My Inquiry
My Account
AMD XCVU080-3FFVA2104E
- Part No.:
- XCVU080-3FFVA2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU080-3FFVA2104E.pdf
- Description:
- IC FPGA 832 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,495
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCVU080-3FFVA2104E from AMD is a Virtex UltraScale FPGA featuring 820K logic cells, 3720 DSP slices, 59.5 Mb of block RAM, and 100G Ethernet MAC support in a 2104-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) package. It targets high-throughput data center acceleration, 400G optical transport line cards, and radar signal processing systems.
For engineers reviewing the XCVU080-3FFVA2104E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.8 V / 1.5 V / 1.35 V / 1.2 V), transceiver line rates up to 25.78125 Gb/s, and PCIe Gen4 x16 root complex capability.
Technical Context
The XCVU080-3FFVA2104E implements a heterogeneous architecture with programmable logic fabric, hardened 100G Ethernet MACs, and multi-protocol transceivers compliant with IEEE 802.3bj/ck and OTU4 standards. It integrates dual ARM Cortex-A53 processors for system management and supports partial reconfiguration.
It delivers deterministic latency for time-sensitive networking via integrated TSN endpoints and supports AXI4-Stream interfaces for high-bandwidth data movement between PL and PS domains. The device includes hardened DDR4 memory controllers supporting up to 2400 MT/s.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 820,000 - Enables large-scale algorithm acceleration and protocol stack implementation in single-device solutions. |
| DSP Slices | 3,720 - Supports concurrent 27×18-bit multiply-accumulate operations for real-time signal processing. |
| Block RAM | 59.5 Mb - Provides on-chip buffering for packet assembly, frame storage, and coefficient tables without external memory. |
| Transceiver Max Rate | 25.78125 Gb/s - Meets 100G KR4/CR4 and 400G DR4/FR4 PAM4 line-rate requirements. |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL - Enables direct interfacing with high-speed ADCs, DACs, and memory devices. |
| PCIe Interface | Gen4 x16 Root Complex - Allows direct CPU coherency and low-latency host communication in accelerator cards. |
Pinout & Package
Package: 2104-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V to FPGA fabric; requires tight regulation (±3%) for timing closure. |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration logic, PCIe PHY, and clock management tiles. |
| MGTAVCC | Transceiver analog supply | Delivers 0.95 V to high-speed serial transceivers; sensitive to noise and ripple. |
| IO_LxYy_YY | Configurable I/O bank | Supports selectable I/O standards per bank; each bank has dedicated VCCO and VREF pins. |
| CLK_IN_YY | Dedicated clock input | Connects to external oscillators or clocks; routed to MMCM/PLL for jitter cleaning and frequency synthesis. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Reduces RTL integration effort and ensures IEEE 802.3bj compliance without soft IP resource consumption. |
| Partial Reconfiguration Support | Enables dynamic function swapping in deployed systems-e.g., switching between encryption and compression engines without full FPGA reset. |
| AXI4-Stream Interconnect | Provides standardized, flow-controlled data path between programmable logic and ARM processor subsystem for streaming workloads. |
| TSN Endpoint Integration | Delivers sub-microsecond timestamping and schedule-aware queuing for deterministic industrial Ethernet applications. |
| DDR4 Memory Controller | Manages up to 4 banks of DDR4-2400 with ECC support, eliminating need for external memory controller ICs. |
Applications
| Data Center Acceleration | Optical Transport Line Card |
|---|---|
Use Scenario: Offloading TCP/IP stack, TLS encryption, and RDMA processing from CPU in cloud servers. IC Role / Device Role / Timing Role: High-performance programmable accelerator with PCIe Gen4 host interface and deterministic latency control. Use Value: Achieves 2× throughput improvement over ASIC-based NICs while supporting firmware-upgradable protocols. | Use Scenario: Implementing FEC, OTU framing, and forward error correction in 400G coherent optical modules. IC Role / Device Role / Timing Role: Line-side digital signal processor with 25.78 Gb/s transceivers and hardened OTU4 framer logic. Use Value: Reduces BOM count by integrating framer, mapper, and FEC into single die, lowering power by 35% vs. discrete solution. |
| Radar Signal Processing | Test & Measurement Equipment |
Use Scenario: Real-time beamforming, pulse-Doppler FFT, and CFAR detection in AESA radar systems. IC Role / Device Role / Timing Role: High-throughput DSP engine with 3720 DSP slices and 59.5 Mb on-chip RAM for coefficient caching. Use Value: Processes 128-channel phased array data at 2.4 GS/s with <100 ns pipeline latency. | Use Scenario: High-resolution waveform generation and analysis in modular PXIe instruments. IC Role / Device Role / Timing Role: Reconfigurable signal generator core with synchronized multi-channel DAC/ADC interface and jitter-clean clock synthesis. Use Value: Enables 16-bit, 1.25 GS/s arbitrary waveform generation with <0.5 ps RMS jitter on output clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU095-2FLGA2104I | Higher logic capacity (985K cells), lower speed grade (-2), FLGA package with different thermal pad layout. | Better suited for compute-intensive AI inference where logic density outweighs transceiver count. | Select when higher DSP slice count and larger BRAM are required; verify thermal dissipation in existing mechanical cutout. |
| XCVU13P-2FLGA2577E | Greater transceiver count (128 vs. 104), -2 speed grade, larger 2577-pin FLGA package. | Preferred for multi-100G port aggregation or 800G optical switch fabric applications. | Choose when >100 Gb/s aggregate bandwidth or additional PCIe Gen4 x16 lanes are needed; board redesign required. |
Compared with XCVU080-3FFVA2104E, the XCVU095-2FLGA2104I offers more logic resources at reduced speed grade, while the XCVU13P-2FLGA2577E adds transceiver count and I/O but requires new PCB layout-making XCVU080-3FFVA2104E optimal for balanced 100G–400G line-card designs with fixed form factor constraints.
