AMD XCVU095-2FFVC1517E

Overview

XCVU095-2FFVC1517E from AMD is a high-performance Virtex UltraScale FPGA featuring 984,000 logic cells, 5,520 DSP slices, and 68.4 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 memory interfaces up to 2400 MT/s, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in high-throughput radar signal processing systems requiring deterministic latency and real-time data path acceleration.

For engineers reviewing the XCVU095-2FFVC1517E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (832 user I/Os), transceiver line rate (16.3 Gb/s), power delivery requirements, thermal envelope, and configuration interface compatibility (e.g., dual BPI or JTAG).

Technical Context

The XCVU095-2FFVC1517E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3, 10/25G Ethernet MAC, and UltraScale+ memory controllers. Its transceivers support PAM4 and NRZ signaling modes with integrated clock data recovery (CDR) and adaptive equalization.

It integrates dedicated AXI-Interconnect infrastructure, hardened DMA engines, and configurable clock management tiles (CMTs) with MMCM and PLL support. Configuration is performed via quad-SPI, BPI, or JTAG, with bitstream encryption and HMAC authentication enabled by the on-chip processor subsystem.

Key Specifications

Pinout & Package

This device is packaged in a 1517-ball Flip-Chip Fine-Pitch Ball Grid Array (FFVC) with 0.8 mm pitch, designed for high-density PCB routing and thermal dissipation in conduction-cooled modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU095-2FFVC1517E, the XCVU13P offers greater scalability at increased power and board area cost, while the XCVU065 delivers pin-compatible capacity reduction for design optimization-both require validation of thermal and signal integrity margins in final system layout.

Availability

XCVU095-2FFVC1517E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and medical imaging systems requiring stable component supply across long production lifecycles.

Supply support for XCVU095-2FFVC1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Virtex UltraScale family targets high-bandwidth, low-latency, and compute-intensive applications such as aerospace radar, 5G infrastructure, and scientific instrumentation.

FAQ

What is the operating temperature range for XCVU095-2FFVC1517E?

The XCVU095-2FFVC1517E is rated for industrial temperature operation from -40°C to +100°C ambient, validated under JEDEC JESD22-A104 conditions. This range supports deployment in sealed avionics enclosures and outdoor 5G base station cabinets without active cooling. The -2 speed grade ensures timing closure across this full range, and thermal derating curves are provided in the XCVU095-2FFVC1517E device characterization report.

Does XCVU095-2FFVC1517E support PCIe Gen4?

No, the XCVU095-2FFVC1517E integrates hardened PCIe Gen3 x16 endpoints only. It does not support PCIe Gen4 data rates or protocol features. Designs requiring Gen4 must use newer Versal ACAP devices or evaluate alternative high-end FPGAs with native Gen4 transceivers. The XCVU095-2FFVC1517E's transceivers are specified up to 16.3 Gb/s, aligning with PCIe Gen3 (8 GT/s) and 25G Ethernet, not Gen4 (16 GT/s).

What configuration modes are supported by XCVU095-2FFVC1517E?

The XCVU095-2FFVC1517E supports multiple configuration modes: Master/Slave Serial (SPI flash), Master/Slave Parallel (x8/x16 BPI NOR flash), JTAG boundary-scan, and ICAP-based partial reconfiguration. Configuration security features include AES-256 bitstream encryption and HMAC authentication, both enforced during boot. These capabilities are documented in the XCVU095-2FFVC1517E Configuration User Guide (UG570).

Can XCVU095-2FFVC1517E interface directly with LPDDR4 memory?

Yes, the XCVU095-2FFVC1517E includes a hardened UltraScale+ memory controller that supports LPDDR4-4266 (2133 MHz clock) with 16-bit or 32-bit bus widths. It implements all required PHY calibration, write-leveling, and read-leveling sequences. The XCVU095-2FFVC1517E's HP I/O banks provide compatible voltage levels (1.1 V) and timing margins for reliable LPDDR4 operation at full speed.

Is there a thermal solution reference design for XCVU095-2FFVC1517E?

Yes, AMD provides thermal reference designs for the XCVU095-2FFVC1517E, including copper slug heatsink recommendations, thermal interface material specifications, and PCB stack-up guidelines for 6-layer and 10-layer boards. These are published in the XCVU095-2FFVC1517E Thermal Management User Guide (UG583), which specifies junction-to-case thermal resistance (θ_JC) as 0.22°C/W under defined mounting conditions.