AMD XCV800-4BG560C

Overview

XCV800-4BG560C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) delivering 888,439 system gates in a 56×84 CLB array with 21,168 logic cells and 512 user I/O pins. It features four delay-locked loops (DLLs), hierarchical memory (including 114,688-bit block RAM and LUT-configurable RAM/shift registers), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation in commercial temperature range (0°C to +85°C).

For engineers reviewing the XCV800-4BG560C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL jitter specs, SelectIO™ interface compatibility, and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0, March 2013).

Technical Context

The XCV800-4BG560C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling high routability for complex designs while minimizing long-path delays. Its CLBs contain dual-slice logic cells with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19-input functions, and BUFTs for internal 3-state bussing.

Each IOB supports programmable input/output standards including LVTTL, LVCMOS2, PCI 3.3 V, HSTL Class IV, SSTL3, and GTL+, with independent VCCO per I/O bank, optional VREF, weak-keeper circuits, and IEEE 1149.1 boundary-scan. Eight I/O banks are defined, with VCCO and VREF pin assignments validated for BG560 package per DS003-4 Pinout Tables.

Key Specifications

Pinout & Package

Package: 560-ball Fine-Pitch Ball Grid Array (BG560), RoHS-compliant, 27 mm × 27 mm body, 1.27 mm ball pitch. Pinout conforms to Xilinx DS003-4 (v4.0) Module 4 - includes 512 user I/O pins distributed across eight I/O banks (Bank 0–7), four dedicated global clock inputs (GCLK0–GCLK3), JTAG TDI/TDO/TMS/TCK, configuration pins (INIT, PROGRAM, CCLK, DONE), and multiple VCCINT/VCCO/VREF/GND balls.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV800-4BG560C, the -6 variant delivers tighter timing margins for high-frequency control loops, while the XCV1000-4BG560C offers headroom for logic growth within identical mechanical and thermal constraints - both retain full I/O banking compatibility and DLL functionality.

Availability

XCV800-4BG560C is available at Aetrix Electronics and suitable for high-reliability communications infrastructure, industrial embedded controllers, aerospace legacy system upgrades, and test equipment requiring stable component supply throughout extended product lifecycles.

Supply support for XCV800-4BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed foundational FPGA architectures and EDA tools for high-performance digital systems.

The Virtex family, including XCV800-4BG560C, was engineered for demanding applications requiring high logic density, multi-standard I/O, and deterministic timing - targeting communications infrastructure, military/aerospace systems, and high-end test equipment.

FAQ

What is the maximum operating frequency supported by XCV800-4BG560C?

XCV800-4BG560C supports synchronous system clock rates up to 200 MHz when using DLLs and optimized routing, as confirmed in DS003-1 Table 2 and functional benchmarks. This includes I/O timing under worst-case conditions; actual performance depends on design placement, routing, and I/O standard selection (e.g., HSTL Class IV achieves 200 MHz, LVTTL 16 mA fast slew achieves 180 MHz).

Does XCV800-4BG560C support hot-swap functionality in CompactPCI systems?

Yes, XCV800-4BG560C is explicitly designed for hot-swappable CompactPCI operation per DS003-1 Feature list and Technical Context section. Its I/O structure, power sequencing behavior, and robust ESD protection (including 5 V tolerant inputs) meet PICMG 2.1 requirements for insertion/removal under power without damaging the backplane or adjacent modules.

How many block RAMs does XCV800-4BG560C contain, and what are their configurations?

XCV800-4BG560C contains 28 block SelectRAMs totaling 114,688 bits, each configured as a fully synchronous dual-ported 4,096-bit RAM. As specified in DS003-2 Table 3 and Figure 6, port widths are programmable from 1 to 16 bits (e.g., 16×256, 8×512, 4×1024), enabling native bus-width conversion between CLB logic and external memory interfaces.

Can XCV800-4BG560C operate with mixed I/O voltage standards on the same device?

Yes, XCV800-4BG560C supports mixed I/O standards via eight isolated I/O banks. Each bank has dedicated VCCO and VREF pins; DS003-2 Table 2 confirms compatibility of LVTTL (3.3 V), LVCMOS2 (2.5 V), and HSTL Class IV (1.5 V) in separate banks. Mixing standards within one bank is prohibited unless they share VCCO and VREF requirements.

Is XCV800-4BG560C still in active production or considered obsolete?

XCV800-4BG560C is marked "Product Obsolete/Under Obsolescence" in DS003-1 v4.0 (March 2013) and superseded by newer Virtex families. However, Aetrix Electronics maintains legacy inventory and traceable sourcing for continued support in long-lifecycle industrial and aerospace programs where redesign is cost-prohibitive.