
| Block RAM | 114,688 bits - 28 × 4,096-bit synchronous dual-ported RAM blocks, enabling on-chip FIFOs and data buffering. |
| Speed Grade | -4 - worst-case 200 MHz system performance with 66-MHz PCI compliance and sub-6 ns register-to-register delays. |
| Configuration Mode | SRAM-based with four modes (master/slave serial, SelectMAP™, JTAG) - enables in-system reprogramming without power cycle. |
| Operating Temperature | –40°C to +100°C (Industrial) - validated thermal range for embedded industrial and telecom infrastructure use. |
Pinout & Package
Package: 432-ball Fine-Pitch Ball Grid Array (BG432), 35 mm × 35 mm, 1.27 mm pitch, RoHS-compliant. Pinout follows Xilinx DS003-4 (v4.0) Module 4, with dedicated clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, CCLK, DIN, DOUT, DONE), JTAG boundary scan (TCK/TMS/TDI/TDO), and eight I/O banks (Bank 0–7) arranged per device edge.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Four dedicated low-skew clock inputs feeding primary global clock distribution networks. |
| INIT, PROGRAM, CCLK, DIN, DOUT, DONE | Configuration Interface | Control and data signals for master serial configuration; DONE indicates successful bitstream load completion. |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port for programming, debugging, and interconnect verification. |
| VCCINT, VCCO_Bank0–7, VREF_Bank0–7 | Power & Reference | VCCINT = 2.5 V core supply; VCCO per bank sets output voltage level; VREF per bank sets input threshold for compatible standards. |
| IO_LxxN/IO_LxxP | Configurable I/O | Differential-capable pins grouped by bank; support LVTTL, HSTL, SSTL, GTL+ with per-pin drive/slew control. |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DLLs | Four delay-locked loops provide zero-hold-time input capture and precise clock deskew across large designs. |
| Hierarchical Memory | Combines 114,688-bit block RAM with distributed LUT RAM (16-/32-bit, dual-port, shift register modes) for flexible on-die data storage. |
| SelectIO™ Interface | 16 supported standards including HSTL Class IV (200 MHz) and 5 V-tolerant LVTTL - enables direct interfacing to DDR SDRAM, ZBTRAM, and PCI peripherals. |
| Arithmetic Optimization | Dedicated carry chains (2-bit height per slice) and hard-wired XOR/AND logic accelerate adders and multipliers without LUT consumption. |
| I/O Banking | Eight independent banks with isolated VCCO/VREF domains allow mixed-voltage interfaces (e.g., 3.3 V LVTTL + 1.5 V HSTL) on same device. |
Applications
| Telecom Line Card | Industrial Motion Controller |
|---|---|
|
Use Scenario: High-density protocol bridging between TDM backplane and packet-switched Ethernet interfaces in carrier-grade access equipment. IC Role / Device Role / Timing Role: FPGA fabric implements HDLC framing, CRC generation, and time-division multiplexing logic; DLLs synchronize 8 kHz TDM clocks with 125 MHz Ethernet timing. Use Value: 316 I/O pins support full E1/T1 interface counts plus management bus; 114,688-bit block RAM buffers bursty traffic across clock domains. |
Use Scenario: Real-time closed-loop servo control with multi-axis position interpolation and fieldbus (PROFIBUS-DP) gateway functions. IC Role / Device Role / Timing Role: Configurable logic executes PID algorithms at 200 kHz loop rate; global clocks distribute deterministic timing to ADC/DAC interfaces and encoder inputs. Use Value: -4 speed grade ensures sub-6 ns register-to-register paths for jitter-free motion profiling; I/O banking isolates 24 V digital I/O from 3.3 V fieldbus signaling. |
| Legacy Test Equipment Upgrade | Avionics Data Concentrator |
|
Use Scenario: Retrofitting aging ATE platforms with high-speed digital pattern generation and response analysis capability. IC Role / Device Role / Timing Role: FPGA implements vector memory, pattern sequencer, and high-speed LVDS capture logic; DLLs align 100+ MHz stimulus clocks with sampling edges. Use Value: 21,168 logic cells accommodate complex state machines and deep pattern buffers; 66-MHz PCI compliance enables plug-in card integration into existing PXI chassis. |
Use Scenario: ARINC 429/664 (AFDX) data aggregation unit in regional aircraft flight control systems. IC Role / Device Role / Timing Role: FPGA performs protocol translation, message filtering, and time-triggered scheduling; die-temperature sensor diode monitors thermal margin during extended mission profiles. Use Value: Industrial temperature rating (–40°C to +100°C) meets DO-160E environmental requirements; IEEE 1149.1 boundary scan supports in-flight diagnostics and repair verification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV800-6BG432I | Faster -6 speed grade (200 MHz max vs. -4's 200 MHz typical); tighter timing margins but higher static power. | Better suited for designs requiring worst-case 200 MHz register-to-register paths or sub-5 ns critical paths. | Select XCV800-6BG432I only if timing closure fails with -4 grade under worst-case voltage/temperature corners. |
| XCV1000-4BG432I | Higher density (1.12M gates, 27,648 logic cells), same BG432 package and I/O count; larger block RAM (131,072 bits). | Enables scaling of same PCB layout to support increased feature count or future firmware expansion. | Choose XCV1000-4BG432I when design requires >21K logic cells or >114K block RAM while retaining mechanical and thermal footprint. |
Compared with XCV800-4BG432I, the -6 variant offers guaranteed higher-speed timing at cost of increased power and reduced noise margin, while the XCV1000-4BG432I provides headroom for logic growth without changing board layout - both require identical PCB land patterns but distinct bitstream compilation.
