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AMD XCV800-6BG560C
- Part No.:
- XCV800-6BG560C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 560-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV800-6BG560C.pdf
- Description:
- IC FPGA 404 I/O 560MBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,245
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Product details
Overview
XCV800-6BG560C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 888,439 system gates, 21,168 logic cells in a 56×84 CLB array, and 512 user I/O pins in a 560-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory including 114,688 bits of block SelectRAM and LUT-based RAM/shift register modes, and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.
For engineers reviewing the XCV800-6BG560C datasheet, pinout, applications, or equivalent options, key selection considerations include its -6 speed grade (200 MHz system performance), BG560 package I/O count and thermal profile, dual-port block RAM configuration flexibility, SelectIO™ interface standard compatibility (LVTTL, HSTL, SSTL), and DLL-based clock management for low-jitter global timing distribution.
Technical Context
The XCV800-6BG560C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets plus four global low-skew clock networks, and VersaRing™ I/O routing for enhanced pin-locking. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and BUFTs for internal 3-state bus driving.
Each IOB supports independent input/output flip-flops with configurable synchronous/asynchronous set/reset, programmable slew rate and drive strength (up to 24 mA source / 48 mA sink), and IEEE 1149.1 boundary-scan. I/O banking enforces VCCO and VREF voltage grouping across eight banks, restricting mixed-standard usage within each bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 888,439 - defines total logic capacity for complex digital system implementation |
| Logic Cells | 21,168 - provides granular, place-and-route efficient resources for RTL synthesis |
| User I/O Pins | 512 - enables high-pin-count interfaces including PCI, DDR, and multi-bank memory controllers |
| Block RAM Bits | 114,688 - supports dual-port, variable-width (1–16 bit) synchronous memory blocks up to 4k × 16 |
| Speed Grade | -6 - guarantees 200 MHz system clock performance with worst-case timing closure |
| DLL Count | 4 - delivers advanced clock deskew, phase alignment, and jitter reduction across multiple domains |
| Process Technology | 0.22 μm 5-layer metal CMOS - enables high density and performance with verified silicon efficiency |
Pinout & Package
The XCV800-6BG560C is housed in a 560-ball fine-pitch Ball Grid Array (FBGA) package with 35 mm × 35 mm body size, 1.27 mm ball pitch, and Pb-free (RoHS-compliant) finish. Pinout follows Xilinx DS003-4 Module 4, with dedicated power/ground balls distributed across all eight I/O banks, four global clock inputs (GCLK0–GCLK3), and bank-specific VCCO/VREF pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Primary low-skew clock entry points feeding four independent DLLs and global clock trees |
| VCCO_0–VCCO_7 | I/O Bank Supply | Eight independent VCCO rails enabling mixed-voltage I/O (e.g., 3.3 V LVTTL + 1.5 V HSTL) across banks |
| VREF_0–VREF_7 | I/O Threshold Reference | Bank-specific reference voltages required for SSTL/HSTL/GTL input standards |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1 test access port supporting configuration, debug, and production testing |
| CCLK/INIT_DONE/PROGRAM_B | Configuration Control | Master serial configuration clock, initialization status flag, and active-low reconfiguration trigger |
| VRP/VRN | Differential Reference | Dedicated pins for differential I/O standards requiring precise termination references |
Key Features
| Feature | Design Value |
|---|---|
| Four DLLs | Enables zero hold-time clock domain crossing, dynamic phase shifting, and jitter attenuation for multi-clock systems |
| Configurable LUT RAM | Each 4-input LUT operates as 16×1-bit RAM, 16×2-bit RAM, 32×1-bit RAM, or 16-bit shift register - ideal for FIFOs and DSP data capture |
| Dual-Port Block RAM | 4k-bit synchronous dual-port RAM blocks with independent address/data buses per port - supports true read-while-write and bus-width conversion |
| SelectIO™ Interface | Supports 16 I/O standards including LVTTL, SSTL2/3, HSTL I/III/IV, GTL+, and PCI - eliminates level-shifter components |
| Carry Chain Arithmetic | Dedicated fast-carry logic per CLB slice enables high-speed adders, counters, and accumulators without LUT resource consumption |
Applications
| High-Speed Communications Backplane | PCI/PCI-X Bridge Logic |
|---|---|
Use Scenario: Implementing protocol translation, packet buffering, and error correction between 66-MHz PCI-X peripherals and custom ASICs in telecom line cards. IC Role / Device Role / Timing Role: Configurable interconnect fabric with deterministic latency, synchronized via DLL-managed clocks to meet PCI-X setup/hold requirements. Use Value: Eliminates need for discrete glue logic and external FIFOs by integrating 114,688 bits of dual-port block RAM and 512 I/Os with HSTL Class IV support for 200 MHz backplane signaling. | Use Scenario: Serving as a host-to-peripheral bridge in industrial control chassis supporting hot-pluggable I/O modules compliant with Compact PCI specifications. IC Role / Device Role / Timing Role: Reconfigurable interface controller managing arbitration, address decoding, and burst transfers while meeting PCI 66-MHz timing and hot-swap sequencing requirements. Use Value: Leverages built-in 66-MHz PCI compliance, DLL-controlled clock domain isolation, and IEEE 1149.1 boundary scan for in-system validation and field firmware updates. |
| Multi-Standard Memory Controller | DSP Acceleration Co-Processor |
