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AMD XCV800-6BG432C

Part No.:
XCV800-6BG432C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
432-LBGA Exposed Pad, Metal
Datasheet:
AetrixXCV800-6BG432C.pdf
Description:
IC FPGA 316 I/O 432MBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,842

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Product details

Overview

XCV800-6BG432C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 888,439 system gates, 21,168 logic cells in a 56×84 CLB array, and 316 user I/O pins in a 432-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 114,688-bit block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV800-6BG432C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, SelectIO™ standard compatibility (LVTTL, HSTL Class IV, SSTL3), and CLB-level timing parameters for synchronous register-to-register paths up to 200 MHz.

Technical Context

The XCV800-6BG432C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice logic cells with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and BUFTs for internal 3-state bus driving.

I/O functionality is organized into eight independent banks, each requiring shared VCCO and (where applicable) a single VREF voltage. Supported standards include LVTTL (5 V tolerant), HSTL Class IV (200 MHz), SSTL3 Class I/II, and GTL/GTL+, with per-pin programmable drive strength (up to 24 mA source / 48 mA sink) and slew control.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 888,439 - defines total logic capacity for ASIC replacement estimation
Logic Cells 21,168 - actual count of configurable logic cells (CLBs × 4.5 LC/CLB)
User I/O Pins 316 - maximum available bidirectional I/O signals in BG432 package
Block RAM Bits 114,688 - distributed across 28 × 4,096-bit dual-ported synchronous RAM blocks
Max System Clock 200 MHz - guaranteed synchronous performance including I/O path timing
PCI Compliance 66-MHz PCI - meets timing and signaling requirements for full-speed PCI bus interface
Speed Grade -6 - worst-case timing grade specifying setup/hold/clock-to-out delays at 2.5 V, 85°C

Pinout & Package

The XCV800-6BG432C is housed in a 432-ball fine-pitch Ball Grid Array (BG432) package with 316 user I/O pins distributed across eight I/O banks. Each bank requires dedicated VCCO and (if needed) a shared VREF supply; no VCCO or VREF pins are shared between banks.

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Input Dedicated low-skew inputs feeding four primary clock distribution networks
IO_LxxN/IO_LxxP User I/O Bank Pin Differential or single-ended signal pin assigned to one of eight I/O banks (e.g., Bank 0–7)
VCCO_0–VCCO_7 Output Supply Voltage Bank-specific power supply for output drivers; must be uniform within each bank
VREF_0–VREF_7 Input Reference Voltage Bank-specific threshold reference for SSTL/HSTL/GTL inputs; internally tied within bank
M0–M2, INIT, PROGRAM_B Configuration Control Mode selection, initialization, and active-low programming enable for master/slave serial or SelectMAP™ configuration
TCK, TMS, TDI, TDO JTAG Boundary Scan IEEE 1149.1-compliant test access port for configuration, debug, and verification

Key Features

Feature Design Value
Four DLLs Enables zero hold-time I/O interfaces and precise clock deskew across large designs
Configurable LUT RAM Each 4-LUT can operate as 16×1-bit synchronous RAM, 16×2-bit, 32×1-bit, or 16-bit shift register
Dual-ported Block RAM 28 × 4,096-bit RAM blocks support independent read/write on two ports with flexible width/depth configuration
SelectIO™ Interface Supports 16 I/O standards including HSTL Class IV (200 MHz), SSTL3, and 5 V-tolerant LVTTL
Dedicated Carry Logic Two per CLB slice enables high-speed arithmetic (e.g., pipelined adders/multipliers) without LUT resource cost

Applications

High-Speed Communications Backplane PCI-Based Industrial Controller

Use Scenario: Implementing protocol bridging and packet buffering between multiple 66-MHz PCI slots and a custom SERDES interface.

IC Role / Device Role / Timing Role: FPGA acts as a reconfigurable interconnect fabric with deterministic 66-MHz PCI timing compliance and DLL-managed clock domain crossing.

Use Value: Enables seamless integration of legacy PCI peripherals with modern high-speed serial links using on-chip block RAM for packet buffering and LUT RAM for header parsing state machines.

Use Scenario: Real-time motion control system with synchronized analog I/O, encoder feedback, and servo drive interface over PCI.

IC Role / Device Role / Timing Role: XCV800-6BG432C serves as the central logic engine managing time-critical I/O scheduling, PID computation, and PCI host communication.

Use Value: Delivers sub-microsecond interrupt latency via dedicated carry logic for fast arithmetic and four global clock nets for synchronized peripheral timing domains.

Reconfigurable Digital Signal Processing Hot-Swappable Compact PCI Module

Use Scenario: Adaptive filtering and FFT processing in radar front-end where algorithm parameters change dynamically during operation.

IC Role / Device Role / Timing Role: Configurable logic platform executing parameterized DSP kernels with real-time partial reconfiguration via SelectMAP™ mode.

Use Value: Leverages 114,688-bit block RAM for coefficient storage and LUT-based 16-bit shift registers for pipeline capture of high-speed ADC data streams.

Use Scenario: Modular telecom line card supporting field-replaceable function cards without powering down the backplane.

