AMD XCV800-6FG680C
- Part No.:
- XCV800-6FG680C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 680-LBGA Exposed Pad
- Datasheet:
-
XCV800-6FG680C.pdf
- Description:
- IC FPGA 512 I/O 680FTEBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCV800-6FG680C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 888,439 system gates, 21,168 logic cells in a 56×84 CLB array, and 512 user I/O pins in a 680-ball Fine-pitch Ball Grid Array (FBGA) package. It features four delay-locked loops (DLLs), hierarchical memory (including 114,688 bits of block SelectRAM), and supports 66-MHz PCI-compliant interfaces for high-speed embedded control and digital signal processing applications.
For engineers reviewing the XCV800-6FG680C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex-6 to newer families - all grounded in DS003-1 (v4.0) and DS003-4 documentation.
Technical Context
The XCV800-6FG680C implements a hierarchical routing architecture with General Routing Matrix (GRM), VersaRing I/O ring, and dedicated horizontal bus lines per CLB row. Its CLBs contain four logic cells each, with dual-slice structure supporting 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, or 16-bit shift registers.
It uses eight I/O banks with independent VCCO and VREF supply domains; each bank supports mixed I/O standards only if sharing the same VCCO voltage (e.g., LVTTL and PCI at 3.3 V), and input standards requiring VREF (e.g., HSTL Class I) must share one VREF per bank. The device includes die-temperature sensor diode and IEEE 1149.1 boundary-scan logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 888,439 - defines total logic capacity for complex state machines and datapaths |
| Logic Cells | 21,168 - provides granular, place-and-route-efficient implementation of synchronous logic |
| User I/O Pins | 512 - enables high-pin-count interface consolidation (e.g., parallel memory buses, multi-channel ADC/DAC) |
| Block RAM Bits | 114,688 - supports dual-port 4k×16-bit RAM blocks for FIFOs, buffers, and coefficient storage |
| Speed Grade | -6 - guarantees worst-case register-to-register delay ≤ 5.0 ns and 200 MHz system clock operation |
| Supply Voltage | 2.5 V core / 3.3 V I/O - requires separate power domains and decoupling for noise-sensitive high-speed signaling |
| Package | FG680 - 680-ball fine-pitch BGA with 1.0 mm ball pitch; supports thermal dissipation up to 2.5 W typical |
Pinout & Package
Package: FG680 - 680-ball Fine-pitch Ball Grid Array (1.0 mm pitch), commercial temperature range (0°C to +85°C), 2.5 V core supply.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Dedicated global clock inputs | Low-skew entry points for primary clocks feeding four DLLs; require external termination and controlled impedance routing |
| VCCO_0–VCCO_7 | I/O bank power supplies | Eight independent VCCO pins - each powers one I/O bank; must be set to match output standard (e.g., 3.3 V for LVTTL) |
| VREF_0–VREF_7 | I/O bank reference voltages | Eight VREF inputs - each sets threshold for input standards like HSTL or SSTL; internally tied within bank |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | IEEE 1149.1-compliant test access port; used for configuration, debugging, and in-system verification |
| CCLK/INIT_DONE/PROGRAM_B | Configuration control signals | Master clock input, configuration status flag, and active-low reconfiguration trigger - critical for reliable bitstream loading |
Key Features
| Feature | Design Value |
|---|---|
| Four DLLs | Enables zero hold-time clock domain crossing and phase-aligned clock distribution across large designs |
| Configurable LUTs as RAM/Shift Register | Each 4-LUT can serve as 16×1-bit synchronous RAM or 16-bit shift register - eliminates need for external FIFOs in data capture |
| Dual-ported 4k-bit Block RAM | 32 × 4096-bit blocks support simultaneous read/write on independent ports - ideal for ping-pong buffering and FFT engines |
| SelectIO™ Interface Support | 16 I/O standards including LVTTL, HSTL Class IV, and SSTL2 - allows direct interfacing to DDR SDRAM, ZBT RAM, and PCI peripherals |
| Dedicated Carry Logic | Two per CLB with two-bit height carry chain - accelerates arithmetic pipelines and wide adders without LUT resource penalty |
Applications
| High-Speed Data Acquisition | PCI-Based Industrial Controller |
|---|---|
Use Scenario: Simultaneous sampling of 32-channel 14-bit ADCs at 100 MSPS with real-time histogramming and trigger logic. IC Role / Device Role / Timing Role: FPGA acts as deterministic front-end processor, using CLB-based counters and block RAM for histogram storage; DLLs synchronize ADC clock and sample strobes. Use Value: 512 I/O pins accommodate parallel ADC bus + trigger/control lines; -6 speed grade ensures sub-5 ns setup/hold timing closure. | Use Scenario: Real-time motion control board with 6-axis servo interface, encoder feedback, and host communication via 66-MHz 32-bit PCI slot. IC Role / Device Role / Timing Role: XCV800-6FG680C serves as PCI target interface and motion trajectory generator; implements PCI transaction layer and position interpolation logic. Use Value: Native 66-MHz PCI compliance eliminates external bridge IC; 21,168 logic cells host dual-core soft processors plus custom IP. |
| Telecom Line Card Interface | Reconfigurable Digital Signal Processor |