Use Scenario: Managing concurrent access to SDRAM, SSRAM, and QDR SRAM in radar signal processing subsystems requiring low-latency memory arbitration. IC Role / Device Role / Timing Role: Programmable memory interface engine with banked I/O, per-bank VCCO/VREF control, and DLL-synchronized strobes for multi-standard timing compliance. Use Value: Uses 512 I/Os across eight voltage-isolated banks to simultaneously drive SSTL3 (SDRAM), HSTL Class IV (QDR), and LVTTL (SSRAM) interfaces without level shifters. | Use Scenario: Offloading FFT, FIR filtering, and matrix operations from a host processor in software-defined radio baseband units. IC Role / Device Role / Timing Role: Hardware-accelerated compute fabric using distributed LUT RAM for coefficient storage and dedicated carry chains for parallel arithmetic pipelines. Use Value: Achieves >100 MHz sustained MAC throughput using 21,168 logic cells, 16-bit shift registers for data capture, and block RAM for coefficient tables - reducing host CPU load by 70%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV800-6FG680C | Same logic capacity and speed grade, but 680-ball FBGA package with 512 I/Os and larger footprint (27 mm × 27 mm vs. 35 mm × 35 mm) | Higher I/O density and improved thermal dissipation; suited for space-constrained PCBs with tighter routing layers | Select when board layout requires finer pitch and lower inductance interconnects, accepting higher assembly cost and rework complexity |
| XCV1000-6BG560C | 1,124,022 system gates (+26%), same BG560 package and pinout, but higher logic density and 131,072 block RAM bits | Enables larger designs without PCB redesign; compatible with existing BG560 footprint and thermal management | Choose for design scalability where future feature expansion is anticipated, leveraging identical mechanical and thermal interface |
Compared with XCV800-6BG560C, XCV800-6FG680C offers identical logic and timing but superior I/O density in a smaller area, while XCV1000-6BG560C provides direct pin-compatible upgrade path with 26% more gates and 14% more block RAM - both preserving core system architecture without layout changes.
Availability
XCV800-6BG560C is available at Aetrix Electronics and suitable for high-reliability communications infrastructure, industrial control backplanes, and legacy military/aerospace avionics requiring stable component supply and long-term obsolescence mitigation.
Supply support for XCV800-6BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and design toolchains widely adopted in high-performance computing and communications.
The Virtex family was engineered as Xilinx's flagship high-end FPGA platform targeting bandwidth-intensive applications such as wired/wireless infrastructure, defense radar, and scientific instrumentation - emphasizing clock integrity, memory bandwidth, and I/O flexibility.
FAQ
Is XCV800-6BG560C still in production or supported for new designs?
XCV800-6BG560C is marked obsolete per Xilinx documentation (DS003-1 v4.0, March 2013) and no longer manufactured. However, Aetrix Electronics maintains verified legacy inventory with full traceability and offers engineering support, extended lifecycle coordination, and obsolescence mitigation planning for ongoing production programs relying on the XCV800-6BG560C.
What development tools are required to program XCV800-6BG560C?
XCV800-6BG560C requires Xilinx Foundation Series or Alliance Series design tools (v3.1 or later), which provide schematic/behavioral entry, synthesis, place-and-route, and bitstream generation. Configuration is performed via JTAG, SelectMAP™, or master serial mode using PROMs. Legacy tool support remains available through Aetrix's engineering resources for XCV800-6BG560C projects.
Does XCV800-6BG560C support hot-swap functionality in Compact PCI systems?
Yes, XCV800-6BG560C is explicitly designed for hot-swappable Compact PCI applications. Its I/O structure, power-up sequencing, and configuration architecture comply with PICMG 2.1 hot-swap specifications. The device supports controlled power-rail ramp rates, hot-insertion detection via dedicated pins, and glitch-free reconfiguration - all validated in Xilinx DS003-1 Section "Hot-swappable for Compact PCI".
Can XCV800-6BG560C interface directly with 3.3 V PCI slots without level shifters?
Yes, XCV800-6BG560C supports 3.3 V PCI signaling natively via its SelectIO™ I/O buffers configured for PCI 3.3 V standard. Each I/O bank can be powered with 3.3 V VCCO, and the IOBs meet PCI electrical specifications for drive strength, slew rate, and input thresholds - eliminating external level-shifting components when interfacing with standard 3.3 V PCI slots.
What is the maximum operating junction temperature for XCV800-6BG560C?
The XCV800-6BG560C has a commercial temperature range of 0°C to +85°C (TJ). Its thermal characteristics are defined for BG560 package operation under specified airflow and PCB copper pour conditions. The die-integrated temperature sensor diode allows real-time monitoring, and thermal derating guidelines are provided in Xilinx DS003-3 Module 3 for sustained operation near upper limits.
XCV800-6BG560C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 560-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4704
- Number of Logic Elements/Cells:
- 21168
- Total RAM Bits:
- 114688
- Number of I/O:
- 404
- Number of Gates:
- 888439
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 560-MBGA (42.5x42.5)
XCV800-6BG560C FAQ
1.How can I place an order for XCV800-6BG560C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV800-6BG560C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV800-6BG560C reliable?
The price and inventory of XCV800-6BG560C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV800-6BG560C is usually 5 days.
3.What payment methods are accepted for XCV800-6BG560C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV800-6BG560C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV800-6BG560C?
XCV800-6BG560C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV800-6BG560C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV800-6BG560C?
For technical support, including XCV800-6BG560C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV800-6BG560C requirements.
6.How does Aetrix verify that XCV800-6BG560C is sourced from the original manufacturer or authorized distributors?
All XCV800-6BG560C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV800-6BG560C meets industry standards.
7.What is the process for return or replacement of XCV800-6BG560C?
All XCV800-6BG560C units undergo pre-shipment inspection (PSI). If there is an issue with XCV800-6BG560C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV800-6BG560C part is unused and in its original packaging.
Return procedure for XCV800-6BG560C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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