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AMD XCVU095-2FFVB1760I
- Part No.:
- XCVU095-2FFVB1760I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCVU095-2FFVB1760I.pdf
- Description:
- IC FPGA 702 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,780
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Product details
Overview
XCVU095-2FFVB1760I from AMD is a high-performance Virtex UltraScale FPGA featuring 984,000 logic cells, 5,520 DSP slices, and 68.4 Mb of block RAM. It supports PCIe Gen3 x16, 28 Gbps transceivers, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in radar signal processing and high-throughput data acquisition systems.
For engineers reviewing the XCVU095-2FFVB1760I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic density, thermal envelope, I/O bank voltage flexibility, and configuration security options.
Technical Context
The XCVU095-2FFVB1760I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe, 10/25/100G Ethernet MAC, memory controllers), and multi-rate transceivers supporting protocols including CPRI, JESD204B/C, and OTN. Its UltraScale+ architecture uses 3D IC stacking for inter-die interconnects.
Configuration is performed via quad-SPI, BPI, or JTAG; bitstream encryption and HMAC authentication are supported. The device includes dedicated clock management tiles with MMCM and PLL resources for low-jitter clock synthesis across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 984,000 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 5,520 - enables parallel execution of high-precision arithmetic operations for real-time filtering and FFT |
| Block RAM | 68.4 Mb - provides on-chip memory for buffering, FIFOs, and coefficient storage without external memory latency |
| Transceiver Max Rate | 28.3 Gbps - supports 100G Ethernet, CPRI Option 10, and JESD204C serial links |
| I/O Pins | 720 - delivers high pin count for interfacing with ADCs, DACs, memory, and custom ASICs |
| Speed Grade | -2 - guarantees timing closure at highest operating frequencies under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - validated for deployment in enclosed industrial and aerospace enclosures without active cooling |
Pinout & Package
Package: 1760-pin FCBGA (Fine-Pitch Column Grid Array), 42.5 mm × 42.5 mm, 0.8 mm pitch, RoHS-compliant, thermal lid-equipped.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as SDIO, UART, SPI, I2C, or GPIO; connects to PS peripherals in Zynq UltraScale+ MPSoC hybrid mode |
| HR Bank 0–3 | High-Range I/O | Supports 1.8V/2.5V/3.3V signaling; used for DDR4 interfaces and high-speed parallel buses |
| HP Bank 4–13 | High-Performance I/O | 1.2V/1.35V/1.8V operation; optimized for source-synchronous interfaces like QDR SRAM and FPGA-to-FPGA links |
| GTH Transceivers | Serial I/O | 28.3 Gbps differential lanes; each pair requires dedicated reference clock and power plane isolation |
| VCCINT / VCCAUX / VCCO | Power Supplies | Separate rails for core (0.85V), auxiliary (1.8V), and I/O (1.2–3.3V) enable mixed-voltage board design |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale+ Architecture | Enables hierarchical design reuse and partial reconfiguration for dynamic function swapping in mission-critical systems |
| Hardened PCIe Gen3 x16 | Reduces RTL integration effort and ensures deterministic latency for host-FPGA DMA transfers |
| Integrated Memory Controllers | Supports DDR4-2400 and RLDRAM3-1600 with ECC, eliminating need for external controller logic |
| Secure Boot with AES-HMAC | Prevents unauthorized bitstream loading and runtime tampering in regulated environments |
| Multi-Die Interconnect | Provides >1 Tbps die-to-die bandwidth within the same package for scalable compute partitioning |
Applications
| Radar Beamforming System | 5G Massive MIMO Radio Unit |
|---|---|
Use Scenario: Real-time adaptive beam steering using hundreds of antenna elements with sub-microsecond latency requirements. IC Role / Device Role / Timing Role: FPGA fabric executes phase-shift calculation and digital upconversion; transceivers drive RFICs via JESD204C. Use Value: 28.3 Gbps transceivers and 5,520 DSP slices enable simultaneous processing of 64+ antenna streams with <100 ns loop latency. | Use Scenario: Distributed unit (DU) to radio unit (RU) fronthaul interface handling 8×100 MHz carriers with CPRI compression. IC Role / Device Role / Timing Role: Acts as fronthaul protocol mapper and packet scheduler; manages time-sensitive synchronization via IEEE 1588v2 hardware timestamping. Use Value: Hardened 100G Ethernet MAC and deterministic latency routing ensure <1 μs jitter for TDD frame alignment across remote radios. |
| High-Energy Physics Trigger Processor | AI Accelerator Co-Processor |
Use Scenario: Online event filtering in particle collider experiments requiring nanosecond-level coincidence detection across 10k+ sensor channels. IC Role / Device Role / Timing Role: Implements pipelined pattern matching and time-windowed correlation logic across distributed I/O banks. Use Value: 720 I/O pins and 68.4 Mb block RAM allow concurrent ingestion and staging of raw detector data before selective forwarding to GPU clusters. | Use Scenario: Offloading sparse matrix multiplication and quantized inference kernels from CPU/GPU in edge inference servers. IC Role / Device Role / Timing Role: Configured as custom systolic array using LUT-based MAC units and BRAM-based weight caching. Use Value: 984,000 logic cells and 5,520 DSP slices deliver >12 TOPS INT8 throughput at <25 W typical power under industrial ambient conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577I | Higher logic density (1,375K LC), larger package (2577-pin), higher power consumption | Better suited for multi-protocol aggregation and full-stack protocol stack offload | Select when >1M logic cells or >80 transceivers are required; verify PCB redesign for larger footprint and thermal management |
| XCVU065-2FFVA1156I | Lower logic count (663K LC), smaller 1156-pin package, reduced transceiver count (40 vs 64) | Targeted at cost-constrained radar front-ends and mid-tier test equipment | Choose when system I/O and DSP resource requirements are ~30% lower; maintains same speed grade and temp range |
Compared with XCVU095-2FFVB1760I, the XCVU13P offers greater scalability at the cost of layout and thermal redesign, while the XCVU065 reduces bill-of-materials cost and board area where full 984K LC capacity is unused.
