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AMD XCV800-5BG560C
- Part No.:
- XCV800-5BG560C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 560-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV800-5BG560C.pdf
- Description:
- IC FPGA 404 I/O 560MBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,057
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Product details
Overview
XCV800-5BG560C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 888,439 system gates, 21,168 logic cells in a 56×84 CLB array, and 512 user I/O pins in a 560-ball BGA package. It integrates four delay-locked loops (DLLs), 28 × 4,096-bit dual-ported block RAMs (114,688 bits total), and supports 66-MHz PCI-compliant interfaces for high-speed embedded control and data-path acceleration.
For engineers reviewing the XCV800-5BG560C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, SelectIO™ standard compatibility, and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0).
Technical Context
The XCV800-5BG560C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5–19-input logic, and LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift register.
I/O functionality is organized into eight banks, each supporting independent VCCO and VREF voltages; compatible standards per bank include LVTTL, LVCMOS2, SSTL3, HSTL Class I/III/IV, and GTL/GTL+, with 5 V tolerance limited to LVTTL, LVCMOS2, and PCI 5 V inputs. The device uses a 0.22 μm 5-layer metal CMOS process and is 100% factory tested.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 888,439 - defines maximum combinational logic density for place-and-route estimation |
| Logic Cells | 21,168 - actual count of configurable logic elements (4.5 LCs per CLB × 4,704 CLBs) |
| User I/O Pins | 512 - maximum available bidirectional signals in BG560 package, excluding dedicated clocks |
| Block RAM Bits | 114,688 - from 28 × 4,096-bit synchronous dual-ported RAM blocks, enabling on-chip FIFOs and buffer memory |
| Speed Grade | -5 - guarantees timing performance up to 200 MHz system clock rate under worst-case commercial conditions (0°C to +85°C) |
| Supply Voltage | 2.5 V core (VCCINT), 3.3 V/2.5 V/1.5 V I/O (VCCO) - requires separate power domains per I/O bank |
| Configuration Mode | Master Serial, Slave Serial, SelectMAP™, JTAG - enables in-system reprogramming without external PROM dependency |
Pinout & Package
Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 27 mm × 27 mm, 1.27 mm pitch, RoHS-compliant. Pinout defined across eight I/O banks (Bank 0–7), with dedicated global clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), JTAG TAP signals (TCK, TMS, TDI, TDO), and VCCO/VREF supply pins assigned per bank per DS003-4 (v4.0) Pinout Tables.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Primary low-skew clock inputs routed to four dedicated DLLs for domain-specific skew management |
| INIT, PROGRAM, CCLK, DIN, DONE | Configuration Interface | Control and data lines for master serial configuration; DONE indicates successful bitstream loading |
| TCK, TMS, TDI, TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port for programming, debugging, and interconnect verification |
| VCCO_0–VCCO_7 | I/O Bank Power Supply | Separate VCCO pins per bank enable mixed-voltage I/O (e.g., 3.3 V LVTTL + 1.5 V HSTL in different banks) |
| VREF_0–VREF_7 | I/O Threshold Reference | Bank-specific reference voltage for SSTL/HSTL/GTL input receivers; internally tied within each bank |
Key Features
| Feature | Design Value |
|---|---|
| Four DLLs | Enables zero hold-time clock alignment, phase shifting, and duty-cycle correction for source-synchronous interfaces |
| 28 × 4k-bit Dual-Port Block RAMs | Provides 114,688 bits of true dual-port memory with independent read/write clocks and widths per port |
| SelectIO™ Interface Support | 16 standards including LVTTL, SSTL3, HSTL Class IV, GTL+, and PCI - with per-bank VCCO/VREF isolation |
| CLB Carry Chains | Dedicated two-bit-per-CLB arithmetic carry paths accelerate adders, counters, and accumulators without LUT resource cost |
| Configurable LUT RAM | Each 4-input LUT operates as 16×1-bit synchronous RAM, 16×2-bit, 32×1-bit, or 16×1-bit dual-port RAM - enabling distributed memory and shift registers |
Applications
| PCI Bridge Controller | High-Speed Data Acquisition |
|---|---|
Use Scenario: Implementing a 66-MHz PCI bus master interface between a host CPU and custom peripherals in industrial instrumentation. IC Role / Device Role / Timing Role: FPGA acts as PCI target and initiator with hard-wired arbitration, address decoding, and burst transfer control using dedicated carry logic and DLL-synchronized timing. Use Value: Achieves full 528 MB/s PCI bandwidth with deterministic latency via 4 DLLs and 512 I/O pins allocated to AD[31:0], C/BE[3:0]#, PAR, and FRAME# signals. |
Use Scenario: Capturing parallel 14-bit ADC samples at 100 MSPS and buffering into on-chip RAM before serial transmission. IC Role / Device Role / Timing Role: FPGA serves as high-speed parallel-to-serial converter with LUT-based shift registers for capture and block RAM for depth-2k buffering. Use Value: Uses 28 × 4k-bit block RAMs (114,688 bits) to store >8k samples, while DLL-controlled I/O timing ensures setup/hold compliance at 100 MHz DDR rates. |
| Telecom Line Card Logic | Legacy System Emulation |
Use Scenario: Replacing ASICs in optical line termination equipment requiring HSTL Class IV and SSTL3 I/O for SerDes interfacing. IC Role / Device Role / Timing Role: FPGA provides protocol translation, framing, and jitter cleanup using four DLLs and eight I/O banks with independent VCCO/VREF. Use Value: Supports simultaneous HSTL Class IV (1.5 V) and SSTL3 (3.3 V) signaling on adjacent banks - validated by DS003-2 Table 2 compatibility rules. |
