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AMD XCV800-4BG560I
- Part No.:
- XCV800-4BG560I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 560-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV800-4BG560I.pdf
- Description:
- IC FPGA 404 I/O 560MBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,527
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Product details
Overview
XCV800-4BG560I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 888,439 system gates, 21,168 logic cells in a 56×84 CLB array, and 404 user I/O pins in a 560-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 114,688-bit block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.
For engineers reviewing the XCV800-4BG560I datasheet, pinout, applications, or equivalent options, key selection criteria include its industrial temperature range (–40°C to +100°C), 404-pin BG560 package compatibility, 200 MHz system performance ceiling, and multi-standard SelectIO™ interface support for LVTTL, HSTL, SSTL, and GTL families.
Technical Context
The XCV800-4BG560I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four low-skew global clock distribution networks. Its CLBs contain dual-slice logic cells with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5-/6-input functions, and configurable storage elements supporting synchronous/asynchronous set/reset.
I/O functionality is organized into eight banks, each requiring shared VCCO and optionally shared VREF; supported standards include LVTTL (5 V tolerant), HSTL Class IV (200 MHz), SSTL2/3, and GTL/GTL+, with per-pin programmable drive strength (up to 24 mA source / 48 mA sink) and slew control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 888,439 - defines total logic capacity for complex digital system implementation |
| Logic Cells | 21,168 - provides granular, place-and-route-efficient resources for RTL synthesis |
| User I/O Pins | 404 - enables high-pin-count interface consolidation (e.g., memory buses, parallel I/O) |
| Block RAM Bits | 114,688 - delivers on-chip synchronous dual-port memory for FIFOs, buffers, or lookup tables |
| Max System Frequency | 200 MHz - supports high-speed synchronous designs including PCI-66 and DDR interfaces |
| Speed Grade | -4 - specifies worst-case timing performance at industrial temperature and 2.5 V core voltage |
| Package | BG560 - 560-ball fine-pitch ball grid array with 1.27 mm pitch, optimized for thermal and signal integrity |
Pinout & Package
The XCV800-4BG560I is housed in a 560-ball plastic BGA (BG560) package with 32 dedicated power/ground balls per supply domain (VCCINT, VCCO, VREF), eight I/O banks, four global clock inputs (GCLK0–GCLK3), and IEEE 1149.1 boundary-scan test access.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Connects to dedicated low-skew clock distribution network; required for DLL synchronization |
| PROGRAM_B | Configuration Initiate | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading; must be pulled up externally |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1 interface for programming, debugging, and interconnect testing |
| VCCINT | Core Supply | 2.5 V ± 3% supply for CLB and routing logic; decoupling critical for timing stability |
| VCCO_0–VCCO_7 | I/O Bank Supply | Bank-specific 1.5 V / 2.5 V / 3.3 V outputs; each bank requires independent regulation |
| VREF_0–VREF_7 | I/O Threshold Reference | Bank-specific reference for SSTL/HSTL input receivers; must match standard requirements |
Key Features
| Feature | Design Value |
|---|---|
| Four DLLs | Enables zero-hold-time clock domain crossing and phase-aligned clock generation across multiple I/O banks |
| LUT-as-RAM mode | Each 4-LUT configures as 16×1-bit synchronous RAM or 16-bit shift register-ideal for pipeline staging or burst capture |
| Dual-port block RAM | 4k-bit blocks support independent read/write clocks and widths-enables true dual-clock FIFOs without external memory |
| SelectIO™ interface | Single-pin programmability across 16 standards (e.g., HSTL Class IV @ 200 MHz) reduces PCB layer count and signal integrity tuning |
| Dedicated carry chain | Two-bit-per-CLB arithmetic chain enables high-speed adders, counters, and accumulators without LUT resource consumption |
Applications
| High-Speed Data Acquisition | PCI-66 Embedded Controller |
|---|---|
Use Scenario: Capturing 100+ MSPS parallel ADC streams with real-time filtering and buffering before PCIe transfer. IC Role / Device Role / Timing Role: FPGA acts as deterministic front-end processor, using LUT-based shift registers for sample alignment and block RAM for ping-pong buffering. Use Value: 200 MHz system clock and 404 I/O enable direct connection to wide ADC buses; DLLs ensure setup/hold compliance across sampling domains. | Use Scenario: Implementing a custom PCI-66 master endpoint in industrial motion control with real-time servo loop closure. IC Role / Device Role / Timing Role: FPGA serves as PCI bus interface and real-time logic engine, handling address decoding, burst arbitration, and position-loop computation. Use Value: Native 66-MHz PCI compliance, hot-swap capability, and 404 I/O allow integration of encoder feedback, PWM outputs, and safety monitoring on one device. |
| Multi-Standard Memory Interface | Protocol Bridge for Legacy Systems |
Use Scenario: Interfacing DDR SDRAM, QDR SRAM, and flash memory simultaneously in telecom line cards. IC Role / Device Role / Timing Role: FPGA provides PHY-layer timing control, address multiplexing, and protocol translation between memory types. Use Value: Eight I/O banks with independent VCCO/VREF permit concurrent SSTL2 (2.5 V), HSTL (1.5 V), and LVTTL (3.3 V) interfaces without level shifters. | Use Scenario: Bridging VMEbus peripherals to modern ARM-based host processors in avionics test equipment. IC Role / Device Role / Timing Role: FPGA implements VME slave interface, data packing logic, and AXI-stream conversion for DMA transfers. Use Value: 21,168 logic cells and 114,688 block RAM bits support full VME protocol state machine plus 4 kB packet buffer-eliminating external FIFO ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV800-6BG560I | Higher speed grade (-6 vs. -4); 15–20% faster internal timing, same pinout and logic resources | Suitable for designs requiring >160 MHz clock domains or tighter hold-time margins | Select when timing closure fails on -4 grade or when future-proofing for higher-frequency derivatives |
| XCV1000-4BG560I | 1.12M system gates, 27,648 logic cells, 131,072 block RAM bits; identical BG560 package and I/O count | Enables larger state machines, deeper buffers, or additional protocol stacks without PCB change | Choose when design scalability or on-chip memory headroom is critical, and cost premium is acceptable |
Compared with XCV800-4BG560I, the -6 variant improves maximum operating frequency without altering footprint or power envelope, while the XCV1000-4BG560I extends logic and memory capacity within the same board layout-both offer migration paths rather than drop-in replacements.
