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AMD XCVU080-2FFVB2104E
- Part No.:
- XCVU080-2FFVB2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU080-2FFVB2104E.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,198
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Product details
Overview
XCVU080-2FFVB2104E from AMD is a high-performance Virtex UltraScale FPGA featuring 826,500 logic cells, 3,795 DSP slices, and 59.5 Mb of block RAM. It supports PCIe Gen3 x16, 28.3 Gb/s transceivers, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). Used in radar signal processing and high-throughput data acquisition systems.
For engineers reviewing the XCVU080-2FFVB2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic cell count, thermal performance in air-cooled enclosures, and support for AXI4-Stream interfaces in real-time processing pipelines.
Technical Context
The XCVU080-2FFVB2104E implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen3, 10/25/100G Ethernet MAC), and ultra-fast serial transceivers. It integrates dual 32-bit DDR4 memory controllers supporting up to 2400 MT/s and includes clock management tiles with MMCM and PLL resources.
Configuration is performed via quad-SPI or BPI flash, JTAG, or SelectMAP interface. The device uses 16nm FinFET process technology and supports partial reconfiguration for dynamic function swapping in mission-critical systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 826,500 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 3,795 - enables parallel multiply-accumulate operations for radar FFTs and digital beamforming |
| Block RAM | 59.5 Mb - provides on-chip buffering for multi-channel ADC data streams without external memory latency |
| Transceiver Max Rate | 28.3 Gb/s - supports CPRI/eCPRI over single-lane optical links in 5G fronthaul applications |
| PCIe Interface | Gen3 x16 - delivers 16 GT/s bidirectional throughput for host-FPGA DMA transfers in compute-accelerated servers |
| Speed Grade | -2 - guarantees timing closure at 28.3 Gb/s with 100°C junction temperature under worst-case voltage variation |
| Operating Temp | -40°C to +100°C - qualified for deployment in uncooled outdoor base station enclosures and avionics bays |
Pinout & Package
Package: 2104-pin Flip-Chip Ball Grid Array (FFVB) with 0.8 mm pitch, thermally enhanced for high-power FPGA operation. Dimensions: 49.0 mm × 49.0 mm, 2.2 mm height.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V ±3% to FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration logic, PCIe block, and clock management tiles |
| HR_IO | High-range I/O bank | Supports 1.8 V/2.5 V/3.3 V LVCMOS, SSTL, HSTL, and differential standards up to 1.25 Gb/s |
| GTH Transceiver | Serial I/O lane | Each pair handles 28.3 Gb/s PAM4 or NRZ; requires controlled impedance PCB routing and AC coupling |
| MGTAVCC | Transceiver analog supply | 1.0 V ±2% analog rail for GTH transceiver PLLs and CDR circuits; sensitive to ripple & noise |
| CONFIG_IO | Configuration interface | Dedicated pins for JTAG TCK/TMS/TDI/TDO and mode selection (M0–M2) during power-up |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous integration | Combines programmable logic, hardened PCIe Gen3, 100G Ethernet MAC, and 28.3 Gb/s transceivers on single die for system-on-chip consolidation |
| Partial reconfiguration | Enables runtime swap of logic partitions without interrupting active functions-critical for adaptive radar waveform updates |
| UltraScale+ architecture | Delivers 1.5× higher logic density and 2× DSP throughput vs. 28nm Virtex-7, reducing board area in SWaP-constrained platforms |
| DDR4 memory controller | Dual 32-bit channels at 2400 MT/s with ECC support-eliminates need for external memory controller ASIC in data concentrators |
| Thermal design support | Thermally enhanced FFVB package with integrated heat slug enables conduction cooling in sealed chassis without forced airflow |
Applications
| Radar Signal Processing | 5G Massive MIMO Fronthaul |
|---|---|
Use Scenario: Real-time pulse-Doppler processing across 128 antenna elements with sub-microsecond latency. IC Role / Device Role / Timing Role: Primary compute engine executing beamforming, CFAR detection, and track-before-detect algorithms in hardware. Use Value: 826,500 logic cells and 3,795 DSP slices enable concurrent execution of 64 independent FFT chains at 100 MHz clock rate. | Use Scenario: Aggregation and serialization of 64x 2.4576 Gb/s eCPRI streams from remote radio units into 100G Ethernet uplink. IC Role / Device Role / Timing Role: Protocol bridging and deterministic packet scheduling unit with precise timestamp alignment. Use Value: 28.3 Gb/s transceivers and hardened 100G Ethernet MAC reduce PHY-layer latency by 42% versus discrete SerDes + MAC solutions. |
| High-Energy Physics DAQ | AI Accelerator Co-Processor |
Use Scenario: Trigger-level filtering of 400+ sensor channels in particle collision experiments, generating <10 μs decision latency. IC Role / Device Role / Timing Role: Real-time pattern matcher and data compressor using LUT-based finite state machines and Huffman encoding. Use Value: 59.5 Mb block RAM buffers full event window while logic fabric applies trigger algorithms without DRAM access delay. | Use Scenario: Offloading sparse matrix-vector multiplication from CPU/GPU in edge inference servers running vision transformer models. IC Role / Device Role / Timing Role: Custom accelerator tightly coupled to host CPU via PCIe Gen3 x16 with AXI4-Stream DMA interface. Use Value: PCIe Gen3 x16 bandwidth (16 GT/s) sustains 12.5 GB/s sustained transfer rate for weight streaming and feature map ingestion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FFVB2104E | 1,322,500 logic cells, 5,520 DSP slices, same package and transceiver spec | Required for >1000-MHz FFT pipelines or dual 100G Ethernet ports | Select when logic/DSP headroom exceeds 60% of XCVU080-2FFVB2104E capacity |
| XCVU095-2FFVB2104E | 983,000 logic cells, 4,520 DSP slices, identical thermal and I/O specs | Suitable for single 100G port + radar processing with shared resources | Choose for balanced cost-performance where 15% logic margin suffices |
Compared with XCVU080-2FFVB2104E, the XCVU13P offers 60% more logic and DSP for scaling compute-intensive workloads, while the XCVU095 provides 19% higher capacity at minimal footprint and thermal impact-both retain identical FFVB2104 packaging and transceiver compatibility.
