Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

AMD XCV800-4BG432I

Part No.:
XCV800-4BG432I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
432-LBGA Exposed Pad, Metal
Datasheet:
AetrixXCV800-4BG432I.pdf
Description:
IC FPGA 316 I/O 432MBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,701

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

XCV800-4BG432I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 888,439 system gates, 21,168 logic cells in a 56×84 CLB array, and 316 user I/O pins in a 432-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (114,688 bits of block RAM + distributed LUT RAM), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV800-4BG432I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and SelectIO™ standard compatibility for high-speed interface design and legacy Virtex migration planning.

Technical Context

The XCV800-4BG432I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock networks. Its CLBs contain dual-slice logic with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift register - each slice supporting independent synchronous/asynchronous set/reset and clock enable.

I/O functionality is organized into eight banks, each requiring shared VCCO and single VREF voltage; supported standards include LVTTL (5 V tolerant), HSTL Class IV (200 MHz), SSTL3, and GTL+, with per-pin programmable drive strength (up to 24 mA source / 48 mA sink) and slew rate control. Configuration occurs via master serial, slave serial, SelectMAP™, or JTAG modes using external PROM or host controller.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 888,439 - defines total combinational logic capacity for gate-equivalent synthesis targeting.
Logic Cells 21,168 - actual count of configurable logic cells (CLBs × 4.5 LC/CLB), used for place-and-route resource estimation.
User I/O Pins 316 - maximum available bidirectional user I/O in BG432 package, constrained by I/O banking rules.
Block RAM 114,688 bits - 28 × 4,096-bit synchronous dual-ported RAM blocks, enabling on-chip FIFOs and data buffering.
Speed Grade -4 - worst-case 200 MHz system performance with 66-MHz PCI compliance and sub-6 ns register-to-register delays.
Configuration Mode SRAM-based with four modes (master/slave serial, SelectMAP™, JTAG) - enables in-system reprogramming without power cycle.
Operating Temperature –40°C to +100°C (Industrial) - validated thermal range for embedded industrial and telecom infrastructure use.

Pinout & Package

Package: 432-ball Fine-Pitch Ball Grid Array (BG432), 35 mm × 35 mm, 1.27 mm pitch, RoHS-compliant. Pinout follows Xilinx DS003-4 (v4.0) Module 4, with dedicated clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, CCLK, DIN, DOUT, DONE), JTAG boundary scan (TCK/TMS/TDI/TDO), and eight I/O banks (Bank 0–7) arranged per device edge.

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Input Four dedicated low-skew clock inputs feeding primary global clock distribution networks.
INIT, PROGRAM, CCLK, DIN, DOUT, DONE Configuration Interface Control and data signals for master serial configuration; DONE indicates successful bitstream load completion.
TCK/TMS/TDI/TDO JTAG Boundary Scan IEEE 1149.1-compliant test access port for programming, debugging, and interconnect verification.
VCCINT, VCCO_Bank0–7, VREF_Bank0–7 Power & Reference VCCINT = 2.5 V core supply; VCCO per bank sets output voltage level; VREF per bank sets input threshold for compatible standards.
IO_LxxN/IO_LxxP Configurable I/O Differential-capable pins grouped by bank; support LVTTL, HSTL, SSTL, GTL+ with per-pin drive/slew control.

Key Features

Feature Design Value
Dedicated DLLs Four delay-locked loops provide zero-hold-time input capture and precise clock deskew across large designs.
Hierarchical Memory Combines 114,688-bit block RAM with distributed LUT RAM (16-/32-bit, dual-port, shift register modes) for flexible on-die data storage.
SelectIO™ Interface 16 supported standards including HSTL Class IV (200 MHz) and 5 V-tolerant LVTTL - enables direct interfacing to DDR SDRAM, ZBTRAM, and PCI peripherals.
Arithmetic Optimization Dedicated carry chains (2-bit height per slice) and hard-wired XOR/AND logic accelerate adders and multipliers without LUT consumption.
I/O Banking Eight independent banks with isolated VCCO/VREF domains allow mixed-voltage interfaces (e.g., 3.3 V LVTTL + 1.5 V HSTL) on same device.

