AMD XCV800-5BG560I

Overview

XCV800-5BG560I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 888,439 system gates, 21,168 logic cells, and 512 user I/O pins in a 560-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 114,688 bits of block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV800-5BG560I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, SelectIO™ standard compatibility (LVTTL, HSTL, SSTL), and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0).

Technical Context

The XCV800-5BG560I implements a regular array architecture with configurable logic blocks (CLBs) arranged in a 56×84 grid, each containing four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice. Its routing hierarchy includes local VersaBlock interconnect, general-purpose GRM, 12 Longlines, and VersaRing I/O ring for pin-locking.

It integrates 28 block SelectRAM™ modules (each 4k-bit synchronous dual-ported RAM), supports eight I/O banks with independent VCCO/VREF assignment, and provides IEEE 1149.1 boundary-scan testability. The -5 speed grade guarantees 200 MHz system performance under worst-case timing conditions with DLL-enabled clock management.

Key Specifications

Pinout & Package

The XCV800-5BG560I is housed in a 560-ball fine-pitch ball grid array (BG560) package with 35 mm × 35 mm body size, 1.27 mm ball pitch, and thermal-enhanced construction suitable for industrial temperature range (–40°C to +100°C). Pin functions follow Xilinx DS003-4 Module 4 pinout tables.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV800-5BG560I, the XCV800-6BG560I delivers higher timing margin at identical density, while the XCV1000-5BG560I offers 26% more logic resources in the same footprint-enabling either performance uplift or functional growth without layout revision.

Availability

XCV800-5BG560I is available at Aetrix Electronics and suitable for high-reliability industrial control, telecommunications infrastructure, and defense electronics requiring stable component supply across extended product lifecycles.

Supply support for XCV800-5BG560I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed foundational FPGA architectures used across aerospace, communications, and computing.

The Virtex family-including XCV800-5BG560I-was engineered for high-performance, high-density system integration, targeting applications demanding reconfigurable logic, embedded memory, and multi-standard I/O in a single device.

FAQ

What is the operating temperature range for XCV800-5BG560I?

The XCV800-5BG560I is rated for industrial temperature operation from –40°C to +100°C (junction temperature), as indicated by the "I" suffix in its ordering code. This rating applies to all electrical specifications in DS003-3, including I/O drive strength, DLL lock time, and configuration reliability under thermal stress.

Does XCV800-5BG560I support JTAG programming and debugging?

Yes, XCV800-5BG560I fully implements IEEE 1149.1 boundary-scan logic with dedicated TCK, TMS, TDI, and TDO pins. It supports in-circuit configuration, readback of configuration memory, and interconnect testing-enabling debug visibility and manufacturing test coverage without additional hardware probes.

How many block RAMs does XCV800-5BG560I contain, and what are their configurations?

XCV800-5BG560I contains 28 block SelectRAM™ modules, each providing 4,096 bits of synchronous dual-ported RAM. Each block supports independent port widths (1–16 bits) and depths (256–4096), enabling flexible memory mapping such as 256×16 or 1024×4 configurations without external memory chips.

Can XCV800-5BG560I interface directly with 3.3 V PCI buses?

Yes, XCV800-5BG560I supports 3.3 V PCI signaling via its SelectIO™ I/O banks when configured with VCCO = 3.3 V and appropriate drive settings. It meets PCI specification timing (setup/hold, skew, voltage levels) and supports hot-swap sequencing per PICMG 2.1 when combined with external power-control circuitry.

Is XCV800-5BG560I still in active production or subject to obsolescence?

XCV800-5BG560I is marked as obsolete per Xilinx document DS003-1 (v4.0, March 2013) and XCN10016. While no longer manufactured, Aetrix Electronics maintains legacy inventory and supports lifecycle management-including cross-reference guidance, last-time-buy coordination, and migration paths to newer families.