AMD XCVU095-2FFVB2104E

Overview

XCVU095-2FFVB2104E from AMD is a high-performance Virtex UltraScale FPGA featuring 984,000 logic cells, 5,520 DSP slices, and 72.5 Mb of block RAM. It supports PCIe Gen4 x16, 28 Gbps transceivers, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in 5G radio units and high-throughput data acceleration systems.

For engineers reviewing the XCVU095-2FFVB2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic density, thermal envelope, I/O bank voltage flexibility, and configuration security options.

Technical Context

The XCVU095-2FFVB2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and UltraScale+ routing interconnect. Its transceivers support PAM4 and NRZ modulation up to 28.3 Gbps per lane with integrated clock data recovery.

Configuration occurs via dual-boot QSPI flash or JTAG, with AES-256 bitstream encryption and HMAC authentication. The device uses SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards across 24 I/O banks.

Key Specifications

Pinout & Package

Package: 2104-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVB) with 0.8 mm pitch, 39.5 mm × 39.5 mm body size, and thermal lid for enhanced heat dissipation in high-power operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU095-2FFVB2104E, the XCVU13P offers higher logic and DSP capacity in identical packaging-ideal for scaling compute without layout change-while the XCVU065 trades density and transceiver count for lower cost and power, necessitating board revision but easing thermal design.

Availability

XCVU095-2FFVB2104E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace avionics, and high-performance computing applications requiring stable component supply across extended product lifecycles.

Supply support for XCVU095-2FFVB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.

The Virtex UltraScale family targets high-bandwidth, low-latency, and compute-intensive applications such as wireless infrastructure, test equipment, and real-time signal processing systems.

FAQ

What is the maximum supported transceiver data rate for XCVU095-2FFVB2104E?

The XCVU095-2FFVB2104E supports a maximum transceiver line rate of 28.3 Gbps per lane using NRZ encoding, validated per UG576 and applicable to all 60 transceiver quads. This enables full-rate PCIe Gen4 x16, 100G Ethernet KR4, and CEI-28G interfaces without gearbox logic.

Does XCVU095-2FFVB2104E support partial reconfiguration?

Yes, XCVU095-2FFVB2104E fully supports partial reconfiguration as defined in UG909. It allows dynamic swapping of logical modules-such as waveform-specific DSP blocks or protocol engines-without resetting the entire device or disrupting active I/O channels.

What configuration security features are implemented in XCVU095-2FFVB2104E?

XCVU095-2FFVB2104E integrates AES-256 bitstream encryption with HMAC-SHA256 authentication and secure key storage in eFUSE. These features prevent unauthorized readback, cloning, or modification of the programmed configuration, meeting DO-254 and IEC 62443-3-3 requirements.

Which memory interface standards does XCVU095-2FFVB2104E natively support?

XCVU095-2FFVB2104E includes hardened DDR4 PHY supporting 2400 MT/s operation across up to 32-bit wide interfaces, plus LPDDR4 support up to 4266 MT/s. It does not include native GDDR6 or HBM2 controllers; those require soft IP or external memory controllers.

What is the thermal design power (TDP) range for XCVU095-2FFVB2104E under typical operating conditions?

XCVU095-2FFVB2104E has a typical TDP range of 28–35 W depending on resource utilization, transceiver count active, and I/O switching activity. The FFVB2104 package with thermal lid is rated for 35 W sustained dissipation with appropriate heatsink and airflow per UG1195 thermal guidelines.