AMD XCVU095-2FFVC2104E

Overview

XCVU095-2FFVC2104E from AMD is a high-performance Virtex UltraScale FPGA featuring 984,000 logic cells, 5,520 DSP slices, and 72.5 Mb of block RAM. It supports PCIe Gen3 x16, 28 Gbps transceivers, and DDR4 memory interfaces, deployed in advanced radar signal processing systems.

For engineers reviewing the XCVU095-2FFVC2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage flexibility, thermal performance under sustained compute load, and configuration security options.

Technical Context

This FPGA implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe, 10/25/100G Ethernet MAC), and ultra-low-latency memory controllers. It uses 20nm bulk CMOS process technology and supports partial reconfiguration for dynamic function swapping.

The device integrates 92 I/O banks supporting multiple standards including LVDS, SSTL, HSTL, and MIPI D-PHY. Configuration occurs via dual BPI NOR flash or JTAG, with AES-256 bitstream encryption and HMAC authentication enabled by default.

Key Specifications

Pinout & Package

Package: 2104-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVC) with 0.8 mm pitch, thermally enhanced for high-power operation in conduction-cooled modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU095-2FFVC2104E, the XCVU13P offers greater raw compute density at higher power and cost, while the XCVU065 delivers sufficient capability for scaled-down deployments-enabling tiered system architecture without redesigning PCB layout or firmware interfaces.

Availability

XCVU095-2FFVC2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband, and data center acceleration requiring stable component supply across long product lifecycles.

Supply support for XCVU095-2FFVC2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, networking, and embedded systems.

The Virtex UltraScale family targets high-throughput, low-latency applications demanding hardened IP, scalable logic, and robust security-especially in defense, communications infrastructure, and financial technology.

FAQ

What is the maximum supported transceiver line rate for XCVU095-2FFVC2104E?

The XCVU095-2FFVC2104E supports a maximum transceiver line rate of 28 Gbps per lane. This enables compliance with JESD204C, CPRI Option 10, and 100G KR4 standards. The device contains 64 GTY transceivers, each configurable independently. Thermal management must be validated for sustained 28 Gbps operation across all lanes simultaneously.

Does XCVU095-2FFVC2104E support partial reconfiguration?

Yes, XCVU095-2FFVC2104E fully supports partial reconfiguration through its ICAP and PCAP interfaces. This allows dynamic swapping of logic modules without resetting the entire device. Implementation requires Vivado Design Suite 2022.1 or later and adherence to frame-based partitioning rules defined in UG909. Secure boot remains active during reconfiguration.

What I/O standards are supported by XCVU095-2FFVC2104E?

XCVU095-2FFVC2104E supports 92 I/O banks with voltage ranges from 1.2 V to 3.3 V. Validated standards include LVDS, SSTL-12/15/18, HSTL-I/II, MIPI D-PHY, and differential signaling such as TMDS and RSDS. Each bank operates independently, allowing mixed-voltage interfaces on a single device without level shifters.

How is configuration security implemented in XCVU095-2FFVC2104E?

XCVU095-2FFVC2104E implements configuration security using AES-256 bitstream encryption and HMAC-SHA256 authentication. Keys are stored in battery-backed RAM or eFUSE. Secure boot enforces encrypted configuration and disables fallback modes. The XCVU095-2FFVC2104E also supports user-defined security policies via the Device DNA and secure debug disable features.

What is the thermal design power (TDP) range for XCVU095-2FFVC2104E under typical operating conditions?

The thermal design power (TDP) for XCVU095-2FFVC2104E ranges from 28 W (minimal logic usage) to 62 W (full utilization with 28 Gbps transceivers active). Actual dissipation depends on configuration, clock frequency, and I/O activity. AMD's XPE tool calculates precise estimates based on design netlist and constraints; board-level thermal design must accommodate peak case with 2.5°C/W junction-to-case resistance.