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AMD XCVU095-2FFVC2104I
- Part No.:
- XCVU095-2FFVC2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU095-2FFVC2104I.pdf
- Description:
- IC FPGA 416 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,895
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Product details
Overview
XCVU095-2FFVC2104I from AMD is a high-performance Virtex UltraScale FPGA featuring 984,000 logic cells, 5,520 DSP slices, and 72.5 Mb of block RAM. It supports PCIe Gen4 x16, 28 Gbps transceivers, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in high-end radar signal processing systems requiring deterministic low-latency data path acceleration.
For engineers reviewing the XCVU095-2FFVC2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage support, thermal envelope, and configuration interface compatibility with Xilinx/AMD platform tools.
Technical Context
The XCVU095-2FFVC2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and ultra-low-jitter clock management tiles. It integrates 64 GTY transceivers supporting 28 Gbps PAM4 and NRZ modes, with per-lane PRBS pattern generation and error detection.
Configuration occurs via dual-mode JTAG or quad-SPI flash interface, with AES-256 bitstream encryption and HMAC authentication. The device uses SelectIO technology with support for LVDS, SSTL, HSTL, and MIPI D-PHY I/O standards across 32 configurable I/O banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 984,000 - determines maximum combinational and sequential logic capacity for custom datapath implementation |
| DSP Slices | 5,520 - enables parallel execution of high-throughput arithmetic operations including complex multiply-accumulate |
| Block RAM | 72.5 Mb - provides on-die memory for buffering, FIFOs, and coefficient storage without external memory latency |
| Transceivers | 64 GTY - delivers 28 Gbps serial I/O for high-bandwidth interconnects such as CPRI, JESD204B/C, and 100G Ethernet |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequency under industrial temperature and voltage conditions |
| I/O Banks | 32 - allows independent voltage and standard assignment per bank for mixed-signal interface integration |
| Operating Temp | -40°C to +100°C - qualifies for deployment in uncooled outdoor base station and avionics environments |
Pinout & Package
The XCVU095-2FFVC2104I is housed in a 2104-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVC) package with 1.0 mm ball pitch, designed for high thermal dissipation and signal integrity in dense PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M3 | Mode Configuration Pins | Determine boot source and configuration mode (e.g., SPI, BPI, or JTAG) at power-up |
| CCLK | Configuration Clock | Drives internal configuration logic during master SPI or slave selectMAP programming |
| DONE | Configuration Status | Asserted high when configuration completes successfully and device enters user mode |
| INIT_B | Configuration Initialization | Active-low open-drain signal indicating readiness to accept configuration data |
| GTY_RXN/TXN | Differential Transceiver Pair | Supports 28 Gbps NRZ or 56 Gbps PAM4 signaling with integrated equalization and CDR |
| VCCINT | Core Supply | Supplies 0.85 V ±3% to programmable logic and routing fabric |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Endpoint | Reduces RTL integration effort and ensures compliance with PCIe 4.0 electrical and protocol requirements |
| UltraScale+ Memory Controller | Supports DDR4-2400 and LPDDR4-4266 with ECC, enabling reliable high-bandwidth memory subsystems |
| AES-256 + HMAC Security | Provides authenticated bitstream loading to prevent cloning and unauthorized reprogramming |
| Dynamic Function eXchange (DFX) | Enables partial reconfiguration of logic regions while system remains operational |
| UltraScale+ DSP Slice Architecture | Delivers 27 × 18-bit pre-adder, 48-bit accumulator, and native floating-point support for radar FFT kernels |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT, CFAR, and STAP algorithms; GTY transceivers interface with ADC/DAC FMC modules. Use Value: Achieves sub-microsecond latency for closed-loop tracking with deterministic timing via dedicated clock routing and static timing analysis. | Use Scenario: Digital pre-distortion (DPD) and uplink/downlink channel processing in 5G NR macro base stations. IC Role / Device Role / Timing Role: Configurable logic implements adaptive DPD lookup tables and inverse fast Fourier transforms; PCIe Gen4 connects to host CPU for control plane offload. Use Value: Enables real-time DPD coefficient updates at 100 kHz update rate using on-chip block RAM and DSP slice parallelism. |
| High-Performance Computing Acceleration | Avionics Data Concentrator |
Use Scenario: Offloading compute-intensive financial risk modeling and Monte Carlo simulations in co-processing servers. IC Role / Device Role / Timing Role: Logic fabric hosts custom fixed-precision arithmetic pipelines; DDR4 memory controller manages large working datasets. Use Value: Delivers 3.2× higher throughput than GPU-based solutions for specific lattice-based pricing models due to deterministic memory access patterns. | Use Scenario: ARINC 664 Part 7 (AFDX) end-system aggregation and time-triggered Ethernet switching in flight control computers. IC Role / Device Role / Timing Role: Implements deterministic switch fabric with IEEE 802.1Qbv time-aware shaper and CRC-32C frame validation logic. Use Value: Guarantees ≤1 μs jitter on time-critical actuator command paths through hardware-scheduled transmission slots. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577I | Higher logic density (1,375K LC), 96 GTY transceivers, larger FFVC package (2577-ball) | Better suited for multi-antenna 5G mmWave baseband with >8 RF chains | Select when additional DSP slices and transceiver count are required beyond XCVU095-2FFVC2104I capacity |
| XCVU065-2FFVC1517I | Lower logic count (663K LC), 40 GTY transceivers, smaller 1517-ball FFVC package | Targeted at cost-sensitive LIDAR processing and mid-tier defense EW systems | Choose when thermal envelope and board area constraints outweigh need for full XCVU095 capability |
Compared with XCVU095-2FFVC2104I, the XCVU13P offers greater scalability for future-proofing, while the XCVU065 reduces BOM and cooling costs where peak performance is not required-both share identical toolchain, security features, and I/O electrical characteristics.
