AMD XCVU095-2FFVA2104I

Overview

XCVU095-2FFVA2104I from AMD is a high-performance Virtex UltraScale FPGA featuring 984,000 logic cells, 5,720 DSP slices, and 68.4 Mb of block RAM. It supports PCIe Gen3 x16, 28 Gbps transceivers, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in radar signal processing systems requiring real-time FFT acceleration and deterministic latency.

For engineers reviewing the XCVU095-2FFVA2104I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, available DSP resources for fixed-point math, thermal envelope under sustained 28 Gbps operation, and I/O bank voltage flexibility for mixed-signal interface integration.

Technical Context

The XCVU095-2FFVA2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25/100G Ethernet MAC), and UltraScale+ memory controllers. Its transceivers support PAM4 and NRZ modulation with integrated clock data recovery up to 28.3 Gbps per lane.

It uses 20nm bulk CMOS process technology, features dual-register flip-flops per LUT6, and includes dedicated routing for time-critical paths such as AXI4-Stream interconnects between DSP slices and memory controllers.

Key Specifications

Pinout & Package

Package: FFVA2104 - 2104-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA), 49.0 mm × 49.0 mm, 0.8 mm pitch, 1.27 mm height, RoHS-compliant, with thermal lid.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU095-2FFVA2104I, the XCVU13P-2FLGA2577I offers higher compute density at greater thermal and layout cost, while the XCVU065-2FFVA1156I delivers scaled-down capability in a more compact, thermally efficient package-enabling trade-offs between algorithmic complexity, board space, and cooling infrastructure.

Availability

XCVU095-2FFVA2104I is available at Aetrix Electronics and suitable for radar signal processing, 5G massive MIMO baseband, and avionics data concentrator applications requiring stable component supply across long production lifecycles.

Supply support for XCVU095-2FFVA2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Virtex UltraScale family targets high-throughput, low-latency signal processing in defense radar, 5G infrastructure, and test equipment where deterministic timing and hardened IP integration are critical.

FAQ

What is the maximum supported transceiver line rate for XCVU095-2FFVA2104I?

The XCVU095-2FFVA2104I supports a maximum transceiver line rate of 28.3 Gbps per lane using NRZ encoding. This enables direct interfacing with JESD204B/C converters and 100G Ethernet KR4 physical layers. The transceiver architecture includes adaptive equalization and clock data recovery optimized for PCB trace lengths up to 30 inches at this rate. XCVU095-2FFVA2104I maintains this performance across its full industrial temperature range.

Does XCVU095-2FFVA2104I include hardened PCIe Gen3 endpoints?

Yes, XCVU095-2FFVA2104I integrates hardened PCIe Gen3 x16 endpoint blocks compliant with PCI Express Base Specification Revision 3.1. These blocks implement the physical layer, data link layer, and transaction layer, eliminating the need for soft IP synthesis and reducing integration risk. XCVU095-2FFVA2104I supports both root complex and endpoint configurations with full hot-plug and ASPM power management.

What I/O standards are supported by the HP I/O banks on XCVU095-2FFVA2104I?

The HP I/O banks on XCVU095-2FFVA2104I support DDR4-2400, LPDDR4-4266, and RLDRAM3-2133 memory interfaces with calibrated on-die termination. They also support differential standards including LVDS, BLVDS, and MIPI D-PHY v2.1 at data rates up to 1.5 Gbps. XCVU095-2FFVA2104I allows independent voltage setting per bank, enabling mixed-voltage board designs.

How many block RAM bits does XCVU095-2FFVA2104I provide?

XCVU095-2FFVA2104I provides 68.4 Mb of total block RAM, composed of 2,880 BRAM primitives each configurable as 36 Kb dual-port RAM or 72 Kb simple dual-port RAM. This capacity supports large frame buffers for video processing, coefficient tables for adaptive filtering, and FIFOs for high-throughput AXI4-Stream pipelines. XCVU095-2FFVA2104I allocates block RAM across multiple clock domains with independent write enable controls.

Is XCVU095-2FFVA2104I qualified for industrial temperature operation?

Yes, XCVU095-2FFVA2104I is rated for industrial temperature operation from -40°C to +100°C case temperature. It undergoes extended burn-in and characterization across this range, including transceiver jitter testing and timing closure validation. The -2 speed grade guarantees functional operation and timing compliance under worst-case voltage and temperature corners. XCVU095-2FFVA2104I includes on-die thermal sensors accessible via the System Monitor interface.