AMD XCVU080-2FFVD1517E

Overview

XCVU080-2FFVD1517E from AMD is a high-performance Virtex UltraScale FPGA featuring 817,200 logic cells, 4,032 DSP slices, and 96.4 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 memory interfaces up to 2400 MT/s, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in high-throughput radar signal processing systems requiring deterministic latency and real-time data flow.

For engineers reviewing the XCVU080-2FFVD1517E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (1,024 user I/Os), transceiver line rate (32.75 Gb/s), power delivery requirements, thermal management for FFVD1517 package, and configuration interface compatibility (e.g., Quad-SPI, BPI, JTAG).

Technical Context

The XCVU080-2FFVD1517E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3, 10/25/100G Ethernet MAC, memory controllers), and ultra-low-latency transceivers. Its UltraScale+ architecture uses 20nm bulk CMOS process and features segmented interconnect with clock region partitioning for timing closure in large designs.

It supports partial reconfiguration, AXI4-Stream and AXI4-Lite interfaces for system integration, and includes integrated ADCs (XADC) for on-die monitoring. Configuration is performed via Master SPI, SelectMAP, or JTAG, with bitstream encryption and HMAC authentication enabled for secure boot.

Key Specifications

Pinout & Package

The XCVU080-2FFVD1517E is housed in a 1517-ball Flip-Chip Fine-Pitch Ball Grid Array (FFVD1517) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation via central thermal ball array.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU080-2FFVD1517E, the XCVU13P offers greater scalability for future-proofing compute-intensive designs, while the XCVU095 trades some DSP capacity for expanded I/O flexibility-both require package-level layout changes and distinct thermal management strategies.

Availability

XCVU080-2FFVD1517E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and space-qualified onboard computing requiring stable component supply across extended product lifecycles.

Supply support for XCVU080-2FFVD1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and aerospace applications.

The Virtex UltraScale family targets high-bandwidth, low-latency, and radiation-aware applications where deterministic performance, hardened IP integration, and long-term obsolescence management are critical design requirements.

FAQ

What is the maximum supported DDR4 memory interface speed for the XCVU080-2FFVD1517E?

The XCVU080-2FFVD1517E supports DDR4 memory interfaces up to 2400 MT/s using its hardened memory controller IP. This speed is guaranteed under industrial temperature conditions and -2 speed grade operation. The controller includes built-in write leveling, read leveling, and gate training to ensure signal integrity across high-speed parallel buses. XCVU080-2FFVD1517E implements DDR4-specific timing parameters including tFAW, tRRD_L, and tRC per JEDEC specification JESD79-4.

Does the XCVU080-2FFVD1517E support partial reconfiguration?

Yes, the XCVU080-2FFVD1517E fully supports partial reconfiguration through Vivado Design Suite tools and runtime configuration port (RCP). This allows dynamic swapping of logic modules without resetting the entire device or disrupting active I/O operations. XCVU080-2FFVD1517E implements frame-based reconfiguration with CRC-protected bitstream segments and hardware-assisted address translation. Use cases include adaptive radar waveform updates and field-upgradable communication protocols.

What transceiver protocols are natively supported by the XCVU080-2FFVD1517E?

The XCVU080-2FFVD1517E natively supports PCIe Gen3 x16, 10/25/100G Ethernet (with RS-FEC), CPRI v7.0, and Interlaken v2.1 via hardened transceiver PMA/PMD blocks. These protocols are implemented in silicon with guaranteed jitter performance and link training compliance. XCVU080-2FFVD1517E does not require external retimers for 100G Ethernet operation at 25.78125 Gb/s per lane. Protocol selection is configured at bitstream generation time using Vivado's transceiver wizard.

Is the XCVU080-2FFVD1517E qualified for space applications?

The XCVU080-2FFVD1517E is not radiation-hardened or QML-V certified, but it is widely used in commercial space applications with external mitigation techniques. XCVU080-2FFVD1517E supports configuration scrubbing, SEU detection via CRC, and triple-modular redundancy (TMR) implementation in fabric. For missions requiring ECSS-Q-ST-60-13C Class B compliance, additional system-level hardening and testing are required-XCVU080-2FFVD1517E provides the architectural foundation but is not a drop-in space-grade part.

What configuration modes are supported by the XCVU080-2FFVD1517E?

The XCVU080-2FFVD1517E supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Master SPI is most common for single-flash boot; SelectMAP enables high-speed parallel loading from microcontrollers. XCVU080-2FFVD1517E also supports dual-boot with fallback bitstream storage and encrypted bitstream loading using AES-256 keys stored in eFUSE. Configuration mode is selected via MODE pins during power-on reset sequence.