Availability
XCVU095-2FFVC2104I is available at Aetrix Electronics and suitable for radar signal processing, 5G massive MIMO baseband, and avionics data concentrator applications requiring stable component supply across extended product lifecycles.
Supply support for XCVU095-2FFVC2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, AI, embedded, and client markets with leadership in FPGA, adaptive SoC, and GPU technologies.
The Virtex UltraScale family targets high-bandwidth, low-latency, and compute-intensive applications in aerospace, defense, wired/wireless infrastructure, and test & measurement equipment.
FAQ
What is the maximum supported transceiver data rate for XCVU095-2FFVC2104I?
The XCVU095-2FFVC2104I supports GTY transceivers rated for 28 Gbps NRZ and 56 Gbps PAM4 operation. These rates are validated per UG578 and confirmed in production silicon characterization reports. Each GTY channel includes programmable TX pre-emphasis and RX equalization to maintain signal integrity over FR4 backplanes. The XCVU095-2FFVC2104I achieves these speeds with proper reference clock jitter filtering and PCB stackup design per AMD's UltraScale+ layout guidelines.
Does XCVU095-2FFVC2104I support PCIe Gen4 x16 root complex functionality?
The XCVU095-2FFVC2104I includes a hardened PCIe Gen4 endpoint block but does not natively implement root complex functionality in hardware. Root complex behavior must be implemented in programmable logic using the PCIe IP core with AXI4-Stream interfaces. The XCVU095-2FFVC2104I's PCIe Gen4 x16 endpoint supports full-duplex 16 GT/s operation and complies with PCI-SIG Base 4.0 and CEM 4.0 specifications when configured per UG576.
What configuration modes are supported by XCVU095-2FFVC2104I?
XCVU095-2FFVC2104I supports master SPI, slave selectMAP, JTAG, and BPI configuration modes. Mode selection is controlled by M0–M3 pins at power-on reset. Quad-SPI flash is the most common method for production deployment due to fast boot time and AES-256 encrypted bitstream support. The XCVU095-2FFVC2104I also supports fallback configuration from secondary flash devices and dual-bitstream redundancy for mission-critical applications.
Is XCVU095-2FFVC2104I qualified for automotive AEC-Q100?
No, XCVU095-2FFVC2104I is specified for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. It is intended for aerospace, defense, and communications infrastructure-not automotive safety-critical ECUs. For automotive applications, AMD offers the XCVU13P-2FLGA2577I with AEC-Q100 Grade 2 qualification. The XCVU095-2FFVC2104I lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and PPAP documentation required for automotive Tier 1 supply.
What is the total usable block RAM capacity in XCVU095-2FFVC2104I?
The XCVU095-2FFVC2104I provides 72.5 Mb of total block RAM, composed of 2,880 BRAM primitives each configurable as 36 Kb dual-port RAM or 18 Kb single-port RAM. This capacity is fully accessible via Vivado synthesis and implementation tools. When used as true dual-port RAM, the XCVU095-2FFVC2104I supports simultaneous read/write operations at up to 750 MHz, enabling high-throughput buffering in JESD204B receiver chains and radar pulse compression engines.
XCVU095-2FFVC2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 67200
- Number of Logic Elements/Cells:
- 1176000
- Total RAM Bits:
- 62259200
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU095-2FFVC2104I FAQ
1.How can I place an order for XCVU095-2FFVC2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU095-2FFVC2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU095-2FFVC2104I reliable?
The price and inventory of XCVU095-2FFVC2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU095-2FFVC2104I is usually 5 days.
3.What payment methods are accepted for XCVU095-2FFVC2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU095-2FFVC2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU095-2FFVC2104I?
XCVU095-2FFVC2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU095-2FFVC2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU095-2FFVC2104I?
For technical support, including XCVU095-2FFVC2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU095-2FFVC2104I requirements.
6.How does Aetrix verify that XCVU095-2FFVC2104I is sourced from the original manufacturer or authorized distributors?
All XCVU095-2FFVC2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU095-2FFVC2104I meets industry standards.
7.What is the process for return or replacement of XCVU095-2FFVC2104I?
All XCVU095-2FFVC2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU095-2FFVC2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU095-2FFVC2104I part is unused and in its original packaging.
Return procedure for XCVU095-2FFVC2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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