Availability
XCVU080-3FFVA2104E is available at Aetrix Electronics and suitable for data center accelerators, optical transport systems, and radar signal processing requiring stable component supply across long production cycles.
Supply support for XCVU080-3FFVA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and aerospace/defense markets.
The Virtex UltraScale family was designed for infrastructure applications demanding extreme bandwidth, deterministic latency, and hardware adaptability-including 400G+ networking, real-time radar, and AI-accelerated compute.
FAQ
What is the maximum transceiver line rate supported by the XCVU080-3FFVA2104E?
The XCVU080-3FFVA2104E supports a maximum transceiver line rate of 25.78125 Gb/s, validated per IEEE 802.3bj and OTU4 standards. This enables native 100G KR4/CR4 and 400G DR4/FR4 PAM4 operation. All transceiver banks on the XCVU080-3FFVA2104E are rated for this speed under specified thermal and power conditions.
Does the XCVU080-3FFVA2104E include hardened Ethernet MAC blocks?
Yes, the XCVU080-3FFVA2104E integrates hardened 100G Ethernet MAC blocks compliant with IEEE 802.3bj and 802.3ck. These blocks offload MAC-layer functions from programmable logic, reduce resource usage, and guarantee timing closure for 100G KR4/CR4 implementations without soft IP.
What I/O voltage standards does the XCVU080-3FFVA2104E support?
The XCVU080-3FFVA2104E supports multiple I/O standards including LVDS, MIPI D-PHY, SSTL-12/15/18, HSTL-I/II, and differential signaling up to 1.8 V. Each I/O bank is independently configurable with dedicated VCCO and VREF pins, enabling mixed-voltage board designs.
Is partial reconfiguration supported on the XCVU080-3FFVA2104E?
Yes, the XCVU080-3FFVA2104E fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic swapping of logical partitions-such as encryption engines or protocol stacks-without resetting the entire device or disrupting active I/O channels.
What is the block RAM capacity of the XCVU080-3FFVA2104E?
The XCVU080-3FFVA2104E provides 59.5 Mb of total block RAM, distributed across 2,880 BRAM primitives. This capacity supports large on-chip buffers for packet assembly, frame storage, and coefficient tables-eliminating reliance on external memory in latency-critical applications.
Does the XCVU080-3FFVA2104E include an integrated ARM processor subsystem?
Yes, the XCVU080-3FFVA2104E features a dual-core ARM Cortex-A53 processor subsystem (PS) running at up to 1.5 GHz. It operates alongside the programmable logic (PL) domain and communicates via AXI4 interconnect, enabling heterogeneous software-hardware partitioning in the XCVU080-3FFVA2104E.
XCVU080-3FFVA2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 55714
- Number of Logic Elements/Cells:
- 975000
- Total RAM Bits:
- 51200000
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.970V ~ 1.030V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU080-3FFVA2104E FAQ
1.How can I place an order for XCVU080-3FFVA2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU080-3FFVA2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU080-3FFVA2104E reliable?
The price and inventory of XCVU080-3FFVA2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU080-3FFVA2104E is usually 5 days.
3.What payment methods are accepted for XCVU080-3FFVA2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU080-3FFVA2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU080-3FFVA2104E?
XCVU080-3FFVA2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU080-3FFVA2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU080-3FFVA2104E?
For technical support, including XCVU080-3FFVA2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU080-3FFVA2104E requirements.
6.How does Aetrix verify that XCVU080-3FFVA2104E is sourced from the original manufacturer or authorized distributors?
All XCVU080-3FFVA2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU080-3FFVA2104E meets industry standards.
7.What is the process for return or replacement of XCVU080-3FFVA2104E?
All XCVU080-3FFVA2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU080-3FFVA2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU080-3FFVA2104E part is unused and in its original packaging.
Return procedure for XCVU080-3FFVA2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU080-3FFVA2104E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
