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AMD XCVU095-2FFVD1517E

Part No.:
XCVU095-2FFVD1517E
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1517-BBGA, FCBGA
Datasheet:
AetrixXCVU095-2FFVD1517E.pdf
Description:
IC FPGA 338 I/O 1517FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,051

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Product details

Overview

XCVU095-2FFVD1517E from AMD is a high-performance Virtex UltraScale FPGA featuring 984,000 logic cells, 5,520 DSP slices, and 68.4 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 memory interfaces up to 2400 MT/s, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in high-end radar signal processing systems requiring deterministic low-latency data path acceleration.

For engineers reviewing the XCVU095-2FFVD1517E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2V/1.35V/1.8V), transceiver line rates up to 16.3 Gb/s, thermal design power (TDP) of 45 W, and configuration via dual BPI NOR flash or JTAG.

Technical Context

The XCVU095-2FFVD1517E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3, Ethernet MACs, and memory controllers, plus 24 UltraScale+ GTY transceivers. Its routing interconnect supports 2.5D integration via silicon interposer and enables multi-die system partitioning.

Configuration uses 32-bit parallel NOR flash interface or IEEE 1149.1 JTAG, with bitstream encryption via AES-256 and HMAC-SHA-256 authentication. The device supports partial reconfiguration and dynamic function exchange for runtime hardware adaptation.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells984,000 - determines maximum combinational and sequential logic capacity for algorithm mapping
DSP Slices5,520 - enables concurrent execution of fixed/floating-point multiply-accumulate operations
Block RAM68.4 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external DRAM
Transceiver Max Rate16.3 Gb/s - supports 100G Ethernet KR4, CPRI, and JESD204B/C high-speed serial links
I/O StandardsLVCMOS, SSTL, HSTL, MIPI, differential LVDS - enables direct interfacing to DDR4, sensors, and ADCs
TDP45 W - defines thermal envelope for heatsink sizing and airflow requirements in sealed enclosures

Pinout & Package

Package: 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) with 0.8 mm pitch, 42.5 mm × 42.5 mm body size, and thermal lid for industrial-grade thermal dissipation.

Pin/TerminalCircuit RoleDesign Meaning
MIO[0:15]Multiplexed I/O bankConfigurable as GPIO, SDIO, SPI, UART, or CAN-FD controller interface
GTYP[0:23]GTY transceiver quadEach pair supports independent 16.3 Gb/s serial lanes with built-in clock/data recovery
VRP/VRNReference voltage pinsProvide termination reference for differential I/O standards in adjacent banks
CONFIG_IOConfiguration I/OCarries configuration data during master SPI or BPI boot mode
VCCINTCore supplySupplies 0.85 V ±3% to programmable logic and routing fabric

Key Features

FeatureDesign Value
Hardened PCIe Gen3 x16 endpointReduces RTL integration effort and guarantees compliance with PCIe Base Spec 3.1
UltraScale+ GTY transceiversDeliver 16.3 Gb/s line rate with <1.5 ps RMS jitter for deterministic serial link timing
Partial Reconfiguration SupportEnables dynamic hardware updates without full device reset or system interruption
AES-256 Bitstream EncryptionPrevents unauthorized readback and cloning of configured logic functionality
Industrial Temperature RangeValidated operation from -40°C to +100°C ambient for deployment in avionics and defense platforms

Applications

Radar Signal Processing5G Massive MIMO Baseband

Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems.

IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT, CFAR, and STAP algorithms; GTY transceivers handle ADC/DAC data streaming at 12 Gb/s.

Use Value: Achieves sub-microsecond latency for adaptive waveform generation and target tracking decisions.

Use Scenario: Digital pre-distortion (DPD) and uplink/downlink channel processing in 5G NR macro base stations.

IC Role / Device Role / Timing Role: Configurable logic implements wideband DPD engines; PCIe Gen3 x16 connects to host CPU for control plane coordination.

Use Value: Supports 8×8 MIMO with 100 MHz carrier aggregation while maintaining EVM <2.5% at 3.5 GHz.

High-Performance Computing AccelerationTest & Measurement Equipment

Use Scenario: Offloading matrix multiplication and sparse graph analytics in edge AI inference servers.

IC Role / Device Role / Timing Role: Logic fabric runs custom accelerator kernels; DDR4-2400 interfaces feed high-bandwidth data streams from NVMe storage.

Use Value: Delivers 2.1 TOPS/W efficiency for INT8 workloads versus GPU-based alternatives.

Use Scenario: Real-time protocol analysis and jitter measurement in 100G Ethernet test instruments.

IC Role / Device Role / Timing Role: GTY transceivers recover embedded clock from 100GBASE-KR4 signals; logic fabric performs PRBS error counting and eye diagram sampling.

