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AMD XCV800-5FG676I

Part No.:
XCV800-5FG676I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BGA
Datasheet:
AetrixXCV800-5FG676I.pdf
Description:
IC FPGA 444 I/O 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,504

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Product details

Overview

XCV800-5FG676I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 888,439 system gates, 21,168 logic cells in a 56×84 CLB array, and 512 user I/O pins in a 676-ball fine-pitch BGA package. It integrates four delay-locked loops (DLLs), 28 × 4,096-bit dual-ported block RAMs (114,688 bits total), and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.

For engineers reviewing the XCV800-5FG676I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, SelectIO™ standard compatibility, and migration guidance from Virtex-1 generation designs.

Technical Context

The XCV800-5FG676I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain four logic cells each-each with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift register-and dedicated carry chains for arithmetic acceleration.

I/O functionality is organized into eight independent banks, each supporting mixed voltage standards under shared VCCO and single VREF constraints. Supported SelectIO™ standards include LVTTL (3.3 V, 5 V tolerant), LVCMOS2 (2.5 V), HSTL Class IV (1.5 V), and SSTL3 Class I/II (3.3 V), with programmable drive strength up to 24 mA and sink capability up to 48 mA per output.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 888,439 - defines maximum combinational logic density for place-and-route estimation
Logic Cells 21,168 - provides granular resource count for synthesis and timing closure
User I/O Pins 512 - enables high-pin-count interface consolidation (e.g., memory buses + peripheral control)
Block RAM Bits 114,688 - delivered via 28 × 4,096-bit synchronous dual-ported RAM blocks for FIFOs and buffering
Speed Grade -5 - guarantees worst-case 6.0 ns pipelined multiplier (16×16) and 5.4 ns 16:1 multiplexer performance
Operating Voltage 2.5 V core / 3.3 V or 2.5 V I/O - requires separate VCCINT and bank-specific VCCO supplies
Temperature Range –40°C to +100°C (Industrial) - validated for extended thermal environments without derating

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG676) with 676 solder balls, 1.0 mm pitch, and 27 mm × 27 mm body size. Pin assignment follows Xilinx DS003-4 (v4.0) Module 4, with eight I/O banks (Bank 0–7), four dedicated global clock inputs (GCLK0–GCLK3), and dual-purpose configuration pins (e.g., INIT, PROGRAM_B, CCLK).

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Input Low-skew dedicated inputs feeding four primary clock networks; required for DLL reference
IO_LxxN/P_yy_# User I/O (Differential Pair) Configurable as LVDS, LVDSEXT, or other differential standards; mapped to specific I/O bank and VREF group
VCCO_# I/O Bank Supply Bank-specific output voltage rail (e.g., 3.3 V or 2.5 V); all outputs in same bank must share one VCCO
VREF_# Input Reference Voltage Single-supplied threshold reference per bank; required for SSTL/HSTL/LVCMOS input standards
INIT, PROGRAM_B, CCLK, DIN, DONE Configuration Interface Support master serial, slave serial, SelectMAP™, and JTAG modes; DONE indicates configuration completion

Key Features

Feature Design Value
Dedicated DLLs Four on-chip delay-locked loops enable zero-hold-time I/O timing and phase-aligned clock domain crossing
SelectIO™ Flexibility 16 supported standards-including PCI 66 MHz, HSTL Class IV, and SSTL3-with per-bank VCCO/VREF control
Hierarchical Memory LUTs serve as distributed 16-bit RAM/shift registers; block RAMs provide 4k-bit dual-ported buffers with independent port widths
Arithmetic Optimization Dedicated carry chains and XOR/AND logic within CLBs accelerate adders, accumulators, and multipliers
Boundary Scan IEEE 1149.1-compliant TAP controller enables full-board JTAG testing and in-system programming

Applications

PCI Bridge Controller High-Speed Data Acquisition

Use Scenario: Implementing a 66-MHz PCI bus master interface between host CPU and custom peripherals in industrial test equipment.

IC Role / Device Role / Timing Role: FPGA acts as PCI target and initiator with hard-wired timing compliance, DLL-synchronized setup/hold, and 512 I/O for address/data multiplexing.

Use Value: Eliminates need for discrete glue logic and external FIFOs; leverages 114,688 block RAM bits for burst-mode data buffering at line rate.

Use Scenario: Capturing parallel 14-bit ADC samples at 100 MSPS with real-time histogramming and trigger logic in radar signal processing.

IC Role / Device Role / Timing Role: Configurable logic processes sample streams using LUT-based shift registers and carry-chain arithmetic; DLLs align sampling clocks to external triggers.

Use Value: Achieves sub-ns timing precision across 512 I/O; uses dual-ported block RAM for simultaneous capture and readout without stalls.

Telecom Line Card Legacy System Emulation

Use Scenario: Replacing obsolete gate arrays in SONET/SDH framer cards requiring HSTL Class IV and SSTL3 interfaces to SerDes and memory.

IC Role / Device Role / Timing Role: FPGA implements protocol state machines and elastic buffers, with I/O banks independently configured for 1.5 V HSTL and 3.3 V SSTL3 signaling.

