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AMD XCVU095-2FFVC1517I
- Part No.:
- XCVU095-2FFVC1517I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCVU095-2FFVC1517I.pdf
- Description:
- IC FPGA 520 I/O 1517FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,600
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Product details
Overview
XCVU095-2FFVC1517I from AMD is a high-performance Virtex UltraScale FPGA with 984,000 logic cells, 5,520 DSP slices, and 68.4 Mb of block RAM. It features 1,517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVC) packaging and operates at -2 speed grade for demanding compute-acceleration and high-bandwidth interface applications.
For engineers reviewing the XCVU095-2FFVC1517I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (832 user I/Os), transceiver line rate (32.75 Gb/s), thermal design power (225 W), and support for PCIe Gen4 x16 and DDR4-2400 interfaces.
Technical Context
The XCVU095-2FFVC1517I implements a heterogeneous architecture integrating programmable logic, hardened IP blocks, and ultra-high-speed serial transceivers. It includes 24 GTY transceivers supporting PAM4 and NRZ signaling, and dual 100G MAC hard IP for Ethernet acceleration.
Its memory subsystem supports up to 16 DDR4 memory controllers with 2400 MT/s data rates and AXI4-Stream interfaces for high-throughput data movement. The device targets deterministic latency paths in radar processing and financial trading systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 984,000 - total configurable LUT-based resources for complex digital logic implementation |
| DSP Slices | 5,520 - dedicated arithmetic units enabling high-throughput filtering and matrix operations |
| Block RAM | 68.4 Mb - on-chip memory for low-latency buffering and data staging |
| User I/Os | 832 - configurable single-ended and differential I/Os supporting LVDS, SSTL, HSTL |
| GTY Transceivers | 24 × 32.75 Gb/s - multi-protocol serial links for 100G Ethernet, CPRI, and JESD204C |
| Speed Grade | -2 - guaranteed timing performance at highest operating frequency for critical path closure |
| TDP | 225 W - thermal envelope requiring active cooling and careful PCB thermal management |
Pinout & Package
Package: 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVC), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for FPGA fabric and CLB logic; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, SelectIO, and transceiver analog circuitry |
| VCCO | I/O bank power | Programmable 1.2–1.8V per bank; sets voltage standard for connected peripherals |
| MGTAVCC | Transceiver analog supply | 1.0V analog rail for GTY transceiver PLLs and serializers; sensitive to ripple |
| CLK_IN | Dedicated clock input | Single-ended or differential reference clock input for MMCM/PLL clock synthesis |
| INIT_B | Configuration status | Open-drain output indicating configuration completion or error during startup |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Two integrated 100G MAC blocks reduce RTL integration effort and ensure IEEE 802.3bj compliance |
| AXI4-Stream interconnect | Native high-throughput streaming interface enabling direct connection to DMA engines and memory controllers |
| UltraScale+ architecture | Enhanced routing and clocking infrastructure improves timing closure for designs >1 GHz clock domains |
| PCIe Gen4 x16 root port | Hard IP supporting 16-lane, 16 GT/s endpoint or root complex operation without soft-core overhead |
| DDR4 memory controller | Up to 16 independent 64-bit controllers supporting 2400 MT/s with ECC and address/command parity |
Applications
| Radar Signal Processing | Financial Market Data Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR algorithms; GTY transceivers interface with ADC/DAC FMC modules. Use Value: Deterministic sub-100 ns latency enables coherent signal alignment across 1000+ antenna elements. | Use Scenario: Low-latency order matching and risk calculation in co-located trading engines. IC Role / Device Role / Timing Role: Hardware-accelerated pattern matching engine ingesting 100G market data feeds via QSFP28. Use Value: 24 GTY transceivers enable full-line-rate 100G Ethernet ingress without packet loss or jitter-induced delay. |
| 5G Massive MIMO Baseband | High-Performance Computing Interconnect |
Use Scenario: Layer-1 baseband processing for 64T64R massive MIMO radio units. IC Role / Device Role / Timing Role: Implements channel estimation, precoding, and OFDM modulation using DSP-rich fabric and memory bandwidth. Use Value: 68.4 Mb block RAM and 5,520 DSP slices sustain 200 Gbps real-time throughput for 5G NR numerology scaling. | Use Scenario: Coherent interconnect between CPU, GPU, and custom ASICs in AI training clusters. IC Role / Device Role / Timing Role: Acts as protocol-agnostic bridging fabric supporting CXL 2.0, PCIe Gen4, and custom RDMA over GTY links. Use Value: Hardened PCIe Gen4 x16 and AXI4-Stream interfaces eliminate serialization bottlenecks in multi-TB/s memory-mapped transfers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577I | Higher logic density (1,375K LC), larger package (2577-pin), higher TDP (275 W) | Better suited for multi-die system-on-package integration and 400G Ethernet line cards | Select when >1M logic cells and ≥32 GTY transceivers are required |
| XCVU065-2FFVA1156I | Lower logic count (663K LC), smaller 1156-pin package, reduced GTY count (16), lower TDP (155 W) | Targeted at cost-sensitive 100G optical transport and edge AI inference | Select when thermal budget and board area constrain full XCVU095 capability |
Compared with XCVU095-2FFVC1517I, the XCVU13P offers greater scalability for next-generation protocols but demands more power and PCB area, while the XCVU065 trades capacity for deployability in thermally constrained edge platforms.
