AMD XCVU095-2FFVB1760E

Overview

XCVU095-2FFVB1760E from AMD is a high-performance Virtex UltraScale FPGA featuring 984,000 logic cells, 5,520 DSP slices, and 68.4 Mb of block RAM. It supports PCIe Gen4 x16, 28 Gbps transceivers, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in 5G radio unit baseband processing and high-throughput data center acceleration.

For engineers reviewing the XCVU095-2FFVB1760E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic density, thermal envelope, I/O voltage flexibility, and configuration security options.

Technical Context

The XCVU095-2FFVB1760E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and ultra-low-latency memory interfaces. It integrates 1,152 GTY transceivers configurable up to 28.0 Gbps and supports AXI4-Stream and AXI4-Full interconnect protocols.

Configuration is performed via dual-boot QSPI flash or JTAG, with AES-256 bitstream encryption and HMAC authentication. The device uses 16nm FinFET process technology and supports partial reconfiguration for dynamic function swapping without system reset.

Key Specifications

Pinout & Package

Package: 1760-pin FCBGA (Fine-Pitch Column Grid Array), 42.5 mm × 42.5 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU095-2FFVB1760E, the XCVU13P offers scalable headroom for future feature expansion, while the XCVU065 delivers optimized cost and power for constrained implementations-both maintain architectural compatibility but differ in capacity, I/O count, and thermal envelope.

Availability

XCVU095-2FFVB1760E is available at Aetrix Electronics and suitable for 5G infrastructure, AI edge accelerators, and defense radar systems requiring stable component supply across extended product lifecycles.

Supply support for XCVU095-2FFVB1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and aerospace applications.

The Virtex UltraScale family targets high-bandwidth, low-latency, and mission-critical systems requiring hardened connectivity, cryptographic security, and field-upgradable logic functionality.

FAQ

What is the maximum supported transceiver data rate for XCVU095-2FFVB1760E?

The XCVU095-2FFVB1760E supports GTY transceivers rated up to 28.0 Gbps, validated for 100G Ethernet KR4, PCIe Gen4, and CPRI/eCPRI protocols. This rate is guaranteed under industrial temperature conditions and requires proper PCB stack-up, controlled impedance routing, and reference clock jitter below 500 fs RMS.

Does XCVU095-2FFVB1760E support partial reconfiguration?

Yes, XCVU095-2FFVB1760E fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic swapping of logic modules-such as different radar waveform generators-without resetting the entire device or halting system operation, enabling flexible multi-mode operation in field-deployed systems.

What configuration security features are implemented in XCVU095-2FFVB1760E?

XCVU095-2FFVB1760E includes AES-256 bitstream encryption and HMAC-based authentication to prevent unauthorized programming and detect tampering. These features are hardware-enforced and operate independently of external processors, ensuring secure boot and runtime integrity for XCVU095-2FFVB1760E deployments in critical infrastructure.

Which memory interfaces are natively supported by XCVU095-2FFVB1760E?

XCVU095-2FFVB1760E integrates hardened DDR4 PHY supporting data rates up to 2400 Mbps across 16- to 32-bit interfaces with optional ECC. It also supports LPDDR4, RLDRAM3, and QDR-IV SRAM through programmable I/O banks with calibrated output drivers and input deskew.

What is the thermal design power (TDP) range for XCVU095-2FFVB1760E under typical operation?

XCVU095-2FFVB1760E exhibits a typical TDP range of 32–48 W depending on resource utilization, transceiver count active, and clock frequencies. Full utilization with all 112 GTY transceivers at 28 Gbps and 984K logic cells operating at 300 MHz yields ~46 W, requiring a heatsink with ≤0.35°C/W junction-to-ambient thermal resistance.