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AMD XCV800-6FG676C
- Part No.:
- XCV800-6FG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XCV800-6FG676C.pdf
- Description:
- IC FPGA 444 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,701
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Product details
Overview
XCV800-6FG676C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 888,439 system gates, 21,168 logic cells in a 56×84 CLB array, and 512 user I/O pins in a 676-ball fine-pitch BGA package. It integrates four delay-locked loops (DLLs), 28 block RAMs totaling 114,688 bits, and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.
For engineers reviewing the XCV800-6FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include its 200 MHz system performance ceiling, dual-port 4k-bit synchronous block RAM configuration, SelectIO™ interface support across 16 standards, and compatibility with FPGA Foundation™ and Alliance development tools.
Technical Context
The XCV800-6FG676C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain four logic cells each-each with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift register-and dedicated carry logic for high-speed arithmetic.
Each IOB supports programmable input/output standards including LVTTL, LVCMOS2, SSTL3, HSTL Class IV, and GTL+, with independent VCCO per I/O bank and optional VREF for threshold-sensitive inputs. The device features IEEE 1149.1 boundary-scan logic, die-temperature sensor diode, and SRAM-based in-system reprogrammability across four configuration modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 888,439 - defines total logic capacity for complex digital system implementation |
| Logic Cells | 21,168 - provides granular, place-and-route-efficient resources for RTL synthesis |
| User I/O Pins | 512 - enables high-pin-count interface consolidation in telecom and datacom systems |
| Block RAM Bits | 114,688 - delivered via 28 × 4,096-bit dual-ported synchronous RAM blocks for FIFO/buffering |
| Max System Frequency | 200 MHz - achievable synchronous clock rate including I/O timing closure |
| PCI Compliance | 66-MHz PCI - meets timing and signaling requirements for peripheral interconnect in embedded computing |
| Speed Grade | -6 - specifies worst-case timing performance at commercial temperature range (0°C to +85°C) |
| Supply Voltage | 2.5 V core / 3.3 V or 2.5 V I/O - requires separate VCCINT and VCCO rails for mixed-signaling designs |
Pinout & Package
Package: Fine-pitch Ball Grid Array (FG676) with 676 solder balls, 27 mm × 27 mm body size, 1.0 mm ball pitch, and commercial temperature rating (0°C to +85°C). Pinout conforms to Xilinx DS003-4 (v4.0) Module 4 - Pinout Tables.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Dedicated low-skew inputs feeding four DLLs; essential for multi-domain clock management |
| PROGRAM_B | Configuration Initiate | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| INIT_B | Configuration Status | Open-drain output indicating configuration completion or error during bitstream loading |
| CCLK | Configuration Clock | Input clock for master serial mode; drives internal configuration logic at up to 20 MHz |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan | IEEE 1149.1-compliant test access port for programming, debugging, and board-level verification |
| VCCINT | Core Power Supply | 2.5 V supply for CLB, RAM, and routing logic; requires tight regulation and local decoupling |
| VCCO_0–VCCO_7 | I/O Bank Power | Eight independent VCCO rails supporting mixed-voltage I/O standards across eight banks |
| VREF_0–VREF_7 | I/O Threshold Reference | Bank-specific reference voltage inputs for SSTL/HSTL/GTL standards; must be externally supplied |
Key Features
| Feature | Design Value |
|---|---|
| Four DLLs | Enables zero-hold-time I/O paths, phase alignment across clock domains, and jitter reduction in high-speed interfaces |
| SelectIO™ Interface | Supports 16 I/O standards-including HSTL Class IV (200 MHz) and SSTL3-with per-bank VCCO/VREF control |
| Distributed LUT RAM | LUTs configurable as 16-bit synchronous RAM or 16-bit shift register-ideal for pipeline staging and DSP buffering |
| Block SelectRAM | 28 × 4,096-bit dual-ported RAM blocks with independent address/data widths per port for flexible bus bridging |
| Carry Chain Logic | Dedicated fast-carry path per CLB slice enables efficient arithmetic (adders, counters) without LUT resource penalty |
| Boundary Scan | Full IEEE 1149.1 compliance enables in-circuit test, debug visibility, and JTAG-based configuration programming |
Applications
| Telecom Line Card | Data Center Switch Fabric |
|---|---|
Use Scenario: High-density packet classification and header modification in OC-192/STM-64 line cards. IC Role / Device Role / Timing Role: Configurable protocol processor handling multiple SerDes lanes, MAC offload, and QoS scheduling logic. Use Value: 512 I/O and 200 MHz system clock enable concurrent 10-Gbps PHY interfacing and real-time traffic shaping. |
Use Scenario: Reconfigurable switching matrix for 40G/100G Ethernet aggregation in modular chassis switches. IC Role / Device Role / Timing Role: Programmable crossbar controller managing buffer arbitration, flow control, and link training state machines. Use Value: Dual-port block RAMs provide deep packet buffering; DLLs synchronize multi-lane SerDes recovery clocks. |
| Industrial Motion Controller | Medical Imaging Backend |
Use Scenario: Real-time closed-loop servo control with synchronized analog acquisition and PWM generation. IC Role / Device Role / Timing Role: Deterministic logic fabric executing PID loops, encoder interpolation, and safety monitoring in <1 µs latency. Use Value: Dedicated carry chains accelerate position calculation; 2.5 V core reduces power in thermally constrained enclosures. |
Use Scenario: Pipeline-accelerated image reconstruction in CT/MRI systems using iterative algorithms. IC Role / Device Role / Timing Role: Hardware-accelerated backprojection engine processing raw detector data streams at >1 GSample/s. Use Value: 114,688 block RAM bits store intermediate sinogram buffers; LUT shift registers capture burst-mode ADC samples. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV800-6BG560C | Same logic density and speed grade but in 560-ball BGA (BG560); 404 max I/O vs. 512 in FG676 | Lower I/O count limits interface scalability; preferred only when PCB space constraints favor smaller footprint | Select XCV800-6BG560C only if board layout requires reduced package area and I/O count reduction is acceptable. |
| XCV1000-6FG676C | Higher density (1.12M gates), same FG676 package and 512 I/O, but larger CLB array (64×96) and 32 block RAMs | Enables larger designs without changing PCB; requires higher power and more stringent thermal design | Choose XCV1000-6FG676C when future-proofing for logic growth or adding co-processing functions within same footprint. |
Compared with XCV800-6FG676C, XCV800-6BG560C trades I/O scalability for compactness, while XCV1000-6FG676C extends gate count and memory without altering pinout-making it a direct upgrade path for logic-intensive upgrades.
