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AMD XCV800-5BG432I

Part No.:
XCV800-5BG432I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
432-LBGA Exposed Pad, Metal
Datasheet:
AetrixXCV800-5BG432I.pdf
Description:
IC FPGA 316 I/O 432MBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,665

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Product details

Overview

XCV800-5BG432I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 888,439 system gates, 21,168 logic cells, and 316 user I/O pins in a 432-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory including 114,688 bits of block SelectRAM and LUTs configurable as RAM/shift registers, and supports 66-MHz PCI compliance and hot-swap operation for Compact PCI systems.

For engineers reviewing the XCV800-5BG432I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specifications, CLB-level timing parameters, and migration guidance from Virtex-1 family documentation DS003-1 through DS003-4 (v4.0, March 2013).

Technical Context

The XCV800-5BG432I implements a regular array architecture with configurable logic blocks (CLBs) surrounded by input/output blocks (IOBs), interconnected via a hierarchical routing matrix including general-purpose channels, 24 local clock nets, and dedicated horizontal 3-state bus lines. Each CLB contains four logic cells with 4-input LUTs, carry chains, and dual flip-flops per slice.

Its IO subsystem supports 16 SelectIO™ standards-including LVTTL, LVCMOS2, HSTL Class I/III/IV, SSTL2/3, GTL/GTL+, and PCI-within eight voltage-defined I/O banks, each requiring shared VCCO and (where applicable) a single VREF. The device integrates 28 block SelectRAMs (4k-bit dual-ported synchronous RAM), each configurable across 16 depth/width combinations up to 4096×1 or 256×16.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 888,439 - silicon capacity metric aligned with industry gate-count benchmarks for logic density estimation
Logic Cells 21,168 - actual count of addressable, functionally complete logic units (4 LCs per CLB × 5,292 CLBs)
User I/O Pins 316 - maximum available bidirectional signal interfaces in BG432 package, excluding dedicated clock pins
Block RAM Bits 114,688 - total distributed synchronous dual-port memory capacity across 28 × 4,096-bit blocks
Speed Grade -5 - guaranteed timing performance at worst-case industrial temperature (–40°C to +100°C) and voltage
DLL Count 4 - dedicated delay-locked loops enabling advanced clock deskew, phase alignment, and domain crossing
PCI Compliance 66 MHz - fully compliant with PCI Local Bus Specification Rev 2.2 for add-in card and backplane applications

Pinout & Package

Package: 432-ball Fine-Pitch Ball Grid Array (BG432), 35 mm × 35 mm, 1.27 mm pitch, RoHS-compliant, industrial temperature range (–40°C to +100°C).

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Input Dedicated low-skew primary clock inputs feeding four independent DLLs and global clock distribution networks
VCCO_0–VCCO_7 I/O Bank Power Supply Eight independent VCCO pins, one per I/O bank, defining output voltage levels (e.g., 3.3 V, 2.5 V, or 1.5 V) for compatible signaling standards
VREF_0–VREF_7 I/O Bank Reference Voltage Eight VREF inputs, one per bank, supplying threshold voltage for input standards like HSTL and SSTL; internally tied within each bank
TCK/TMS/TDI/TDO JTAG Boundary-Scan Interface IEEE 1149.1-compliant test access port supporting configuration, debug, and in-system verification
CCLK/INIT_DONE/PROGRAM_B Configuration Control Master clock for slave serial configuration (CCLK), power-on initialization status (INIT_DONE), and reconfiguration trigger (PROGRAM_B)

Key Features

Feature Design Value
Four DLLs with jitter compensation Enables sub-nanosecond clock deskew across large designs and supports multi-phase clocking without external PLLs
28 × 4k-bit dual-ported block RAM Provides synchronous, independent read/write access on two ports with programmable data widths (1–16 bits) and depths (256–4096)
SelectIO™ with 16 interface standards Allows mixed-voltage I/O banking (e.g., LVTTL + HSTL Class IV on same device) while maintaining signal integrity and timing closure
Dedicated carry chain per CLB slice Supports high-speed arithmetic (e.g., 32-bit adders ≤ 8 ns) without consuming LUT resources or routing delay
Configurable LUT-as-RAM/Shift Register Each 4-LUT can serve as 16×1 RAM, 16×2/32×1 RAM, 16×1 dual-port RAM, or 16-bit shift register for burst capture or DSP buffering

Applications

High-Speed Data Acquisition System PCI-Based Industrial Controller

Use Scenario: Real-time digitization and preprocessing of analog sensor streams at ≥100 MSPS using parallel ADC interfaces and on-chip FIR filtering.

IC Role / Device Role / Timing Role: Configurable logic fabric implementing pipeline stages, decimation filters, and DDR memory controllers; DLLs synchronize sampling clocks with ADC strobes and SDRAM write cycles.

Use Value: 316 I/O pins support wide parallel ADC buses and SDRAM interfaces; 114,688 block RAM bits buffer multiple acquisition frames before host transfer.

Use Scenario: Embedded motion control board with PCI host interface, encoder feedback processing, and PWM motor drive generation.

IC Role / Device Role / Timing Role: PCI target endpoint managing DMA transfers and command decoding; CLB-based quadrature decoder and dead-time insertion logic for gate drivers.

Use Value: 66-MHz PCI compliance ensures full bandwidth for real-time command streaming; 4 DLLs isolate encoder clock domains from PCI and PWM timing domains.

Telecom Line Card Interface Legacy System Emulation Platform

Use Scenario: Aggregation of multiple T1/E1/J1 framer interfaces with HDLC framing, CRC checking, and channelized time-slot mapping.