Applications

Telecom Line Card Industrial Motion Controller

Use Scenario: High-density protocol bridging between TDM backplane and packet-switched Ethernet interfaces in carrier-grade access equipment.

IC Role / Device Role / Timing Role: FPGA fabric implements HDLC framing, CRC generation, and time-division multiplexing logic; DLLs synchronize 8 kHz TDM clocks with 125 MHz Ethernet timing.

Use Value: 316 I/O pins support full E1/T1 interface counts plus management bus; 114,688-bit block RAM buffers bursty traffic across clock domains.

Use Scenario: Real-time closed-loop servo control with multi-axis position interpolation and fieldbus (PROFIBUS-DP) gateway functions.

IC Role / Device Role / Timing Role: Configurable logic executes PID algorithms at 200 kHz loop rate; global clocks distribute deterministic timing to ADC/DAC interfaces and encoder inputs.

Use Value: -4 speed grade ensures sub-6 ns register-to-register paths for jitter-free motion profiling; I/O banking isolates 24 V digital I/O from 3.3 V fieldbus signaling.

Legacy Test Equipment Upgrade Avionics Data Concentrator

Use Scenario: Retrofitting aging ATE platforms with high-speed digital pattern generation and response analysis capability.

IC Role / Device Role / Timing Role: FPGA implements vector memory, pattern sequencer, and high-speed LVDS capture logic; DLLs align 100+ MHz stimulus clocks with sampling edges.

Use Value: 21,168 logic cells accommodate complex state machines and deep pattern buffers; 66-MHz PCI compliance enables plug-in card integration into existing PXI chassis.

Use Scenario: ARINC 429/664 (AFDX) data aggregation unit in regional aircraft flight control systems.

IC Role / Device Role / Timing Role: FPGA performs protocol translation, message filtering, and time-triggered scheduling; die-temperature sensor diode monitors thermal margin during extended mission profiles.

Use Value: Industrial temperature rating (–40°C to +100°C) meets DO-160E environmental requirements; IEEE 1149.1 boundary scan supports in-flight diagnostics and repair verification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV800-6BG432I Faster -6 speed grade (200 MHz max vs. -4's 200 MHz typical); tighter timing margins but higher static power. Better suited for designs requiring worst-case 200 MHz register-to-register paths or sub-5 ns critical paths. Select XCV800-6BG432I only if timing closure fails with -4 grade under worst-case voltage/temperature corners.
XCV1000-4BG432I Higher density (1.12M gates, 27,648 logic cells), same BG432 package and I/O count; larger block RAM (131,072 bits). Enables scaling of same PCB layout to support increased feature count or future firmware expansion. Choose XCV1000-4BG432I when design requires >21K logic cells or >114K block RAM while retaining mechanical and thermal footprint.

Compared with XCV800-4BG432I, the -6 variant offers guaranteed higher-speed timing at cost of increased power and reduced noise margin, while the XCV1000-4BG432I provides headroom for logic growth without changing board layout - both require identical PCB land patterns but distinct bitstream compilation.

Availability

XCV800-4BG432I is available at Aetrix Electronics and suitable for telecom line cards, industrial motion controllers, legacy ATE upgrades, avionics data concentrators, and Compact PCI hot-swap systems requiring stable component supply across extended product lifecycles.

Supply support for XCV800-4BG432I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered SRAM-based FPGA architectures and established industry standards for reconfigurable computing.

The Virtex family was designed for high-performance, high-capacity logic implementation in wired infrastructure, industrial automation, and aerospace systems - emphasizing place-and-route efficiency, clock management, and multi-standard I/O flexibility.

FAQ

What is the maximum operating frequency of the XCV800-4BG432I?

The XCV800-4BG432I has a -4 speed grade specifying worst-case synchronous system clock rates up to 200 MHz, including I/O timing. This is validated for register-to-register paths and 66-MHz PCI-compliant interfaces. Actual achievable frequency depends on design complexity, placement, and routing; Table 2 in DS003-1 shows representative circuit delays ranging from 4.1 ns (parity tree) to 7.2 ns (adder) under worst-case conditions.

Does the XCV800-4BG432I support hot-swap operation in Compact PCI systems?