Use Value: Enables <100 fs RMS jitter measurement resolution with sub-bit-period alignment accuracy.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU13P-2FFVD1760E1,322K logic cells, 7,200 DSP slices, 84.5 Mb BRAM, same FFVD package footprint but larger die areaHigher compute density required for 400G crypto offload and AI training accelerationSelect when >1.2M LC and >7K DSP are needed; requires revised thermal layout
XCVU065-2FFVA1156E663K logic cells, 3,600 DSP slices, 44.3 Mb BRAM, 1156-pin FCBGA package with different pinoutLower-cost radar subsystems where 100G serial bandwidth is not requiredChoose for cost-sensitive designs with reduced I/O count and no GTY transceiver requirement

Compared with XCVU095-2FFVD1517E, the XCVU13P offers higher logic and DSP capacity at increased power and thermal cost, while the XCVU065 reduces I/O count and transceiver capability for compact, lower-bandwidth deployments.

Availability

XCVU095-2FFVD1517E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband infrastructure, and high-performance computing acceleration requiring stable component supply across long product lifecycles.

Supply support for XCVU095-2FFVD1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for data centers, embedded systems, and client devices.

The Virtex UltraScale family targets mission-critical infrastructure applications demanding deterministic latency, high serial bandwidth, and long-term reliability in aerospace, defense, and communications equipment.

FAQ

What is the maximum supported DDR4 memory interface speed for XCVU095-2FFVD1517E?

The XCVU095-2FFVD1517E supports DDR4 memory interfaces up to 2400 MT/s with hardened memory controller IP. This speed is validated under industrial temperature conditions and requires proper PCB stackup design with controlled impedance and matched trace lengths. The XCVU095-2FFVD1517E memory controller supports dual-rank, 64-bit-wide configurations with ECC capability for mission-critical applications.

Does XCVU095-2FFVD1517E support partial reconfiguration?

Yes, XCVU095-2FFVD1517E fully supports partial reconfiguration through its ICAP and PCAP interfaces. This allows dynamic swapping of logic modules without resetting the entire device or disrupting active I/O operations. The XCVU095-2FFVD1517E implementation requires Vivado Design Suite 2022.1 or later and adheres to Xilinx UG909 guidelines for secure, timing-closed reconfigurable partitions.

What transceiver protocols are natively supported by XCVU095-2FFVD1517E GTY blocks?

The XCVU095-2FFVD1517E GTY transceivers natively support 100G Ethernet (KR4), CPRI v6.1, JESD204B/C, and PCIe Gen3 protocols via hardened PHY logic. Each GTY quad includes independent TX/RX PMA and PCS layers with programmable encoding schemes. Protocol selection is configured at runtime using the XCVU095-2FFVD1517E's transceiver wizard in Vivado.

What configuration modes does XCVU095-2FFVD1517E support?

XCVU095-2FFVD1517E supports master SPI, slave serial, BPI x16, and JTAG configuration modes. Dual BPI NOR flash is the recommended industrial method for secure, fast boot. The XCVU095-2FFVD1517E also supports fallback configuration and multi-boot images stored in external flash, enabling field-upgradable firmware with rollback capability.

Is XCVU095-2FFVD1517E qualified for automotive applications?

No, XCVU095-2FFVD1517E is specified for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. It is intended for aerospace, defense, and communications infrastructure-not automotive ECUs. For automotive use, AMD recommends the Xilinx Automotive (XA) Virtex UltraScale+ family, which undergoes additional qualification testing beyond the standard XCVU095-2FFVD1517E specification.

XCVU095-2FFVD1517E Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex® UltraScale™
Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
67200
Number of Logic Elements/Cells:
1176000
Total RAM Bits:
62259200
Number of I/O:
338
Number of Gates:
-
Voltage - Supply:
0.922V ~ 0.979V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1517-FCBGA (40x40)

XCVU095-2FFVD1517E FAQ

1.How can I place an order for XCVU095-2FFVD1517E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCVU095-2FFVD1517E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCVU095-2FFVD1517E reliable?

The price and inventory of XCVU095-2FFVD1517E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU095-2FFVD1517E is usually 5 days.

3.What payment methods are accepted for XCVU095-2FFVD1517E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU095-2FFVD1517E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCVU095-2FFVD1517E?

XCVU095-2FFVD1517E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCVU095-2FFVD1517E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCVU095-2FFVD1517E?

For technical support, including XCVU095-2FFVD1517E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU095-2FFVD1517E requirements.

6.How does Aetrix verify that XCVU095-2FFVD1517E is sourced from the original manufacturer or authorized distributors?

All XCVU095-2FFVD1517E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU095-2FFVD1517E meets industry standards.

7.What is the process for return or replacement of XCVU095-2FFVD1517E?

All XCVU095-2FFVD1517E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU095-2FFVD1517E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCVU095-2FFVD1517E part is unused and in its original packaging.

Return procedure for XCVU095-2FFVD1517E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCVU095-2FFVD1517E Tags

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