IC Role / Device Role / Timing Role: XCV800-6BG432C provides hot-swap controller logic, power sequencing, and I²C management alongside user-defined payload logic.

Use Value: Built-in IEEE 1149.1 boundary scan and DLL-controlled I/O timing ensure safe insertion/removal while maintaining signal integrity during transition states.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV800-6FG676C Same logic density and speed grade but in 676-ball Fine-Pitch BGA with 444 user I/O pins Requires PCB redesign due to larger footprint and higher I/O count; suited for designs needing >316 I/O Select when additional I/O bandwidth or board-level routing flexibility is required beyond BG432 limits
XCV600-6BG432C Lower density (661,111 gates), same BG432 package and pinout, identical I/O count and DLL count Direct drop-in replacement for cost-sensitive or lower-complexity designs with unchanged PCB layout Choose when design fits within 15,552 logic cells and does not require XCV800's extra block RAM or CLB resources

Compared with XCV800-6BG432C, XCV800-6FG676C offers greater I/O scalability at the expense of board space, while XCV600-6BG432C provides pin-compatible migration path with reduced gate count and memory - enabling hardware reuse without layout changes.

Availability

XCV800-6BG432C is available at Aetrix Electronics and suitable for high-reliability industrial controllers, PCI-based test equipment, and reconfigurable communications infrastructure requiring stable component supply throughout extended product lifecycles.

Supply support for XCV800-6BG432C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and design toolchains widely adopted in aerospace, defense, and telecommunications.

The Virtex family - including XCV800-6BG432C - was engineered for high-performance system integration, targeting applications demanding high gate count, multi-standard I/O, and deterministic clock management in 2.5 V systems.

FAQ

What is the maximum operating frequency of the XCV800-6BG432C?

The XCV800-6BG432C achieves synchronous system clock rates up to 200 MHz, including I/O timing, under worst-case conditions (2.5 V, 85°C, speed grade -6). This performance is validated across register-to-register paths and supported by DLL compensation for clock skew. Actual achievable frequency depends on design placement and routing, but representative circuits like pipelined multipliers and address decoders meet sub-6 ns delays per DS003-1.

Does the XCV800-6BG432C support hot-swap functionality?

Yes, the XCV800-6BG432C supports hot-swapping for Compact PCI applications. Its I/O structure, combined with DLL-controlled timing and IEEE 1149.1 boundary scan, ensures safe insertion and removal while powered. The device complies with Compact PCI hot-swap specifications, including controlled power sequencing and signal integrity during transition states.

How many block RAMs does the XCV800-6BG432C contain?

The XCV800-6BG432C contains 28 block SelectRAM memory units, each providing 4,096 bits of synchronous dual-ported RAM, totaling 114,688 bits. These blocks support independent read/write operations on two ports with configurable data widths (1–16 bits) and depths (256–4096), enabling efficient FIFOs, coefficient tables, and buffer memory in DSP and communications designs.

What I/O standards are supported by the XCV800-6BG432C?

The XCV800-6BG432C supports 16 SelectIO™ standards including LVTTL (5 V tolerant), HSTL Class IV (200 MHz), SSTL3 Class I/II, LVCMOS2, PCI 3.3 V, GTL, GTL+, and CTT. Each I/O bank requires uniform VCCO and - where needed - a shared VREF voltage. Compatibility is governed by Table 2 in DS003-2, with GTL/GTL+ usable across all VCCO voltages due to open-drain outputs.

Is the XCV800-6BG432C still in production?

No, the XCV800-6BG432C is obsolete. Per DS003-1 (v4.0) dated March 1, 2013, all Virtex devices listed in that datasheet - including XCV800-6BG432C - are marked "Product Obsolete/Under Obsolescence." Xilinx issued discontinuation notice XCN10016. Aetrix Electronics maintains limited legacy inventory with full traceability and supports lifecycle management for existing designs.

XCV800-6BG432C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
432-LBGA Exposed Pad, Metal
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
4704
Number of Logic Elements/Cells:
21168
Total RAM Bits:
114688
Number of I/O:
316
Number of Gates:
888439
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
432-MBGA (40x40)

XCV800-6BG432C FAQ

1.How can I place an order for XCV800-6BG432C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV800-6BG432C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV800-6BG432C reliable?

The price and inventory of XCV800-6BG432C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV800-6BG432C is usually 5 days.

3.What payment methods are accepted for XCV800-6BG432C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV800-6BG432C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV800-6BG432C?

XCV800-6BG432C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV800-6BG432C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV800-6BG432C?

For technical support, including XCV800-6BG432C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV800-6BG432C requirements.

6.How does Aetrix verify that XCV800-6BG432C is sourced from the original manufacturer or authorized distributors?

All XCV800-6BG432C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV800-6BG432C meets industry standards.

7.What is the process for return or replacement of XCV800-6BG432C?

All XCV800-6BG432C units undergo pre-shipment inspection (PSI). If there is an issue with XCV800-6BG432C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV800-6BG432C part is unused and in its original packaging.

Return procedure for XCV800-6BG432C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV800-6BG432C Tags

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