AMD XCV800-6HQ240C
- Part No.:
- XCV800-6HQ240C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 240-BFQFP Exposed Pad
- Datasheet:
-
XCV800-6HQ240C.pdf
- Description:
- IC FPGA 166 I/O 240QFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCV800-6HQ240C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) delivering 888,439 system gates in a 56×84 CLB array with 21,168 logic cells and 512 user I/O pins. It features four dedicated delay-locked loops (DLLs), hierarchical memory including 114,688 bits of block SelectRAM and LUT-based RAM/shift register modes, and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.
For engineers reviewing the XCV800-6HQ240C datasheet, pinout, applications, or equivalent options, this device serves as a high-density, high-speed programmable logic solution for legacy telecom infrastructure, industrial control systems, and reconfigurable computing platforms requiring deterministic clock management and multi-standard I/O interfacing.
Technical Context
The XCV800-6HQ240C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling efficient place-and-route for large synchronous designs. Its CLBs contain dual-slice logic cells with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and configurable storage elements supporting synchronous/asynchronous set/reset.
It integrates 28 block SelectRAMs (4,096-bit dual-ported synchronous RAM per block), each supporting independent port widths (1–16 bits) and depths (256–4096), plus LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift register. Four primary low-skew global clock nets and 24 secondary local clock nets distribute timing across the 56×84 CLB array.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 888,439 - defines total logic capacity for gate-equivalent synthesis targeting ASIC replacement or complex digital logic implementation. |
| CLB Array | 56 × 84 - determines maximum routable logic density and floorplanning granularity for hierarchical design partitioning. |
| Logic Cells | 21,168 - represents atomic programmable units each containing LUT, flip-flop, carry logic, and multiplexer resources. |
| Maximum User I/O | 512 - specifies number of bidirectional user-configurable pins available for interface bridging, protocol adaptation, or peripheral expansion. |
| Block RAM Bits | 114,688 - provides on-chip synchronous dual-port memory for FIFOs, buffers, coefficient tables, or state storage without external DRAM. |
| Speed Grade | -6 - guarantees worst-case timing performance up to 200 MHz system clock rate including I/O paths under commercial temperature conditions. |
| Package | HQ240 - 240-pin High Heat Dissipation Quad Flat Pack with 0.5 mm pitch, suitable for thermally demanding legacy industrial PCBs. |
Pinout & Package
HQ240 package: 240-pin plastic quad flat pack with exposed thermal pad, 27.0 mm × 27.0 mm body size, 0.5 mm lead pitch, and gull-wing leads. Designed for surface-mount assembly and moderate-power FPGA applications requiring mechanical robustness and thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Four dedicated low-skew inputs feeding primary clock distribution networks; essential for synchronous domain partitioning and jitter-sensitive timing closure. |
| IO_LxxN/IO_LxxP | User I/O Bank Pin | Differential or single-ended I/O pins grouped into eight voltage-isolated banks; each supports selectable standards (LVTTL, LVCMOS2, HSTL, SSTL) with shared VCCO/VREF per bank. |
| M0–M2 | Configuration Mode Select | Three-pin strap controlling startup configuration mode (Master Serial, Slave Serial, SelectMAP, JTAG); determines how bitstream loads at power-on. |
| CCLK | Configuration Clock | Output-only clock driving external PROM during Master Serial configuration; also used as user clock post-configuration if not repurposed. |
| DIN/DOUT | Serial Configuration Data | Asynchronous serial data path for bitstream loading in Master/Slave Serial modes; requires precise setup/hold relative to CCLK edge. |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port enabling in-system programming, verification, and debug without dedicated programming hardware. |
Key Features
| Feature | Design Value |
|---|---|
| Four DLLs | Enables zero-hold-time I/O timing, phase alignment across clock domains, and dynamic clock deskew - critical for source-synchronous interfaces like DDR or video capture. |
| SelectIO™ Interface | Supports 16 I/O standards (including 66-MHz PCI, HSTL Class IV, SSTL3) within eight isolated banks - allows mixed-voltage board-level integration without level shifters. |
| LUT-as-RAM/Shift Register | Each 4-input LUT configures as 16×1-bit RAM, 16×2-bit RAM, or 16-bit shift register - enables compact FIFOs, pipeline stages, or DSP data capture without consuming block RAM. |
| Dedicated Carry Logic | Two per CLB slice with cascaded chain - delivers sub-5 ns carry propagation for arithmetic-intensive functions like counters, accumulators, and FIR filters. |
| Configurable Storage Elements | Per-slice D-flip-flops/latches with independent clock enable, synchronous/asynchronous set/reset, and polarity control - supports precise timing control in state machines and control logic. |
Applications
| Telecom Line Card Processing | Industrial Motion Controller |
|---|---|
Use Scenario: Real-time packet classification and header modification in legacy TDM-over-IP gateway line cards. IC Role / Device Role / Timing Role: Configurable logic fabric implementing custom protocol engines, with DLLs synchronizing to 8 kHz framing clock and 66-MHz PCI bus. Use Value: Enables field-upgradable packet processing logic without hardware redesign; 512 I/O supports multiple E1/T1 interfaces and backplane connectivity. |
Use Scenario: Closed-loop servo control in CNC machine tool drives with encoder feedback and PWM output generation. IC Role / Device Role / Timing Role: Deterministic real-time controller executing position loop at 20 kHz using LUT-based arithmetic and block RAM for trajectory buffering. Use Value: Replaces ASIC-based motion ICs with reprogrammable logic; dual-port block RAM stores motion profiles while CLB carry chains ensure jitter-free PWM timing. |
| Reconfigurable Test Equipment | Avionics Data Concentrator |