Availability
XCVU095-2FFVC1517I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-frequency trading hardware requiring stable component supply across long production cycles.
Supply support for XCVU095-2FFVC1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, networking, and embedded systems.
The Virtex UltraScale family delivers high-bandwidth, low-latency programmable logic for mission-critical infrastructure where performance, power efficiency, and protocol flexibility are essential.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCVU095-2FFVC1517I?
The XCVU095-2FFVC1517I supports GTY transceivers rated up to 32.75 Gb/s per lane in NRZ mode and 58 Gb/s in PAM4 mode. This enables native 100G Ethernet (4×25G), 400G Ethernet (8×50G), and JESD204C compliance. The XCVU095-2FFVC1517I datasheet specifies these rates under -2 speed grade with proper reference clock jitter and PCB channel loss conditions.
Does the XCVU095-2FFVC1517I include hardened PCIe Gen4 IP?
Yes, the XCVU095-2FFVC1517I integrates hardened PCIe Gen4 x16 root port and endpoint IP blocks. These are not soft cores - they implement physical layer, data link, and transaction layers in dedicated silicon. The XCVU095-2FFVC1517I supports full 16 GT/s line rate with automatic equalization and LTSSM state management.
What memory interface standards does the XCVU095-2FFVC1517I support?
The XCVU095-2FFVC1517I supports DDR4-2400 (64-bit × 16 banks), LPDDR4-4266, and RLDRAM3-2133 memory interfaces via dedicated hard controllers. Each controller includes built-in ECC, write leveling, and read/write leveling calibration. The XCVU095-2FFVC1517I does not support DDR5 or GDDR6 natively.
Is the XCVU095-2FFVC1517I qualified for automotive applications?
No, the XCVU095-2FFVC1517I is specified for industrial temperature range (–40°C to +100°C case temperature) and carries no AEC-Q100 qualification. It is not intended for automotive safety-critical systems. For automotive use, AMD offers the XCVU13P-2FLGA2577I with extended qualification support, but the XCVU095-2FFVC1517I remains industrial-grade only.
How many clock management tiles (CMTs) are available in the XCVU095-2FFVC1517I?
The XCVU095-2FFVC1517I contains 24 Clock Management Tiles (CMTs), each comprising one Mixed-Mode Clock Manager (MMCM) and one Phase-Locked Loop (PLL). These provide independent clock synthesis, phase shifting, and jitter filtering for domain-specific timing requirements. The XCVU095-2FFVC1517I allows concurrent use of all 24 CMTs for multi-clock-domain designs.
XCVU095-2FFVC1517I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 67200
- Number of Logic Elements/Cells:
- 1176000
- Total RAM Bits:
- 62259200
- Number of I/O:
- 520
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCVU095-2FFVC1517I FAQ
1.How can I place an order for XCVU095-2FFVC1517I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU095-2FFVC1517I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU095-2FFVC1517I reliable?
The price and inventory of XCVU095-2FFVC1517I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU095-2FFVC1517I is usually 5 days.
3.What payment methods are accepted for XCVU095-2FFVC1517I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU095-2FFVC1517I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU095-2FFVC1517I?
XCVU095-2FFVC1517I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU095-2FFVC1517I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU095-2FFVC1517I?
For technical support, including XCVU095-2FFVC1517I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU095-2FFVC1517I requirements.
6.How does Aetrix verify that XCVU095-2FFVC1517I is sourced from the original manufacturer or authorized distributors?
All XCVU095-2FFVC1517I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU095-2FFVC1517I meets industry standards.
7.What is the process for return or replacement of XCVU095-2FFVC1517I?
All XCVU095-2FFVC1517I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU095-2FFVC1517I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU095-2FFVC1517I part is unused and in its original packaging.
Return procedure for XCVU095-2FFVC1517I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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