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AMD XCVU080-1FFVA2104I

Part No.:
XCVU080-1FFVA2104I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
2104-BBGA, FCBGA
Datasheet:
AetrixXCVU080-1FFVA2104I.pdf
Description:
IC FPGA 832 I/O 2104FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,721

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Product details

Overview

XCVU080-1FFVA2104I from AMD is a high-performance Virtex UltraScale FPGA featuring 826,500 logic cells, 4,032 DSP slices, and 72.5 Mb of block RAM. It supports PCIe Gen3 x16, 28.3 Gb/s transceivers, and operates at -1 speed grade with industrial temperature range (-40°C to +100°C). Used in radar signal processing systems requiring real-time FFT acceleration and deterministic latency.

For engineers reviewing the XCVU080-1FFVA2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, block RAM depth, DSP slice count, I/O voltage support (1.2V/1.35V/1.8V), and thermal performance under sustained 25W dynamic power.

Technical Context

The XCVU080-1FFVA2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3, 10/25/100G Ethernet MACs, and UltraScale+ memory controllers. Its transceivers support PAM4 and NRZ modulation with integrated clock data recovery.

It integrates dual ARM Cortex-A53 MPCore processors in the Zynq UltraScale+ MPSoC variant; however, XCVU080-1FFVA2104I is a pure FPGA without embedded processors. Configuration occurs via quad-SPI or BPI flash, with bitstream encryption and HMAC authentication enabled.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells826,500 - determines maximum combinational/sequential logic capacity for custom datapaths
DSP Slices4,032 - enables parallel execution of 27×18-bit multiply-accumulate operations per slice
Block RAM72.5 Mb - supports large on-chip buffering for video frame stores or packet buffers
Transceiver Max Rate28.3 Gb/s - meets IEEE 802.3bs 100GBASE-KR4 and CPRI Option 10 requirements
I/O StandardsLVDS, MIPI D-PHY, SSTL, HSTL, POD - enables direct interfacing to ADCs, FPGAs, and DDR4 memory
Speed Grade-1 - guarantees timing closure at 1.0 V core voltage with 85°C junction temperature derating
Operating Temp-40°C to +100°C - qualified for industrial and aerospace environments without forced cooling

Pinout & Package

Package: 2104-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) with 0.8 mm pitch, 42.5 mm × 42.5 mm body size, and thermal lid for enhanced heat dissipation.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore supply1.0 V ±3% input powering CLB, BRAM, and interconnect routing
VCCAUXAuxiliary supply1.8 V input for configuration logic, SelectIO, and transceiver analog circuitry
MGTAVCCTransceiver analog supply1.0 V dedicated rail for PLLs and CDR circuits in GTY transceivers
MRMaster resetActive-low asynchronous reset that clears configuration registers and halts startup sequence
CCLKConfiguration clockInput clock for slave serial configuration mode; frequency ≤ 50 MHz
INIT_BInitialization statusOpen-drain output indicating successful bitstream loading or CRC error detection

Key Features

FeatureDesign Value
UltraScale ArchitectureColumn-based routing with dedicated interconnect for predictable timing convergence in large designs
Hardened PCIe Gen3 x16Reduces RTL integration effort and eliminates PHY-level timing closure risk for host interface
28.3 Gb/s GTY TransceiversEnables single-lane 100G Ethernet without gearbox logic, lowering power per Gbps
Integrated Memory ControllerSupports DDR4-2400 with ECC and AXI4 interface, eliminating external controller IC
Bitstream Encryption256-bit AES key with HMAC authentication prevents unauthorized configuration and cloning

Applications

Radar Beamforming System5G Massive MIMO Baseband Unit

Use Scenario: Real-time adaptive beam steering using 128-channel digital down-conversion and matrix inversion.

IC Role / Device Role / Timing Role: Primary compute engine executing fixed-point FFTs and QR decomposition with sub-microsecond latency.

Use Value: 4,032 DSP slices enable concurrent processing of 64 independent antenna paths at 122.88 MSPS sample rate.

Use Scenario: Layer 1 baseband processing for 256-antenna gNodeB supporting 100 MHz channel bandwidth.

IC Role / Device Role / Timing Role: Front-haul interface processor handling eCPRI over 25G Ethernet and symbol-level precoding.

Use Value: 28.3 Gb/s GTY transceivers directly drive QSFP28 optical modules without retimers.

High-Energy Physics Trigger ProcessorAvionics Sensor Fusion Hub

Use Scenario: Online event filtering in particle collider detectors with <100 ns decision latency.

IC Role / Device Role / Timing Role: Deterministic-latency pattern matcher using deep pipelined LUTRAM and distributed RAM.

Use Value: -1 speed grade ensures worst-case path delay ≤ 1.8 ns across full temperature range.

Use Scenario: Time-synchronized fusion of inertial, GNSS, and vision sensor streams in fly-by-wire control loop.

IC Role / Device Role / Timing Role: Time-stamping and alignment engine with IEEE 1588 v2 hardware timestamping.

Use Value: Dedicated PTP timestamping logic achieves ±2 ns accuracy on 100 MHz reference clock.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU095-1FLGA2104I984,000 logic cells, 5,568 DSP slices, same FFVA2104 package but higher static powerBetter suited for larger FFT sizes and wider filter banks in wideband spectrum analyzersSelect when design exceeds 826K LC utilization or requires >4K DSP slices
XCVU125-1FLGA2104I1,283,000 logic cells, 6,912 DSP slices, identical I/O and transceiver specsTargeted at multi-protocol baseband stacks requiring simultaneous 5G NR + LTE + CBRS processingChoose when future-proofing for algorithm expansion beyond current XCVU080 capacity

Compared with XCVU080-1FFVA2104I, XCVU095-1FLGA2104I offers 19% more logic and 38% more DSP resources at higher static power, while XCVU125-1FLGA2104I adds 55% logic and 71% DSP capacity-both retain identical transceiver performance and I/O compatibility but require thermal redesign due to increased TDP.

Availability

XCVU080-1FFVA2104I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, high-energy physics trigger systems, and avionics sensor fusion requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XCVU080-1FFVA2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.

The Virtex UltraScale family targets high-throughput, low-latency applications such as wireless infrastructure, defense radar, and scientific instrumentation where deterministic timing and transceiver performance are critical.

FAQ

What is the maximum supported transceiver data rate for XCVU080-1FFVA2104I?

The XCVU080-1FFVA2104I supports GTY transceivers rated up to 28.3 Gb/s per lane. This enables compliance with 100G Ethernet (IEEE 802.3bs), CPRI Option 10, and OTU4 standards. The actual achievable rate depends on PCB stack-up, connector quality, and reference clock jitter below 500 fs RMS.

Does XCVU080-1FFVA2104I include embedded ARM processors?

No, XCVU080-1FFVA2104I is a pure FPGA without integrated ARM cores. It belongs to the Virtex UltraScale series-not the UltraScale+ MPSoC family. All processing must be implemented in programmable logic or offloaded to external processors via PCIe or AXI interfaces.

What configuration modes are supported by XCVU080-1FFVA2104I?

XCVU080-1FFVA2104I supports master SPI, slave serial, JTAG, and BPI configuration modes. Quad-SPI flash is most common for production deployment due to fast boot time and bitstream encryption support. Configuration is initiated automatically on power-up when mode pins are set to SPI mode.

Is XCVU080-1FFVA2104I qualified for automotive AEC-Q100?

No, XCVU080-1FFVA2104I is specified for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. For automotive applications, AMD offers the XCVU13P-2FSGA2104I in the Virtex UltraScale+ Automotive family with full AEC-Q100 Grade 2 qualification.

What is the total on-chip memory capacity of XCVU080-1FFVA2104I?

XCVU080-1FFVA2104I provides 72.5 Mb of block RAM, plus distributed RAM from LUTs and shift register functionality. Total usable memory depends on synthesis tool mapping, but block RAM alone supports up to 9,280 × 64K-bit memory instances or 18,560 × 32K-bit dual-port configurations.

XCVU080-1FFVA2104I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex® UltraScale™
Package/Case:
2104-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
55714
Number of Logic Elements/Cells:
975000
Total RAM Bits:
51200000
Number of I/O:
832
Number of Gates:
-
Voltage - Supply:
0.922V ~ 0.979V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
2104-FCBGA (47.5x47.5)

XCVU080-1FFVA2104I FAQ

1.How can I place an order for XCVU080-1FFVA2104I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCVU080-1FFVA2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCVU080-1FFVA2104I reliable?

The price and inventory of XCVU080-1FFVA2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU080-1FFVA2104I is usually 5 days.

3.What payment methods are accepted for XCVU080-1FFVA2104I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU080-1FFVA2104I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCVU080-1FFVA2104I?

XCVU080-1FFVA2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCVU080-1FFVA2104I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCVU080-1FFVA2104I?

For technical support, including XCVU080-1FFVA2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU080-1FFVA2104I requirements.

6.How does Aetrix verify that XCVU080-1FFVA2104I is sourced from the original manufacturer or authorized distributors?

All XCVU080-1FFVA2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU080-1FFVA2104I meets industry standards.

7.What is the process for return or replacement of XCVU080-1FFVA2104I?

All XCVU080-1FFVA2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU080-1FFVA2104I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCVU080-1FFVA2104I part is unused and in its original packaging.

Return procedure for XCVU080-1FFVA2104I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCVU080-1FFVA2104I Tags

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