AMD XCV800-4FG676C

Overview

XCV800-4FG676C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 888,439 system gates, 21,168 logic cells in a 56×84 CLB array, and 512 user I/O pins in a 676-ball fine-pitch BGA package. It integrates four delay-locked loops (DLLs), 4 primary global clock nets plus 24 secondary local clock nets, and 114,688 bits of block SelectRAM for high-speed synchronous dual-port memory applications in telecom infrastructure and industrial control systems.

For engineers reviewing the XCV800-4FG676C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing parameters, DLL jitter specifications, and real-world migration guidance from Virtex-1 to Virtex-II families.

Technical Context

The XCV800-4FG676C implements a hierarchical routing architecture with General Routing Matrix (GRM), 24 single-length lines, 12 buffered Hex lines, and 12 bidirectional Longlines spanning full device height/width. Its CLBs contain four logic cells each-each with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift register-and dedicated carry chains supporting high-speed arithmetic.

I/O functionality is organized into eight banks with independent VCCO and VREF supply domains; each bank supports mixed standards only if sharing VCCO voltage (e.g., LVTTL and PCI at 3.3 V), while GTL/GTL+ are compatible across all VCCO levels due to open-drain outputs. The IOB includes three storage elements per pin, programmable weak-keeper, and IEEE 1149.1 boundary-scan compliance.

Key Specifications

Pinout & Package

Package: FG676 - 676-ball fine-pitch BGA, 27 mm × 27 mm, 1.0 mm ball pitch, 1.27 mm overall height, RoHS-compliant lead-free finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV800-4FG676C, the -6 variant improves timing margin at cost of higher static/dynamic power, while the XCV1000-4FG676C offers headroom for functional growth but requires revalidation of I/O voltage assignments and thermal dissipation in existing layouts.

Availability

XCV800-4FG676C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging subsystems, and military radar signal processors requiring stable component supply across extended product lifecycles.

Supply support for XCV800-4FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and design toolchains widely adopted in high-performance digital systems.

The Virtex family was engineered for high-speed, high-capacity logic implementation in demanding applications such as wired/wireless infrastructure and defense electronics, emphasizing place-and-route efficiency, clock management, and I/O flexibility.

FAQ

What is the maximum operating frequency supported by XCV800-4FG676C?

XCV800-4FG676C supports synchronous system clock rates up to 200 MHz including I/O paths. This is achieved using its four dedicated DLLs for clock deskew and its low-skew global clock distribution network. The -4 speed grade guarantees worst-case register-to-register delays of 5.0 ns, enabling robust timing closure for high-throughput datapaths in applications like packet switching and video processing.

Does XCV800-4FG676C support hot-swap capability for CompactPCI systems?

Yes, XCV800-4FG676C is explicitly designed to meet CompactPCI hot-swap requirements. Its I/O architecture supports live insertion and removal through controlled power sequencing, bus-hold logic, and IEEE 1149.1 boundary-scan testability. This capability is documented in DS003-1 and validated for use in carrier-grade telecom chassis where module replacement must occur without system downtime.

How many block RAMs does XCV800-4FG676C contain, and what configurations are supported?

XCV800-4FG676C contains 28 block SelectRAM units, totaling 114,688 bits of memory. Each block is a fully synchronous dual-ported 4,096-bit RAM with independently configurable port widths (1–16 bits) and depths (256–4096). Supported aspect ratios include 16×256, 8×512, 4×1024, 2×2048, and 1×4096, enabling flexible FIFO, buffer, and lookup table implementations without external memory.

Can XCV800-4FG676C interface directly with 5 V TTL logic?

XCV800-4FG676C supports 5 V tolerant inputs for LVTTL, PCI 5 V, and LVCMOS2 standards, allowing direct connection to 5 V logic without level shifters. However, output drivers are not 5 V tolerant and require VCCO = 3.3 V for those standards. Input-only 5 V tolerance is implemented via Zener-like clamping structures tied to ground, as specified in DS003-2 Section "Input/Output Block".

What development tools are compatible with XCV800-4FG676C?

XCV800-4FG676C is fully supported by Xilinx Foundation Series and Alliance Series development systems, including schematic entry, VHDL/Verilog synthesis, place-and-route, and bitstream generation. It is also compatible with later versions of ISE (up to v14.7) via legacy device support files. Simulation models and timing libraries are provided in DS003-3 for post-place-and-route verification under worst-case commercial conditions.