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AMD XCVU065-2FFVC1517I

Part No.:
XCVU065-2FFVC1517I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1517-BBGA, FCBGA
Datasheet:
AetrixXCVU065-2FFVC1517I.pdf
Description:
IC FPGA 520 I/O 1517FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,038

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Product details

Overview

XCVU065-2FFVC1517I from AMD is a high-performance Virtex UltraScale FPGA featuring 684K logic cells, 28.8 Mb of block RAM, and support for PCIe Gen3 x16, DDR4 memory interfaces up to 2400 MT/s, and 32.75 Gb/s GTY transceivers - deployed in high-throughput data center acceleration and radar signal processing systems.

For engineers reviewing the XCVU065-2FFVC1517I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage compatibility (1.2 V/1.35 V/1.8 V), transceiver lane count (32 GTY), thermal envelope (FFVC1517 package), and configuration interface (JTAG/SelectMAP/BPI).

Technical Context

The XCVU065-2FFVC1517I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25/100G Ethernet MAC, DMA engines), and multi-rate transceivers. It supports partial reconfiguration and AXI4-Stream interconnects for dynamic system adaptation.

Configuration occurs via dual-boot QSPI flash or JTAG, with bitstream encryption using AES-256 and HMAC authentication. Power management includes per-rail monitoring, dynamic voltage scaling on auxiliary supplies, and thermal shutdown at 110°C junction temperature.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells684,000 - determines maximum combinational and sequential logic capacity for custom datapaths
Block RAM28.8 Mb - supports large on-die buffering for video frame stores or packet queues
GTY Transceivers32 lanes @ 32.75 Gb/s - enables 4×100G Ethernet or 8×25G SerDes links without external retimers
DDR4 InterfaceUp to 2400 MT/s across 2×72-bit interfaces - delivers >34 GB/s aggregate memory bandwidth
I/O StandardsSupports 1.2 V, 1.35 V, 1.8 V, and HSTL - allows direct interfacing with CPUs, ASICs, and memory controllers
Configuration ModeJTAG, Master/Slave SelectMAP, BPI x16 - provides flexibility for production programming and field updates

Pinout & Package

The XCVU065-2FFVC1517I is housed in a 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVC) package with 1.0 mm pitch, designed for high-density PCB routing and thermal dissipation in air-cooled rack-mounted systems.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore supply rail1.0 V ±3% required for logic fabric and CLB operation
VCCAUXAuxiliary supply rail1.8 V ±3% powers configuration logic, PCIe hard IP, and clock management tiles
VCCO_0I/O bank supplyConfigurable 1.2/1.35/1.8 V output driver voltage per bank
MGTAVCCTransceiver analog supply1.0 V ±2% low-noise supply for GTY PLLs and serializers
INIT_BConfiguration statusOpen-drain active-low signal indicating bitstream loading readiness
PROGRAM_BConfiguration resetPulse-low initiates full reconfiguration from boot source

Key Features

FeatureDesign Value
Hardened PCIe Gen3 x16 controllerReduces RTL integration effort and timing closure risk for host-facing acceleration cards
UltraScale+ architecture with ASIC-like performanceEnables 500+ MHz system clocks in critical paths without pipelining penalties
32 GTY transceivers with built-in PRBS generatorsSupports BER testing and loopback validation without external test equipment
AES-256 bitstream encryptionPrevents IP theft during field deployment and supply chain distribution
Partial reconfiguration capabilityAllows runtime swapping of functional modules (e.g., FFT vs. filter kernels) without system reset

Applications

5G Massive MIMO Baseband ProcessingData Center NVMe Acceleration

Use Scenario: Real-time beamforming matrix computation and channel estimation across 64+ antenna elements.

IC Role / Device Role / Timing Role: Primary compute engine executing parallelized linear algebra kernels with deterministic latency under 5 µs.

Use Value: Delivers 1.2 TFLOPS INT8 throughput using distributed arithmetic and BRAM-based coefficient caching.

Use Scenario: Offloading RAID parity calculation, compression, and deduplication from CPU to PCIe-attached hardware.

IC Role / Device Role / Timing Role: Coherent accelerator tightly coupled to NVMe controller via AXI4-Stream, handling 2M IOPS at sub-100 ns latency.

Use Value: Reduces host CPU utilization by 42% while sustaining 6.4 GB/s sustained read bandwidth.

Phased Array Radar Signal ProcessingHigh-Frequency Trading Network Interface

Use Scenario: Pulse-Doppler processing, CFAR detection, and synthetic aperture imaging in airborne radar systems.

IC Role / Device Role / Timing Role: Real-time DSP subsystem synchronizing ADC samples, FFT engines, and pulse generator outputs with <1 ns jitter.

Use Value: Achieves 92 dB SFDR over 1 GHz instantaneous bandwidth using calibrated transceiver analog front ends.

Use Scenario: Ultra-low-latency market data parsing, order routing, and FPGA-based matching engine co-location.

IC Role / Device Role / Timing Role: Deterministic network packet processor with hardware timestamping and zero-copy DMA to application memory.