Yes, the XCV800-4BG432I is explicitly designed for hot-swappable Compact PCI applications. Its I/O structure, power sequencing behavior, and configuration architecture meet the electrical and timing requirements for insertion/removal while the backplane remains powered. This capability is documented in the "Features" section of DS003-1 (v4.0) and confirmed in the "Higher Performance" subsection.

How many block RAM resources does the XCV800-4BG432I provide?

The XCV800-4BG432I contains 28 block SelectRAM units, totaling 114,688 bits of dedicated synchronous dual-ported memory. Each block is 4,096 bits and configurable for independent port widths (1–16 bits) and depths (256–4096), enabling flexible FIFOs, dual-clock buffers, and lookup tables without consuming CLB resources.

What I/O standards are supported by the XCV800-4BG432I?

The XCV800-4BG432I supports 16 SelectIO™ standards including LVTTL (5 V tolerant), HSTL Class IV (200 MHz), SSTL3 Class I/II, GTL+, and PCI 3.3 V. Support is governed by I/O banking: each of eight banks requires shared VCCO and single VREF, with compatibility matrices defined in DS003-2 Table 2 for mixed-standard deployment.

Is the XCV800-4BG432I still in active production?

No, the XCV800-4BG432I is obsolete. DS003-1 (v4.0) states "The products listed in this data sheet are obsolete. See XCN10016 for further information." Aetrix Electronics maintains limited legacy inventory and supports lifecycle management, including cross-reference guidance and obsolescence mitigation planning for installed base systems.

XCV800-4BG432I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
432-LBGA Exposed Pad, Metal
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
4704
Number of Logic Elements/Cells:
21168
Total RAM Bits:
114688
Number of I/O:
316
Number of Gates:
888439
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
432-MBGA (40x40)

XCV800-4BG432I FAQ

1.How can I place an order for XCV800-4BG432I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV800-4BG432I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV800-4BG432I reliable?

The price and inventory of XCV800-4BG432I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV800-4BG432I is usually 5 days.

3.What payment methods are accepted for XCV800-4BG432I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV800-4BG432I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV800-4BG432I?

XCV800-4BG432I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV800-4BG432I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV800-4BG432I?

For technical support, including XCV800-4BG432I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV800-4BG432I requirements.

6.How does Aetrix verify that XCV800-4BG432I is sourced from the original manufacturer or authorized distributors?

All XCV800-4BG432I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV800-4BG432I meets industry standards.

7.What is the process for return or replacement of XCV800-4BG432I?

All XCV800-4BG432I units undergo pre-shipment inspection (PSI). If there is an issue with XCV800-4BG432I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV800-4BG432I part is unused and in its original packaging.

Return procedure for XCV800-4BG432I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV800-4BG432I Tags

  • XCV800-4BG432I
  • XCV800-4BG432I PDF
  • XCV800-4BG432I Datasheet
  • XCV800-4BG432I Specifications
  • XCV800-4BG432I Images
  • AMD
  • AMD XCV800-4BG432I
  • Buy XCV800-4BG432I
  • XCV800-4BG432I Price
  • XCV800-4BG432I Distributor
  • XCV800-4BG432I Supplier
  • XCV800-4BG432I Wholesale
Related Products
ICE40LP384-SG32
ICE40LP384-SG32

Lattice Semiconductor Corporation

ICE40UL640-CM36AI
ICE40UL640-CM36AI

Lattice Semiconductor Corporation

ICE40UL1K-CM36AI
ICE40UL1K-CM36AI

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG32C
LCMXO2-256HC-4SG32C

Lattice Semiconductor Corporation

10M02DCV36C8G
10M02DCV36C8G

Intel

LCMXO2-256HC-4SG32I
LCMXO2-256HC-4SG32I

Lattice Semiconductor Corporation

ICE5LP1K-SG48ITR
ICE5LP1K-SG48ITR

Lattice Semiconductor Corporation

ICE40LP1K-CM36
ICE40LP1K-CM36

Lattice Semiconductor Corporation

LCMXO2-256ZE-1SG32I
LCMXO2-256ZE-1SG32I

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG48I
LCMXO2-256HC-4SG48I

Lattice Semiconductor Corporation

ICE40LP1K-CM81
ICE40LP1K-CM81

Lattice Semiconductor Corporation

T20W80I4
T20W80I4

Efinix, Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER