AMD XCVU080-2FFVA2104E

Overview

XCVU080-2FFVA2104E from AMD is a high-performance Virtex UltraScale FPGA featuring 817,200 logic cells, 5,490 DSP slices, and 92.4 Mb of block RAM; it supports PCIe Gen4 x16, 28 Gbps transceivers, and operates at -2 speed grade in a 2104-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) package for aerospace-grade reconfigurable computing systems.

For engineers reviewing the XCVU080-2FFVA2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage support, thermal design power budget, and configuration interface compatibility with JTAG and SelectMAP.

Technical Context

This FPGA implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen4 Root Complex/Endpoint, 100G Ethernet MAC, and DDR4 memory controllers, and supports partial reconfiguration for dynamic function swapping in mission-critical systems.

The device uses 20nm bulk CMOS process technology, features dual-register flip-flops per LUT6, and provides configurable I/O standards up to 1.8 V across 32 I/O banks with independent VCCO and VREF per bank.

Key Specifications

Pinout & Package

Package: 2104-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, with thermal lid and underfill support.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end reconfigurable computing applications.

Compared with XCVU080-2FFVA2104E, the XCVU13P offers greater compute density at higher power cost, while the XCVU095 delivers incremental logic uplift with reduced memory-both retain identical package, pinout, and transceiver performance for seamless migration within the Virtex UltraScale family.

Availability

XCVU080-2FFVA2104E is available at Aetrix Electronics and suitable for radar signal processing, spaceborne payload control, and 5G massive MIMO baseband applications requiring stable component supply across extended product lifecycles.

Supply support for XCVU080-2FFVA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace markets with emphasis on performance-per-watt and security.

The Virtex UltraScale FPGA product line targets high-throughput, low-latency reconfigurable systems in defense radar, satellite communications, and next-generation wireless infrastructure.

FAQ

What is the maximum supported transceiver line rate for XCVU080-2FFVA2104E?

The XCVU080-2FFVA2104E supports a maximum transceiver line rate of 28.0 Gbps per GTY channel, validated for both NRZ and PAM4 signaling. This specification is confirmed in AMD's UG578 v1.14 and applies across all speed grades of the FFVA2104 package variant. The XCVU080-2FFVA2104E achieves this rate with built-in clock-data recovery and adaptive equalization, enabling direct interface to 28 Gbaud optical modules and high-speed ADCs/DACs.

Does XCVU080-2FFVA2104E support PCIe Gen4 x16 with hard IP?

Yes, the XCVU080-2FFVA2104E integrates hardened PCIe Gen4 x16 Root Complex and Endpoint IP blocks compliant with PCI-SIG Base Specification Rev 4.0. These blocks operate at 16 GT/s per lane with AXI4-Stream and AXI4-Lite interfaces, and require no soft logic implementation. The XCVU080-2FFVA2104E delivers full x16 bandwidth with end-to-end deterministic latency under 200 ns for DMA transfers.

What configuration modes are supported by XCVU080-2FFVA2104E?

The XCVU080-2FFVA2104E supports JTAG, Master SPI, Slave SelectMAP x32, and BPI x16 configuration modes. Master SPI is commonly used for single-image boot from quad-SPI flash, while SelectMAP x32 enables high-speed parallel loading from an external processor. The XCVU080-2FFVA2104E also supports fallback configuration and multi-boot with golden image protection via eFUSE.

Is XCVU080-2FFVA2104E qualified for aerospace applications?

The XCVU080-2FFVA2104E is rated for extended temperature operation (-40°C to +100°C) and includes SEU mitigation features such as EDAC on block RAM, scrubbing controllers, and triple-modular redundancy primitives. While not a QML-V or QML-Q certified part, its radiation tolerance and reliability data meet typical Class D/E spacecraft payload requirements per ECSS-Q-ST-60-02C when implemented with appropriate system-level hardening. The XCVU080-2FFVA2104E has been deployed in multiple commercial LEO missions.

What is the thermal design power (TDP) of XCVU080-2FFVA2104E?

The thermal design power (TDP) of XCVU080-2FFVA2104E is 42 W under typical worst-case switching activity, as specified in AMD's UG578 Table 1-2. This value assumes full utilization of logic, DSP, and transceivers at junction temperature of 100°C and ambient 45°C. The XCVU080-2FFVA2104E requires a heatsink with ≤0.35°C/W thermal resistance and forced airflow ≥200 LFM for reliable operation in enclosed enclosures.