Availability
XCV800-4BG432I is available at Aetrix Electronics and suitable for telecom line cards, industrial motion controllers, legacy ATE upgrades, avionics data concentrators, and Compact PCI hot-swap systems requiring stable component supply across extended product lifecycles.
Supply support for XCV800-4BG432I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered SRAM-based FPGA architectures and established industry standards for reconfigurable computing.
The Virtex family was designed for high-performance, high-capacity logic implementation in wired infrastructure, industrial automation, and aerospace systems - emphasizing place-and-route efficiency, clock management, and multi-standard I/O flexibility.
FAQ
What is the maximum operating frequency of the XCV800-4BG432I?
The XCV800-4BG432I has a -4 speed grade specifying worst-case synchronous system clock rates up to 200 MHz, including I/O timing. This is validated for register-to-register paths and 66-MHz PCI-compliant interfaces. Actual achievable frequency depends on design complexity, placement, and routing; Table 2 in DS003-1 shows representative circuit delays ranging from 4.1 ns (parity tree) to 7.2 ns (adder) under worst-case conditions.
Does the XCV800-4BG432I support hot-swap operation in Compact PCI systems?
Yes, the XCV800-4BG432I is explicitly designed for hot-swappable Compact PCI applications. Its I/O structure, power sequencing behavior, and configuration architecture meet the electrical and timing requirements for insertion/removal while the backplane remains powered. This capability is documented in the "Features" section of DS003-1 (v4.0) and confirmed in the "Higher Performance" subsection.
How many block RAM resources does the XCV800-4BG432I provide?
The XCV800-4BG432I contains 28 block SelectRAM units, totaling 114,688 bits of dedicated synchronous dual-ported memory. Each block is 4,096 bits and configurable for independent port widths (1–16 bits) and depths (256–4096), enabling flexible FIFOs, dual-clock buffers, and lookup tables without consuming CLB resources.
What I/O standards are supported by the XCV800-4BG432I?
The XCV800-4BG432I supports 16 SelectIO™ standards including LVTTL (5 V tolerant), HSTL Class IV (200 MHz), SSTL3 Class I/II, GTL+, and PCI 3.3 V. Support is governed by I/O banking: each of eight banks requires shared VCCO and single VREF, with compatibility matrices defined in DS003-2 Table 2 for mixed-standard deployment.
Is the XCV800-4BG432I still in active production?
No, the XCV800-4BG432I is obsolete. DS003-1 (v4.0) states "The products listed in this data sheet are obsolete. See XCN10016 for further information." Aetrix Electronics maintains limited legacy inventory and supports lifecycle management, including cross-reference guidance and obsolescence mitigation planning for installed base systems.
XCV800-4BG432I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 432-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4704
- Number of Logic Elements/Cells:
- 21168
- Total RAM Bits:
- 114688
- Number of I/O:
- 316
- Number of Gates:
- 888439
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 432-MBGA (40x40)
XCV800-4BG432I FAQ
1.How can I place an order for XCV800-4BG432I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV800-4BG432I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV800-4BG432I reliable?
The price and inventory of XCV800-4BG432I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV800-4BG432I is usually 5 days.
3.What payment methods are accepted for XCV800-4BG432I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV800-4BG432I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV800-4BG432I?
XCV800-4BG432I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV800-4BG432I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV800-4BG432I?
For technical support, including XCV800-4BG432I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV800-4BG432I requirements.
6.How does Aetrix verify that XCV800-4BG432I is sourced from the original manufacturer or authorized distributors?
All XCV800-4BG432I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV800-4BG432I meets industry standards.
7.What is the process for return or replacement of XCV800-4BG432I?
All XCV800-4BG432I units undergo pre-shipment inspection (PSI). If there is an issue with XCV800-4BG432I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV800-4BG432I part is unused and in its original packaging.
Return procedure for XCV800-4BG432I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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