AMD XCVU095-2FFVB2104I

Overview

XCVU095-2FFVB2104I from AMD is a high-performance Virtex UltraScale FPGA with 984,000 logic cells, 5,720 DSP slices, and 72.5 Mb of block RAM, configured in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package for demanding compute-acceleration and high-bandwidth interface applications.

For engineers reviewing the XCVU095-2FFVB2104I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.8 V / 1.5 V / 1.35 V / 1.25 V), transceiver line rates up to 32.75 Gb/s, and -2 speed grade timing performance under industrial temperature conditions.

Technical Context

The XCVU095-2FFVB2104I implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4 x16, 100G Ethernet MAC, DDR4 controller), and ultra-low-latency transceivers. It supports multi-standard serial protocols including CPRI, JESD204B/C, and OTN.

Configured with dual-register LUTs, carry chains, and distributed RAM, the device delivers deterministic timing closure for high-frequency designs. Its UltraScale+ architecture enables dynamic partial reconfiguration and integrated system monitoring via on-die sensors.

Key Specifications

Pinout & Package

The XCVU095-2FFVB2104I is housed in a 2104-ball Flip-Chip BGA (FFVB2104) package with thermal lid, designed for high-power dissipation and signal integrity in dense PCB layouts. Pin assignment follows AMD's UltraScale+ FPGA pinout conventions with dedicated configuration, clock, and power delivery banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU095-2FFVB2104I, the XCVU13P offers greater scalability for future-proofing but increases board area and thermal load, while the XCVU065 reduces BOM cost and layout complexity at the expense of transceiver bandwidth and logic headroom.

Availability

XCVU095-2FFVB2104I is available at Aetrix Electronics and suitable for 5G infrastructure, AI acceleration, and high-frequency trading systems requiring stable component supply across extended product lifecycles.

Supply support for XCVU095-2FFVB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with emphasis on performance-per-watt and architectural flexibility.

The Virtex UltraScale+ family targets high-throughput, low-latency systems where hardware adaptability, hardened connectivity, and deterministic timing are critical - especially in communications, test equipment, and real-time AI.

FAQ

What is the maximum supported transceiver line rate for the XCVU095-2FFVB2104I?

The XCVU095-2FFVB2104I supports a maximum transceiver line rate of 32.75 Gb/s using its GTY transceivers. This enables native implementation of 100G/400G Ethernet, PCIe Gen4, and coherent optical interfaces. The rate is guaranteed under industrial temperature conditions and -2 speed grade timing constraints. XCVU095-2FFVB2104I transceivers support both NRZ and PAM4 modulation schemes.

Does the XCVU095-2FFVB2104I include a hardened PCIe Gen4 controller?

Yes, the XCVU095-2FFVB2104I integrates a hardened PCIe Gen4 x16 root port or endpoint controller. It complies with PCI-SIG specifications and eliminates the need for external PHY or soft IP implementation. The controller supports ASPM, AER, and MSI-X, and is accessible directly from the programmable logic fabric. XCVU095-2FFVB2104I delivers full Gen4 bandwidth without consuming logic resources.

What I/O standards does the XCVU095-2FFVB2104I support?

The XCVU095-2FFVB2104I supports LVDS, MIPI D-PHY, SSTL, HSTL, and POD I/O standards across its 16 I/O banks. These allow direct interfacing with DDR4, LPDDR4, and high-speed serdes peripherals. Each bank operates at selectable voltages (1.2 V to 1.8 V), and bank-specific termination is configurable. XCVU095-2FFVB2104I supports simultaneous multi-standard operation within a single design.

Is dynamic partial reconfiguration supported on the XCVU095-2FFVB2104I?

Yes, the XCVU095-2FFVB2104I fully supports dynamic partial reconfiguration (DPR) as defined in AMD's UltraScale+ architecture. DPR allows runtime updates of designated logic regions without disrupting active functions elsewhere in the device. Configuration is managed through ICAP and PCIe-based interfaces. XCVU095-2FFVB2104I includes dedicated control logic and bitstream authentication for secure reconfiguration.

What is the operating temperature range for the XCVU095-2FFVB2104I?

The XCVU095-2FFVB2104I is rated for industrial temperature operation from -40°C to +100°C junction temperature. This rating applies to the -2 speed grade and is validated per AMD's qualification standards. Thermal management must account for power delivery and package thermal resistance (θJA = 2.8°C/W typical). XCVU095-2FFVB2104I includes on-die sensors for real-time junction temperature monitoring.