Use Scenario: Modular ATE platform adapting to different DUT interfaces via downloadable bitstreams for signal conditioning and protocol translation. IC Role / Device Role / Timing Role: Multi-standard I/O hub translating between LVDS, HSTL, and LVTTL test vectors while managing timing calibration via DLL-adjusted strobes. Use Value: Eliminates fixed-function interface boards; SelectIO banking allows simultaneous 3.3 V and 2.5 V DUT testing on single PCB. |
Use Scenario: ARINC 429/664 data aggregation unit in regional aircraft flight control systems with deterministic latency requirements. IC Role / Device Role / Timing Role: Time-triggered communication controller implementing ARINC 429 transceivers and Ethernet MAC with guaranteed 10 μs end-to-end latency. Use Value: Meets DO-254 Level A design assurance via full traceability from VHDL to bitstream; die-temperature sensor diode enables thermal derating in sealed avionics enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV800-6BG256C | Same logic capacity and speed grade but in 256-ball BGA package; 180 user I/O vs. 512 in HQ240; no thermal pad; smaller footprint. | Suitable for space-constrained embedded systems where I/O count is secondary to board area; lacks HQ240's thermal dissipation capability. | Select when PCB real estate is limited and thermal load is low; verify pin compatibility - BG256 uses different ball map and I/O bank assignment. |
| XCV1000-6HQ240C | Higher density (1.12M gates), same HQ240 package and pinout; 27,648 logic cells; 131,072 block RAM bits; identical I/O count and DLL count. | Drop-in upgrade path for designs needing more logic or memory without changing PCB layout; requires updated bitstream and timing constraints. | Choose for forward-compatible designs where future feature expansion is anticipated; note increased power consumption and potential thermal derating. |
Compared with XCV800-6HQ240C, XCV800-6BG256C trades I/O count and thermal performance for compactness, while XCV1000-6HQ240C offers higher logic density in identical packaging - enabling scalable design reuse without board revision, provided power delivery and thermal management accommodate the increase.
Availability
XCV800-6HQ240C is available at Aetrix Electronics and suitable for legacy telecom infrastructure, industrial motion control, and reconfigurable test equipment requiring stable component supply and long-term obsolescence mitigation support.
Supply support for XCV800-6HQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; known for FPGA, SoC, and adaptive compute acceleration platforms.
The Virtex family was designed for high-performance, high-capacity reconfigurable logic in mission-critical systems - targeting applications demanding deterministic timing, multi-protocol I/O, and field-upgradable functionality without ASIC NRE costs.
FAQ
Is XCV800-6HQ240C still in production?
No, XCV800-6HQ240C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). It is no longer manufactured, but Aetrix Electronics maintains legacy inventory and offers obsolescence management services including cross-reference support, lifetime buy planning, and verified second-source alternatives for ongoing production needs.
What configuration modes does XCV800-6HQ240C support?
XCV800-6HQ240C supports four configuration modes: Master Serial (loads bitstream from external PROM), Slave Serial (bitstream loaded by external controller), SelectMAP (8- or 16-bit parallel loading), and JTAG (boundary-scan programming via TCK/TMS/TDI/TDO). Mode selection is controlled by M0–M2 pins at power-on reset.
Can XCV800-6HQ240C interface directly with 5 V logic?
Yes - XCV800-6HQ240C IOBs support 5 V-tolerant inputs for LVTTL, LVCMOS2, and PCI 5 V standards. However, outputs are 2.5 V nominal and require external level-shifting or bus-holding circuits for safe 5 V drive; VCCO must be set to 3.3 V for 5 V-tolerant operation, and VREF is not required for these standards.
What is the role of the die-temperature sensor diode in XCV800-6HQ240C?
The die-temperature sensor diode in XCV800-6HQ240C provides analog voltage output proportional to junction temperature, enabling real-time thermal monitoring via external ADC. It supports thermal derating in safety-critical applications and aids in validating cooling solutions during system validation - especially important given the HQ240 package's thermal characteristics.
Does XCV800-6HQ240C support partial reconfiguration?
No - XCV800-6HQ240C does not support partial reconfiguration. It uses SRAM-based configuration memory that requires full bitstream reload for any logic change. Partial reconfiguration was introduced in later Virtex-II Pro and Virtex-4 families; XCV800-6HQ240C requires complete reconfiguration for functional updates.
XCV800-6HQ240C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 240-BFQFP Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4704
- Number of Logic Elements/Cells:
- 21168
- Total RAM Bits:
- 114688
- Number of I/O:
- 166
- Number of Gates:
- 888439
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 240-PQFP (32x32)
XCV800-6HQ240C FAQ
1.How can I place an order for XCV800-6HQ240C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV800-6HQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV800-6HQ240C reliable?
The price and inventory of XCV800-6HQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV800-6HQ240C is usually 5 days.
3.What payment methods are accepted for XCV800-6HQ240C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV800-6HQ240C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV800-6HQ240C?
XCV800-6HQ240C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV800-6HQ240C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV800-6HQ240C?
For technical support, including XCV800-6HQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV800-6HQ240C requirements.
6.How does Aetrix verify that XCV800-6HQ240C is sourced from the original manufacturer or authorized distributors?
All XCV800-6HQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV800-6HQ240C meets industry standards.
7.What is the process for return or replacement of XCV800-6HQ240C?
All XCV800-6HQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV800-6HQ240C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV800-6HQ240C part is unused and in its original packaging.
Return procedure for XCV800-6HQ240C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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