Use Value: Supports mixed-voltage I/O on single device; avoids PCB redesign by matching pinout of legacy ASICs via VersaRing routing.

Use Scenario: Emulating aging microcontroller peripherals (e.g., UART, SPI, timer) in avionics maintenance simulators with strict EMI requirements.

IC Role / Device Role / Timing Role: FPGA replicates exact timing behavior of legacy parts using synchronous LUT-RAM and DLL-controlled clock domains.

Use Value: Maintains functional equivalence without requalification; die-temperature sensor diode enables thermal derating validation per DO-254.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV800-6FG676I Faster speed grade (-6 vs. -5): 5.1 ns pipelined multiplier, 4.4 ns address decoder Required only when design fails timing at -5 grade; identical pinout, power, and feature set Select if post-place-and-route timing analysis shows >5% slack violation on critical paths
XCV1000-5FG676I Higher density (1.12M gates, 27,648 logic cells), same FG676 package and I/O count Enables future-proofing with unused logic resources; requires updated bitstream and timing constraints Choose for new designs needing headroom; not drop-in-requires re-synthesis and layout review for power delivery

Compared with XCV800-5FG676I, the -6 variant delivers measurable timing margin gains without hardware change, while XCV1000-5FG676I offers scalable logic capacity within identical footprint-both require verification against original timing and thermal targets.

Availability

XCV800-5FG676I is available at Aetrix Electronics and suitable for industrial control systems, telecom infrastructure upgrades, aerospace test instrumentation, and legacy FPGA replacement programs requiring stable component supply across extended product lifecycles.

Supply support for XCV800-5FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed the Virtex family as its flagship high-performance FPGA platform.

The Virtex family was engineered for demanding applications requiring high logic density, multi-standard I/O, and deterministic clock management-targeting communications infrastructure, defense systems, and high-end computing acceleration.

FAQ

Is XCV800-5FG676I still in production or considered obsolete?

XCV800-5FG676I is marked as obsolete per Xilinx documentation (DS003-1 v4.0, March 2013) and superseded by Spartan-6 and 7-series FPGAs. However, Aetrix Electronics maintains legacy inventory with full traceability and offers lifecycle management support including obsolescence forecasting and cross-reference guidance for XCV800-5FG676I replacements.

What configuration modes does XCV800-5FG676I support?

XCV800-5FG676I supports four configuration modes: master serial (auto-reads from external PROM), slave serial, SelectMAP™ (parallel data loading), and IEEE 1149.1 JTAG. All modes use the same dedicated pins (DIN, CCLK, PROGRAM_B, INIT, DONE), with mode selection determined by M0–M2 strap pins during power-up.

Can XCV800-5FG676I interface directly with 5 V TTL logic?

XCV800-5FG676I supports 5 V-tolerant inputs for LVTTL and PCI 5 V standards, but its outputs are not 5 V capable. To drive 5 V TTL loads, external level-shifting circuitry or bus switches are required. The IOBs include clamp diodes referenced to VCCO-not 5 V-so VCCO must be set to 3.3 V for safe 5 V input operation.

How many DLLs does XCV800-5FG676I include, and what are their key timing parameters?

XCV800-5FG676I includes four dedicated delay-locked loops (DLLs). Each DLL provides jitter < ±60 ps (peak-to-peak) and supports input frequencies from 10 MHz to 200 MHz. DLL outputs feed four global clock networks, enabling zero-hold-time I/O timing and phase alignment across multiple clock domains in XCV800-5FG676I designs.

Does XCV800-5FG676I support hot-swap operation in CompactPCI systems?

Yes, XCV800-5FG676I is explicitly designed for hot-swappable CompactPCI applications. Its IOBs include programmable weak-keeper circuits, controlled slew-rate drivers, and input/output structures compliant with PICMG 2.1 specifications-ensuring glitch-free insertion/removal while maintaining signal integrity on shared backplane buses.

XCV800-5FG676I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
676-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
4704
Number of Logic Elements/Cells:
21168
Total RAM Bits:
114688
Number of I/O:
444
Number of Gates:
888439
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FBGA (27x27)

XCV800-5FG676I FAQ

1.How can I place an order for XCV800-5FG676I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV800-5FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV800-5FG676I reliable?

The price and inventory of XCV800-5FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV800-5FG676I is usually 5 days.

3.What payment methods are accepted for XCV800-5FG676I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV800-5FG676I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV800-5FG676I?

XCV800-5FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV800-5FG676I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV800-5FG676I?

For technical support, including XCV800-5FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV800-5FG676I requirements.

6.How does Aetrix verify that XCV800-5FG676I is sourced from the original manufacturer or authorized distributors?

All XCV800-5FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV800-5FG676I meets industry standards.

7.What is the process for return or replacement of XCV800-5FG676I?

All XCV800-5FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XCV800-5FG676I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV800-5FG676I part is unused and in its original packaging.

Return procedure for XCV800-5FG676I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV800-5FG676I Tags

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