AMD XCV800-4HQ240I

Overview

XCV800-4HQ240I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 888,439 system gates, 21,168 logic cells, and 512 maximum user I/O pins in a 240-pin High Heat Dissipation Quad Flat Pack (HQ240) package. It features four delay-locked loops (DLLs), hierarchical memory including 114,688 bits of block SelectRAM and LUT-based RAM/shift register modes, and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV800-4HQ240I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, DLL jitter specifications, and real-world migration guidance from Virtex-1 family documentation DS003-1 through DS003-4 (v4.0, March 2013).

Technical Context

The XCV800-4HQ240I implements a hierarchical routing architecture with General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice structures with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input logic, and BUFTs for internal 3-state bus driving.

I/O functionality is organized into eight banks with per-bank VCCO and VREF constraints; each bank supports mixed standards only if sharing VCCO voltage (e.g., LVTTL and SSTL3 at 3.3 V), and GTL/GTL+ are compatible across all VCCO voltages due to open-drain outputs. The device uses IEEE 1149.1 boundary-scan and includes a die-temperature sensor diode.

Key Specifications

Pinout & Package

The XCV800-4HQ240I is housed in a 240-pin High Heat Dissipation Quad Flat Pack (HQ240) package with 8 I/O banks, each requiring dedicated VCCO and (where applicable) VREF supply connections. Pin functions follow Xilinx DS003-4 Module 4 pinout tables; no generic or inferred pin assignments are used.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based programmable logic applications.

Compared with XCV800-4HQ240I, the -6 variant improves timing margin for critical paths without changing footprint or power envelope, while XCV1000-4HQ240I offers headroom for logic growth within the same thermal and mechanical constraints - both require validation of VCCO/VREF bank assignments and DLL configuration.

Availability

XCV800-4HQ240I is available at Aetrix Electronics and suitable for industrial motion control, high-speed data acquisition, PCI bridge design, and protocol translation gateways requiring stable component supply across extended lifecycle planning.

Supply support for XCV800-4HQ240I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGA architecture and developed the Virtex family as high-performance alternatives to mask-programmed gate arrays using 0.22 μm 5-layer-metal CMOS.

The Virtex family was designed for applications demanding high logic density, multi-standard I/O flexibility, and deterministic clock management - especially in communications infrastructure, industrial automation, and test equipment.

FAQ

What is the maximum operating frequency of the XCV800-4HQ240I?

The XCV800-4HQ240I has a speed grade of -4, supporting synchronous system clock rates up to 200 MHz under worst-case timing conditions. This includes I/O paths compliant with 66-MHz PCI specifications. Real-world performance depends on design placement and routing; representative circuits like pipelined multipliers achieve 5.1 ns propagation delay per DS003-1 Table 2.

Does the XCV800-4HQ240I support hot-swap operation?

Yes, the XCV800-4HQ240I supports hot-swappable operation for Compact PCI systems. Its I/O structure, power sequencing behavior, and robust ESD protection enable safe insertion and removal while the backplane remains powered. This capability is explicitly documented in DS003-1 Feature list and validated across industrial temperature range (–40°C to +100°C).

How many block RAMs does the XCV800-4HQ240I contain?

The XCV800-4HQ240I contains 28 block SelectRAM units, totaling 114,688 bits of dedicated synchronous dual-ported memory. Each block is 4,096 bits and configurable for independent port widths (e.g., 16×256, 8×512). These blocks are physically arranged in two columns along the vertical edges of the die, as confirmed in DS003-2 Table 3 and Figure 6.

Can the XCV800-4HQ240I be configured via JTAG?

Yes, the XCV800-4HQ240I supports IEEE 1149.1 JTAG configuration in addition to master serial, slave serial, and SelectMAP™ modes. Pins TCK, TMS, TDI, and TDO provide full boundary-scan access for programming, debugging, and readback. JTAG operation is functional across the full industrial temperature range and requires no external configuration PROM.

What I/O standards are supported by the XCV800-4HQ240I?

The XCV800-4HQ240I supports 16 SelectIO™ standards including LVTTL, LVCMOS2, PCI (3.3 V and 5 V), HSTL Class I/III/IV, SSTL2/I/II, GTL, GTL+, CTT, AGP, and more. Support is governed by I/O banking rules: each of the eight banks must use a single VCCO voltage, and VREF-dependent standards (e.g., HSTL) require shared VREF per bank as defined in DS003-2 Table 1 and Figure 3.