Use Scenario: TDM-over-IP gateway card aggregating 64 E1/T1 streams with CAS/CCS signaling and HDLC framing. IC Role / Device Role / Timing Role: FPGA performs time-slot assignment, HDLC CRC generation, and Jitter attenuation using DLL-based clock cleanup. Use Value: Eight I/O banks allow mixed 3.3 V LVTTL (for microcontroller) and 2.5 V SSTL2 (for SDRAM buffer) on same device; 114,688 block RAM bits store frame buffers. | Use Scenario: Adaptive filter platform for echo cancellation in VoIP gateways, reconfigured daily for new acoustic profiles. IC Role / Device Role / Timing Role: Configurable datapath implementing 128-tap FIR filter with coefficient RAM updated via JTAG; LUTs used as distributed memory for tap weights. Use Value: SRAM-based in-system reprogramming enables field updates without hardware change; 4-LUT-as-RAM mode reduces logic utilization by 35% vs. register-based storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based programmable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV1000-6FG680C | 1.12M system gates, 27,648 logic cells, same FG680 package and -6 speed grade | Higher gate count supports larger soft-core CPU clusters or multi-channel video processing pipelines | Select when design exceeds XCV800 capacity but PCB layout and thermal envelope permit identical footprint |
| XCV600-6FG680C | 661K system gates, 15,552 logic cells, same FG680 package and -6 speed grade | Lower density reduces cost and static power; suitable for legacy migration where full XCV800 resources are unused | Choose for cost-sensitive industrial controllers where 21K logic cells are over-provisioned |
Compared with XCV800-6FG680C, the XCV1000-6FG680C offers 26% more logic and RAM for scalable architectures, while the XCV600-6FG680C trades 27% logic capacity for lower BOM cost and thermal load - both retain identical pinout, timing, and PCB compatibility.
Availability
XCV800-6FG680C is available at Aetrix Electronics and suitable for high-reliability industrial control, telecom infrastructure, and legacy military/aerospace systems requiring stable component supply and long-term obsolescence management.
Supply support for XCV800-6FG680C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.
The Virtex family - including XCV800-6FG680C - was engineered for high-performance, high-density system-on-chip integration in wired communications, test equipment, and digital signal processing applications demanding 200 MHz operation and advanced clock management.
FAQ
What is the maximum operating frequency supported by XCV800-6FG680C?
XCV800-6FG680C supports synchronous system clock rates up to 200 MHz, including I/O paths. This is guaranteed under worst-case timing conditions for the -6 speed grade, as validated by Xilinx's internal benchmarking of register-to-register paths (5.0 ns), pipelined multipliers (6.0 ns), and address decoders (4.4 ns). Actual performance depends on design placement and routing.
Does XCV800-6FG680C support hot-swapping in Compact PCI systems?
Yes, XCV800-6FG680C is explicitly designed for hot-swappable Compact PCI applications. Its I/O architecture meets Compact PCI hot-swap requirements, including controlled power-up sequencing and I/O pin behavior during insertion/removal. This capability is documented in DS003-1 (v4.0) Section "Features" and confirmed in the "Higher Performance" subsection.
How many block RAMs does XCV800-6FG680C contain, and what are their configurations?
XCV800-6FG680C contains 28 block SelectRAMs totaling 114,688 bits. Each block is a fully synchronous dual-ported 4096-bit RAM with independently configurable port widths (1–16 bits) and depths (4096–256), supporting true dual-port operation for applications like ping-pong buffering and coefficient storage in DSP pipelines.
What I/O standards are supported by XCV800-6FG680C, and how are they grouped?
XCV800-6FG680C supports 16 SelectIO™ standards including LVTTL, HSTL Class I/III/IV, SSTL2/3, GTL/GTL+, and PCI (3.3 V and 5 V tolerant). These are grouped into eight I/O banks - four per side - where each bank requires shared VCCO and VREF voltages. Compatible standards per bank are defined by VCCO level (e.g., 3.3 V banks support LVTTL, PCI, SSTL3).
Is XCV800-6FG680C still in production, and what is its obsolescence status?
XCV800-6FG680C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013), with end-of-life declared and no new manufacturing. Aetrix Electronics maintains legacy inventory with full traceability and offers lifecycle coordination support, including cross-reference guidance to Virtex-II Pro or Kintex-7 alternatives where functionally appropriate.
XCV800-6FG680C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 680-LBGA Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4704
- Number of Logic Elements/Cells:
- 21168
- Total RAM Bits:
- 114688
- Number of I/O:
- 512
- Number of Gates:
- 888439
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 680-FTEBGA (40x40)
XCV800-6FG680C FAQ
1.How can I place an order for XCV800-6FG680C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV800-6FG680C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV800-6FG680C reliable?
The price and inventory of XCV800-6FG680C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV800-6FG680C is usually 5 days.
3.What payment methods are accepted for XCV800-6FG680C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV800-6FG680C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV800-6FG680C?
XCV800-6FG680C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV800-6FG680C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV800-6FG680C?
For technical support, including XCV800-6FG680C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV800-6FG680C requirements.
6.How does Aetrix verify that XCV800-6FG680C is sourced from the original manufacturer or authorized distributors?
All XCV800-6FG680C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV800-6FG680C meets industry standards.
7.What is the process for return or replacement of XCV800-6FG680C?
All XCV800-6FG680C units undergo pre-shipment inspection (PSI). If there is an issue with XCV800-6FG680C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV800-6FG680C part is unused and in its original packaging.
Return procedure for XCV800-6FG680C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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