IC Role / Device Role / Timing Role: Protocol engine implementing framer logic, elastic store buffers, and multiplexing/demultiplexing; SelectIO™ configured for HSTL Class IV for backplane interconnect.

Use Value: HSTL Class IV support enables 200 MHz chip-to-chip signaling; 8 I/O banks allow independent VCCO/VREF per framer lane for mixed-standard compatibility.

Use Scenario: Hardware replacement for obsolete ASICs in avionics or medical equipment, replicating custom logic with field-upgradable functionality.

IC Role / Device Role / Timing Role: Pin-compatible behavioral clone of legacy gate array; SRAM configuration allows post-deployment bug fixes and feature updates without PCB change.

Use Value: 888k system gates accommodate complex state machines and glue logic; industrial temp rating (–40°C to +100°C) matches legacy environmental requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV800-6BG432I Faster speed grade (–6 vs –5); achieves higher fMAX in register-to-register paths and I/O timing margins Better suited for designs requiring >160 MHz system clock or tighter setup/hold windows on 66-MHz PCI Select when timing closure fails at –5 grade or when future-proofing for higher clock rates is required
XCV1000-5BG432I Higher density (1.12M gates, 27,648 logic cells), same package and speed grade; adds 16,384 more block RAM bits Enables larger state machines, deeper FIFOs, or additional protocol stacks without changing PCB layout Choose for design scalability where logic utilization exceeds 85% on XCV800-5BG432I but footprint must remain identical

Compared with XCV800-5BG432I, the –6 variant improves worst-case timing margin by ~12% in critical paths, while XCV1000-5BG432I offers 26% more logic cells and 14% more block RAM within identical mechanical and thermal constraints-making both viable for incremental upgrades without board redesign.

Availability

XCV800-5BG432I is available at Aetrix Electronics and suitable for high-reliability industrial control, telecom infrastructure, and legacy system modernization requiring stable component supply and long-term lifecycle support.

Supply support for XCV800-5BG432I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed foundational FPGA architectures and EDA toolchains for adaptive computing.

The Virtex family, including XCV800-5BG432I, was engineered for high-performance system integration-targeting applications demanding dense logic, high-speed I/O, embedded memory, and deterministic clock management in aerospace, wired infrastructure, and industrial automation.

FAQ

What is the maximum operating frequency of the XCV800-5BG432I?

The XCV800-5BG432I supports synchronous system clock rates up to 200 MHz, including I/O paths, under worst-case industrial conditions (–40°C to +100°C, VCC = 2.5 V ± 3%). This figure reflects register-to-register timing in optimized designs; actual achievable frequency depends on placement, routing, and logic depth. The –5 speed grade guarantees timing closure for designs meeting published DC and switching characteristics in DS003-3.

Does the XCV800-5BG432I support hot-swap operation?

Yes, the XCV800-5BG432I supports hot-swap operation for Compact PCI systems, as confirmed in DS003-1 (v4.0). Its I/O structure, power sequencing behavior, and IEEE 1149.1 boundary-scan logic enable safe insertion/removal while the backplane remains powered. Implementation requires adherence to PICMG 2.1 specifications and proper board-level protection circuitry.

How many block RAMs does the XCV800-5BG432I contain?

The XCV800-5BG432I contains 28 block SelectRAMs, each providing 4,096 bits of synchronous dual-ported memory, for a total of 114,688 bits. Each block supports independent read/write addressing, programmable data widths (1–16 bits), and depths (256–4096), with dedicated routing to CLBs and adjacent RAM blocks as documented in DS003-2.

Is the XCV800-5BG432I still in production?

No, the XCV800-5BG432I is obsolete. DS003-1 (v4.0, March 2013) explicitly states "The products listed in this data sheet are obsolete. See XCN10016 for further information." Aetrix Electronics provides legacy supply chain support, including traceable inventory, cross-reference assistance, and migration path guidance to newer Xilinx/AMD families where feasible.

What I/O standards are supported by the XCV800-5BG432I?

The XCV800-5BG432I supports 16 SelectIO™ standards, including LVTTL (5 V tolerant), LVCMOS2, PCI (3.3 V and 5 V), HSTL Classes I/III/IV, SSTL2/3 Classes I & II, GTL/GTL+, CTT, AGP, and programmable slew rate and drive strength. Support is constrained by I/O banking rules-each of the eight banks requires shared VCCO and (if needed) a single VREF voltage.

XCV800-5BG432I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
432-LBGA Exposed Pad, Metal
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
4704
Number of Logic Elements/Cells:
21168
Total RAM Bits:
114688
Number of I/O:
316
Number of Gates:
888439
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
432-MBGA (40x40)

XCV800-5BG432I FAQ

1.How can I place an order for XCV800-5BG432I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV800-5BG432I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV800-5BG432I reliable?

The price and inventory of XCV800-5BG432I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV800-5BG432I is usually 5 days.

3.What payment methods are accepted for XCV800-5BG432I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV800-5BG432I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV800-5BG432I?

XCV800-5BG432I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV800-5BG432I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV800-5BG432I?

For technical support, including XCV800-5BG432I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV800-5BG432I requirements.

6.How does Aetrix verify that XCV800-5BG432I is sourced from the original manufacturer or authorized distributors?

All XCV800-5BG432I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV800-5BG432I meets industry standards.

7.What is the process for return or replacement of XCV800-5BG432I?

All XCV800-5BG432I units undergo pre-shipment inspection (PSI). If there is an issue with XCV800-5BG432I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV800-5BG432I part is unused and in its original packaging.

Return procedure for XCV800-5BG432I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV800-5BG432I Tags

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