Availability
XCV800-6FG676C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging backend processing, and data center switch fabric applications requiring stable component supply amid obsolescence management.
Supply support for XCV800-6FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; headquartered in San Jose, CA, with global R&D and support infrastructure.
The Virtex family was designed as high-performance, high-capacity FPGAs targeting demanding applications in wired communications, compute acceleration, and real-time signal processing-emphasizing silicon efficiency via 0.22 μm 5-layer-metal CMOS.
FAQ
What does the "-6" speed grade indicate for the XCV800-6FG676C?
The "-6" speed grade in XCV800-6FG676C specifies worst-case timing performance under commercial temperature conditions (0°C to +85°C), guaranteeing setup/hold and propagation delays meet or exceed those defined in DS003-3 (v4.0) for all supported I/O standards and internal logic paths. This grade enables reliable 200 MHz system clock operation with margin for routing-induced skew.
Is the XCV800-6FG676C still in active production?
No-the XCV800-6FG676C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013), with end-of-life status confirmed in XCN10016. Aetrix Electronics provides legacy supply chain support, including verified surplus inventory, extended lifecycle coordination, and migration guidance to compatible Virtex-II or Kintex-7 alternatives where functionally appropriate.
How many block RAMs does the XCV800-6FG676C contain, and what are their configurations?
The XCV800-6FG676C contains 28 block SelectRAMs, each a fully synchronous dual-ported 4,096-bit memory. Each block supports independent data widths (1–16 bits) and depths (4096–256), enabling configurations such as 256×16, 512×8, or 1024×4 per port-critical for implementing FIFOs, frame buffers, and lookup tables in XCV800-6FG676C-based systems.
Can the XCV800-6FG676C support 5 V-tolerant I/O?
Yes-the XCV800-6FG676C supports 5 V-tolerant inputs for LVTTL, LVCMOS2, and PCI 5 V standards, implemented via on-die Zener-like clamping to ground. However, 5 V tolerance applies only to inputs; outputs are strictly 2.5 V or 3.3 V referenced and must not drive 5 V buses directly without level-shifting circuitry external to the XCV800-6FG676C.
What configuration modes does the XCV800-6FG676C support?
The XCV800-6FG676C supports four configuration modes: Master Serial (loads bitstream from external PROM), Slave Serial (bitstream driven by external controller), SelectMAP™ (8-bit parallel interface), and JTAG (boundary-scan programming via TDI/TDO). All modes use the same CCLK, PROGRAM_B, INIT_B, and DONE signals, with mode selected by M[2:0] pins at power-up-enabling flexible deployment in XCV800-6FG676C-based systems.
XCV800-6FG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4704
- Number of Logic Elements/Cells:
- 21168
- Total RAM Bits:
- 114688
- Number of I/O:
- 444
- Number of Gates:
- 888439
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XCV800-6FG676C FAQ
1.How can I place an order for XCV800-6FG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV800-6FG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV800-6FG676C reliable?
The price and inventory of XCV800-6FG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV800-6FG676C is usually 5 days.
3.What payment methods are accepted for XCV800-6FG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV800-6FG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV800-6FG676C?
XCV800-6FG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV800-6FG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV800-6FG676C?
For technical support, including XCV800-6FG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV800-6FG676C requirements.
6.How does Aetrix verify that XCV800-6FG676C is sourced from the original manufacturer or authorized distributors?
All XCV800-6FG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV800-6FG676C meets industry standards.
7.What is the process for return or replacement of XCV800-6FG676C?
All XCV800-6FG676C units undergo pre-shipment inspection (PSI). If there is an issue with XCV800-6FG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV800-6FG676C part is unused and in its original packaging.
Return procedure for XCV800-6FG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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