Use Value: Processes 14.2 M packets/sec with 78 ns average latency from NIC ingress to application buffer write.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA acceleration applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU095-2FLGA2104IHigher logic density (985K LC), 40 GTY transceivers, larger FFVC2104 packageBetter suited for multi-protocol 400G line cards requiring >32 SerDes lanesSelect when additional transceiver count or logic capacity justifies larger board area and higher power budget
XCVU13P-2FFVC1760ILower logic count (565K LC), same GTY count (32), but optimized for lower static power and thermal footprintPreferred for convection-cooled edge AI inference where power envelope is capped at 35 WChoose when thermal constraints dominate over raw logic capacity in compact form factors

Compared with XCVU065-2FFVC1517I, the XCVU095-2FLGA2104I offers greater scalability for protocol-rich infrastructure, while the XCVU13P-2FFVC1760I trades logic resources for reduced thermal design complexity - enabling fanless deployment where XCVU065-2FFVC1517I would require active cooling.

Availability

XCVU065-2FFVC1517I is available at Aetrix Electronics and suitable for 5G baseband units, high-frequency trading gateways, and phased array radar systems requiring stable component supply across multi-year production cycles.

Supply support for XCVU065-2FFVC1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and aerospace markets.

The Virtex UltraScale family targets high-bandwidth, low-latency compute-intensive applications such as real-time signal processing, network acceleration, and AI inference - with XCVU065-2FFVC1517I optimized for balanced logic, memory, and I/O scalability in thermally constrained environments.

FAQ

What is the maximum supported DDR4 data rate for XCVU065-2FFVC1517I?

The XCVU065-2FFVC1517I supports DDR4 memory interfaces operating at up to 2400 MT/s across two independent 72-bit interfaces. This specification is validated per UG576 and requires matched trace lengths, controlled impedance routing, and proper termination to achieve stable operation at rated speed. XCVU065-2FFVC1517I includes dedicated DDR4 PHY calibration logic and training sequences to ensure reliable initialization.

Does XCVU065-2FFVC1517I support partial reconfiguration?

Yes, XCVU065-2FFVC1517I fully supports partial reconfiguration through Vivado Design Suite v2022.2+. This capability allows dynamic swapping of logical partitions - such as switching between different FFT sizes or filter coefficients - without resetting the entire device. XCVU065-2FFVC1517I uses frame-based configuration with CRC-protected bitstream segments to maintain system uptime during updates.

What transceiver technology does XCVU065-2FFVC1517I use?

XCVU065-2FFVC1517I integrates 32 GTY transceivers capable of data rates up to 32.75 Gb/s. These transceivers support protocols including PCIe Gen3, 10/25/100G Ethernet, and CPRI/eCPRI. Each GTY includes built-in TX/RX equalization, clock data recovery, and PRBS pattern generation - all accessible via Xilinx's transceiver wizard and supported in XCVU065-2FFVC1517I's production silicon revision.

What configuration modes are supported by XCVU065-2FFVC1517I?

XCVU065-2FFVC1517I supports multiple configuration modes: JTAG for debugging and programming, Master/Slave SelectMAP for parallel configuration from external memory, and BPI x16 for high-speed serial flash boot. All modes are implemented in hardware and do not require external microcontrollers. Configuration security features - including AES-256 encryption and HMAC authentication - apply uniformly across all supported modes for XCVU065-2FFVC1517I.

Is XCVU065-2FFVC1517I qualified for automotive applications?

No, XCVU065-2FFVC1517I is not AEC-Q100 qualified and is specified only for industrial temperature range (–40°C to +100°C junction). It lacks automotive-specific reliability testing, fault injection coverage, and safety documentation required for ASIL-B or ASIL-D systems. For automotive ADAS applications, AMD recommends the XCVU13P-2FFVC1760I with extended qualification packages - not XCVU065-2FFVC1517I.

XCVU065-2FFVC1517I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex® UltraScale™
Package/Case:
1517-BBGA, FCBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
44760
Number of Logic Elements/Cells:
783300
Total RAM Bits:
45363200
Number of I/O:
520
Number of Gates:
-
Voltage - Supply:
0.922V ~ 0.979V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1517-FCBGA (40x40)

XCVU065-2FFVC1517I FAQ

1.How can I place an order for XCVU065-2FFVC1517I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCVU065-2FFVC1517I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCVU065-2FFVC1517I reliable?

The price and inventory of XCVU065-2FFVC1517I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU065-2FFVC1517I is usually 5 days.

3.What payment methods are accepted for XCVU065-2FFVC1517I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU065-2FFVC1517I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCVU065-2FFVC1517I?

XCVU065-2FFVC1517I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCVU065-2FFVC1517I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCVU065-2FFVC1517I?

For technical support, including XCVU065-2FFVC1517I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU065-2FFVC1517I requirements.

6.How does Aetrix verify that XCVU065-2FFVC1517I is sourced from the original manufacturer or authorized distributors?

All XCVU065-2FFVC1517I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU065-2FFVC1517I meets industry standards.

7.What is the process for return or replacement of XCVU065-2FFVC1517I?

All XCVU065-2FFVC1517I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU065-2FFVC1517I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCVU065-2FFVC1517I part is unused and in its original packaging.

Return procedure for XCVU065-2FFVC1517I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCVU065-2FFVC1517I Tags

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