Availability
XCV800-4BG560I is available at Aetrix Electronics and suitable for high-reliability industrial control, legacy telecom infrastructure, and avionics test equipment requiring stable component supply over extended product lifecycles.
Supply support for XCV800-4BG560I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.
The Virtex family-including XCV800-4BG560I-was engineered for high-performance, high-density system-level integration in wired infrastructure, military/aerospace, and industrial automation where reconfigurability and silicon efficiency are critical.
FAQ
What is the operating temperature range for XCV800-4BG560I?
The XCV800-4BG560I is rated for industrial temperature operation from –40°C to +100°C (junction temperature). This rating is confirmed by the "I" suffix in the part number and aligns with Xilinx DS003-1 specification limits for DC characteristics and timing under worst-case thermal conditions. The die-temperature sensor diode integrated into the XCV800-4BG560I enables real-time thermal monitoring in deployed systems.
Does XCV800-4BG560I support JTAG configuration?
Yes, XCV800-4BG560I fully supports IEEE 1149.1 JTAG configuration via TCK, TMS, TDI, and TDO pins. This mode allows in-system programming, boundary-scan testing, and debug access without requiring external PROMs or configuration controllers. JTAG is one of four supported configuration methods alongside Master Serial, Slave Serial, and SelectMAP™, as documented in DS003-1 Module 1.
How many block RAMs does XCV800-4BG560I contain?
XCV800-4BG560I contains 28 block SelectRAM units, totaling 114,688 bits of dedicated synchronous dual-port memory. Each block is 4,096 bits organized as configurable depth/width (e.g., 256×16 or 1024×4), with independent clock, enable, and write-enable controls per port-enabling true dual-clock FIFOs, frame buffers, or coefficient tables without consuming CLB resources.
Is XCV800-4BG560I pin-compatible with other Virtex devices in BG560 packaging?
XCV800-4BG560I shares the BG560 package footprint and pin assignment with XCV600-4BG560I, XCV400-4BG560I, and XCV1000-4BG560I, but I/O bank voltage assignments and default configurations differ. While mechanical mounting is identical, migration requires verification of VCCO/VREF allocation, clock routing, and I/O standard compatibility-no automatic functional equivalence exists across density variants.
What configuration modes does XCV800-4BG560I support?
XCV800-4BG560I supports four configuration modes: Master Serial (reads bitstream from external PROM), Slave Serial (bitstream loaded by external controller), SelectMAP™ (8- or 16-bit parallel interface), and JTAG (boundary-scan programming). Mode selection is controlled by mode pins M0–M2 during power-up, and all modes use the same configuration logic and CRC checking-ensuring bitstream integrity regardless of loading method.
XCV800-4BG560I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 560-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4704
- Number of Logic Elements/Cells:
- 21168
- Total RAM Bits:
- 114688
- Number of I/O:
- 404
- Number of Gates:
- 888439
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 560-MBGA (42.5x42.5)
XCV800-4BG560I FAQ
1.How can I place an order for XCV800-4BG560I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV800-4BG560I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV800-4BG560I reliable?
The price and inventory of XCV800-4BG560I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV800-4BG560I is usually 5 days.
3.What payment methods are accepted for XCV800-4BG560I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV800-4BG560I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV800-4BG560I?
XCV800-4BG560I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV800-4BG560I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV800-4BG560I?
For technical support, including XCV800-4BG560I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV800-4BG560I requirements.
6.How does Aetrix verify that XCV800-4BG560I is sourced from the original manufacturer or authorized distributors?
All XCV800-4BG560I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV800-4BG560I meets industry standards.
7.What is the process for return or replacement of XCV800-4BG560I?
All XCV800-4BG560I units undergo pre-shipment inspection (PSI). If there is an issue with XCV800-4BG560I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV800-4BG560I part is unused and in its original packaging.
Return procedure for XCV800-4BG560I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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