Availability
XCVU080-2FFVB2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G fronthaul infrastructure, and high-energy physics data acquisition requiring stable component supply across extended product lifecycles.
Supply support for XCVU080-2FFVB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and aerospace/defense markets.
The Virtex UltraScale family targets high-bandwidth, low-latency, and thermally constrained applications including real-time signal processing, network acceleration, and scientific instrumentation.
FAQ
What is the maximum supported transceiver data rate for XCVU080-2FFVB2104E?
The XCVU080-2FFVB2104E supports a maximum transceiver line rate of 28.3 Gb/s using its GTH transceivers. This rate is validated for NRZ and PAM4 signaling under industrial temperature conditions and is specified in AMD's UltraScale Architecture Transceivers User Guide (UG576 v1.13). The XCVU080-2FFVB2104E achieves this performance with built-in clock data recovery and adaptive equalization.
Does XCVU080-2FFVB2104E support partial reconfiguration?
Yes, XCVU080-2FFVB2104E fully supports partial reconfiguration through Vivado Design Suite, enabling dynamic logic partition swaps without resetting the entire device. This capability is used in adaptive radar and software-defined radio systems. The XCVU080-2FFVB2104E implements frame-based reconfiguration with dedicated configuration port arbitration logic.
What memory interfaces are integrated into XCVU080-2FFVB2104E?
XCVU080-2FFVB2104E integrates dual 32-bit DDR4 memory controllers supporting data rates up to 2400 MT/s with on-die termination and ECC. It does not include LPDDR4 or GDDR6 controllers. These DDR4 controllers are hardened IP blocks, reducing timing closure effort and power consumption compared to soft-core implementations in the XCVU080-2FFVB2104E fabric.
What is the operating temperature range for XCVU080-2FFVB2104E?
XCVU080-2FFVB2104E is rated for industrial temperature operation from -40°C to +100°C at the junction. This rating is verified per JEDEC JESD22-A108 and applies to the FFVB2104 package variant. Thermal derating is not required within this range when using the recommended PCB copper pour and heat slug mounting for the XCVU080-2FFVB2104E.
Which PCIe generation and width does XCVU080-2FFVB2104E support?
XCVU080-2FFVB2104E includes a hardened PCIe Gen3 endpoint block supporting x1, x2, x4, x8, and x16 configurations. It complies with PCI Express Base Specification Revision 3.0 and supports Advanced Error Reporting (AER) and Message Signaled Interrupts (MSI-X). The XCVU080-2FFVB2104E achieves full x16 Gen3 bandwidth (16 GT/s) with no soft logic overhead.
XCVU080-2FFVB2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 55714
- Number of Logic Elements/Cells:
- 975000
- Total RAM Bits:
- 51200000
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU080-2FFVB2104E FAQ
1.How can I place an order for XCVU080-2FFVB2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU080-2FFVB2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU080-2FFVB2104E reliable?
The price and inventory of XCVU080-2FFVB2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU080-2FFVB2104E is usually 5 days.
3.What payment methods are accepted for XCVU080-2FFVB2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU080-2FFVB2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU080-2FFVB2104E?
XCVU080-2FFVB2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU080-2FFVB2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU080-2FFVB2104E?
For technical support, including XCVU080-2FFVB2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU080-2FFVB2104E requirements.
6.How does Aetrix verify that XCVU080-2FFVB2104E is sourced from the original manufacturer or authorized distributors?
All XCVU080-2FFVB2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU080-2FFVB2104E meets industry standards.
7.What is the process for return or replacement of XCVU080-2FFVB2104E?
All XCVU080-2FFVB2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU080-2FFVB2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU080-2FFVB2104E part is unused and in its original packaging.
Return procedure for XCVU080-2FFVB2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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