Availability
XCVU095-2FFVB1760I is available at Aetrix Electronics and suitable for radar signal processing, 5G fronthaul infrastructure, and high-energy physics instrumentation requiring stable component supply over extended production lifecycles.
Supply support for XCVU095-2FFVB1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, embedded, and aerospace applications.
The Virtex UltraScale family targets demanding compute-intensive applications requiring deterministic latency, high-bandwidth I/O, and field-upgradable logic - especially in defense radar, communications infrastructure, and scientific instrumentation.
FAQ
What is the maximum transceiver line rate supported by XCVU095-2FFVB1760I?
The XCVU095-2FFVB1760I supports a maximum transceiver line rate of 28.3 Gbps per lane using its GTH transceivers. This enables compliance with JESD204C, 100G Ethernet CAUI-4, and CPRI Option 10. The actual achievable rate depends on PCB channel loss, reference clock stability, and termination design - all verified in AMD's UltraScale+ transceiver characterization reports for the XCVU095-2FFVB1760I.
Does XCVU095-2FFVB1760I support PCIe Gen4?
No, the XCVU095-2FFVB1760I integrates hardened PCIe Gen3 x16 endpoints only. It does not support PCIe Gen4 physical layer signaling or data rates. For Gen4 compatibility, AMD recommends the Versal ACAP series or later Virtex UltraScale+ derivatives explicitly specified for Gen4 - the XCVU095-2FFVB1760I datasheet confirms Gen3 as the maximum supported version.
What configuration modes are supported by XCVU095-2FFVB1760I?
The XCVU095-2FFVB1760I supports master and slave configuration modes via Quad-SPI, BPI, and JTAG interfaces. It also enables fallback configuration and dual-boot capability using external flash. Configuration security features - including AES-256 bitstream encryption and HMAC authentication - are enabled and verified for the XCVU095-2FFVB1760I in industrial temperature operation.
Is XCVU095-2FFVB1760I pin-compatible with other Virtex UltraScale devices?
No, the XCVU095-2FFVB1760I uses a unique 1760-pin FFVB package and is not pin-compatible with other Virtex UltraScale FPGAs. Pinouts differ across logic density variants due to I/O bank placement, power pin distribution, and transceiver location constraints. Migration between variants requires PCB redesign - confirmed by AMD's UltraScale packaging documentation for the XCVU095-2FFVB1760I.
What is the block RAM capacity of XCVU095-2FFVB1760I in megabits?
The XCVU095-2FFVB1760I provides 68.4 Mb of total block RAM, composed of 2,880 BRAM primitives (each 36 Kb). This capacity supports large on-chip buffers, deep FIFOs, and coefficient tables for DSP pipelines. All block RAM resources are accessible across the full industrial temperature range and fully characterized for the XCVU095-2FFVB1760I in AMD's silicon validation report.
XCVU095-2FFVB1760I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 67200
- Number of Logic Elements/Cells:
- 1176000
- Total RAM Bits:
- 62259200
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCVU095-2FFVB1760I FAQ
1.How can I place an order for XCVU095-2FFVB1760I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU095-2FFVB1760I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU095-2FFVB1760I reliable?
The price and inventory of XCVU095-2FFVB1760I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU095-2FFVB1760I is usually 5 days.
3.What payment methods are accepted for XCVU095-2FFVB1760I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU095-2FFVB1760I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU095-2FFVB1760I?
XCVU095-2FFVB1760I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU095-2FFVB1760I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU095-2FFVB1760I?
For technical support, including XCVU095-2FFVB1760I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU095-2FFVB1760I requirements.
6.How does Aetrix verify that XCVU095-2FFVB1760I is sourced from the original manufacturer or authorized distributors?
All XCVU095-2FFVB1760I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU095-2FFVB1760I meets industry standards.
7.What is the process for return or replacement of XCVU095-2FFVB1760I?
All XCVU095-2FFVB1760I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU095-2FFVB1760I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU095-2FFVB1760I part is unused and in its original packaging.
Return procedure for XCVU095-2FFVB1760I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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