AMD XCVU095-2FFVA2104E

Overview

XCVU095-2FFVA2104E from AMD is a high-performance Virtex UltraScale FPGA featuring 984,000 logic cells, 5,520 DSP slices, and 72.5 Mb of block RAM. It supports PCIe Gen3 x16, 28 Gbps transceivers, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). Used in radar signal processing and high-throughput data acquisition systems.

For engineers reviewing the XCVU095-2FFVA2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count, I/O voltage support (1.2 V/1.35 V/1.8 V), and thermal design power (TDP) of 42 W under typical operation.

Technical Context

The XCVU095-2FFVA2104E implements a heterogeneous architecture with programmable logic, hardened IP blocks for PCIe Gen3, and UltraScale+ memory controllers. It integrates 24 multi-gigabit transceivers supporting protocols including CPRI, JESD204B/C, and Ethernet up to 28 Gbps.

Its configuration uses dual-boot capability with fallback via SPIx4 or BPI interface, and it supports partial reconfiguration for dynamic function swapping. The device includes hardened 100G Ethernet MAC and integrated AXI interconnect fabric for system-level integration.

Key Specifications

Pinout & Package

Package: 2104-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) with 0.8 mm pitch, thermally enhanced for high-power FPGA operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU095-2FFVA2104E, the XCVU13P offers headroom for future feature expansion but increases cooling complexity, while the XCVU065 reduces board area and power at the expense of real-time processing bandwidth and memory depth.

Availability

XCVU095-2FFVA2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-speed test instrumentation requiring stable component supply across long production cycles.

Supply support for XCVU095-2FFVA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, networking, and embedded systems through FPGA, adaptive SoC, and software-defined platforms.

The Virtex UltraScale family targets high-performance signal processing, network acceleration, and real-time embedded computing where deterministic latency, high I/O bandwidth, and hardware adaptability are critical.

FAQ

What is the maximum supported transceiver data rate for XCVU095-2FFVA2104E?

The XCVU095-2FFVA2104E supports transceiver line rates up to 28 Gbps per lane. This enables compliance with IEEE 802.3bj (100GBASE-CR4), CEI-28G, and JESD204C standards. All 24 transceivers are rated for this speed under industrial temperature conditions and require proper PCB stack-up and equalization tuning.

Does XCVU095-2FFVA2104E support partial reconfiguration?

Yes, XCVU095-2FFVA2104E fully supports partial reconfiguration through Vivado Design Suite. This capability allows dynamic swapping of logic modules-such as different filter banks or modulation schemes-without resetting the entire device. XCVU095-2FFVA2104E's configuration interface and frame-based bitstream architecture enable secure, verified module updates in-field.

What I/O standards are supported by XCVU095-2FFVA2104E?

XCVU095-2FFVA2104E supports LVCMOS (1.2 V/1.35 V/1.5 V/1.8 V), SSTL, HSTL, MIPI D-PHY, and differential standards including LVDS, BLVDS, and RSDS. Each of its 800+ user I/O pins is grouped into banks with independent VCCO and VREF, allowing mixed-voltage operation across interfaces like DDR4, CMOS image sensors, and high-speed ADCs.

What is the thermal design power (TDP) of XCVU095-2FFVA2104E?

The XCVU095-2FFVA2104E has a typical thermal design power (TDP) of 42 W under representative high-activity workloads. This value assumes industrial temperature operation, full transceiver usage, and moderate logic utilization. Actual power varies with design implementation and must be validated using Xilinx Power Estimator (XPE) with the specific XCVU095-2FFVA2104E configuration.

Is XCVU095-2FFVA2104E pin-compatible with other Virtex UltraScale devices?

No, XCVU095-2FFVA2104E is not pin-compatible with other Virtex UltraScale FPGAs due to unique ball map alignment, power delivery requirements, and transceiver placement. Its 2104-pin FFVA package is specific to the XCVU095 density grade. Migration to XCVU13P or XCVU065 requires PCB redesign and signal integrity revalidation.