Use Scenario: Emulating obsolete gate arrays in avionics maintenance systems with field-upgradable logic via JTAG or SelectMAP™. IC Role / Device Role / Timing Role: FPGA functions as drop-in replacement with identical pinout mapping (BG560), reprogrammable configuration memory, and IEEE 1149.1 boundary scan for in-circuit validation. Use Value: Enables zero-PCB-change migration from mask-ROM ASICs using SRAM-based configuration and 100% factory-tested reliability per DS003-1. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV800-6BG560C | Faster speed grade (-6 vs. -5); guarantees 200 MHz operation under worst-case commercial conditions where -5 guarantees 180 MHz | Suitable for designs requiring tighter timing closure on critical paths such as 66-MHz PCI timing margins or high-frequency DDR interfaces | Select XCV800-6BG560C only if timing analysis shows negative slack on clock-to-out or setup paths with -5 grade |
| XCV1000-5BG560C | Higher density (1.12M gates, 27,648 logic cells, 32 block RAMs = 131,072 bits) in same BG560 package footprint | Used when design outgrows XCV800 resources but PCB layout must remain unchanged; requires updated bitstream and power delivery | Choose XCV1000-5BG560C for forward-compatible upgrades where logic utilization exceeds 90% on XCV800-5BG560C |
Compared with XCV800-5BG560C, the -6 variant improves worst-case clock frequency margin without changing pinout or power requirements, while the XCV1000-5BG560C offers higher capacity within identical mechanical packaging - both require revalidation of thermal, power, and timing constraints.
Availability
XCV800-5BG560C is available at Aetrix Electronics and suitable for industrial control systems, telecom infrastructure hardware, legacy avionics upgrades, and high-speed test equipment requiring stable component supply and long-term obsolescence mitigation support.
Supply support for XCV800-5BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered SRAM-based FPGA architectures and tools for digital system design.
The Virtex family, including XCV800-5BG560C, was designed for high-performance, high-density programmable logic applications in communications, computing, and industrial systems - emphasizing clock management, mixed-voltage I/O, and scalable memory hierarchy.
FAQ
What is the maximum operating temperature range for XCV800-5BG560C?
The XCV800-5BG560C is rated for commercial temperature range: junction temperature (TJ) from 0°C to +85°C. This is indicated by the "C" suffix in the part number per Figure 1 of DS003-1 (v4.0). Industrial-grade variants (e.g., XCV800-5BG560I) use "I" and support –40°C to +100°C, but XCV800-5BG560C does not qualify for extended temperature operation.
Does XCV800-5BG560C support hot-swapping in Compact PCI systems?
Yes, XCV800-5BG560C supports hot-swapping for Compact PCI as stated in the Features section of DS003-1 (v4.0). This capability relies on its 2.5 V core supply tolerance, robust I/O protection circuitry, and controlled configuration sequencing - all validated for insertion/removal under power in compliant backplane environments.
How many dedicated delay-locked loops (DLLs) does XCV800-5BG560C include?
XCV800-5BG560C includes four dedicated delay-locked loops (DLLs), as confirmed in the Features section and Architectural Description of DS003-1 and DS003-2 (v4.0). These DLLs provide advanced clock control including zero-delay buffering, phase shifting, and duty-cycle correction for up to four independent clock domains.
Can XCV800-5BG560C implement true dual-port RAM using block memory?
Yes, XCV800-5BG560C contains 28 block SelectRAM units, each a fully synchronous dual-ported 4,096-bit RAM with independent clocks, addresses, and data buses per port. As specified in DS003-2 Table 3 and Figure 6, this enables concurrent read/write operations - essential for FIFOs, frame buffers, and ping-pong memory architectures.
Is XCV800-5BG560C pin-compatible with other Virtex devices in the BG560 package?
No - XCV800-5BG560C is not universally pin-compatible with other Virtex devices in BG560. While XCV600, XCV800, and XCV1000 all offer BG560 variants (per Table 3 of DS003-1), pin functions differ across densities due to varying CLB counts, RAM column placement, and clock network routing. Pin compatibility must be verified per DS003-4 Pinout Tables for each specific device.
XCV800-5BG560C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 560-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4704
- Number of Logic Elements/Cells:
- 21168
- Total RAM Bits:
- 114688
- Number of I/O:
- 404
- Number of Gates:
- 888439
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 560-MBGA (42.5x42.5)
XCV800-5BG560C FAQ
1.How can I place an order for XCV800-5BG560C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV800-5BG560C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV800-5BG560C reliable?
The price and inventory of XCV800-5BG560C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV800-5BG560C is usually 5 days.
3.What payment methods are accepted for XCV800-5BG560C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV800-5BG560C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV800-5BG560C?
XCV800-5BG560C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV800-5BG560C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV800-5BG560C?
For technical support, including XCV800-5BG560C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV800-5BG560C requirements.
6.How does Aetrix verify that XCV800-5BG560C is sourced from the original manufacturer or authorized distributors?
All XCV800-5BG560C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV800-5BG560C meets industry standards.
7.What is the process for return or replacement of XCV800-5BG560C?
All XCV800-5BG560C units undergo pre-shipment inspection (PSI). If there is an issue with XCV800-5BG560C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV800-5BG560C part is unused and in its original packaging.
Return procedure for XCV800-5BG560C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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