AMD XCVU095-2FFVD1517E
- Part No.:
- XCVU095-2FFVD1517E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCVU095-2FFVD1517E.pdf
- Description:
- IC FPGA 338 I/O 1517FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,051
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCVU095-2FFVD1517E from AMD is a high-performance Virtex UltraScale FPGA featuring 984,000 logic cells, 5,520 DSP slices, and 68.4 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 memory interfaces up to 2400 MT/s, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in high-end radar signal processing systems requiring deterministic low-latency data path acceleration.
For engineers reviewing the XCVU095-2FFVD1517E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2V/1.35V/1.8V), transceiver line rates up to 16.3 Gb/s, thermal design power (TDP) of 45 W, and configuration via dual BPI NOR flash or JTAG.
Technical Context
The XCVU095-2FFVD1517E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3, Ethernet MACs, and memory controllers, plus 24 UltraScale+ GTY transceivers. Its routing interconnect supports 2.5D integration via silicon interposer and enables multi-die system partitioning.
Configuration uses 32-bit parallel NOR flash interface or IEEE 1149.1 JTAG, with bitstream encryption via AES-256 and HMAC-SHA-256 authentication. The device supports partial reconfiguration and dynamic function exchange for runtime hardware adaptation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 984,000 - determines maximum combinational and sequential logic capacity for algorithm mapping |
| DSP Slices | 5,520 - enables concurrent execution of fixed/floating-point multiply-accumulate operations |
| Block RAM | 68.4 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external DRAM |
| Transceiver Max Rate | 16.3 Gb/s - supports 100G Ethernet KR4, CPRI, and JESD204B/C high-speed serial links |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - enables direct interfacing to DDR4, sensors, and ADCs |
| TDP | 45 W - defines thermal envelope for heatsink sizing and airflow requirements in sealed enclosures |
Pinout & Package
Package: 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) with 0.8 mm pitch, 42.5 mm × 42.5 mm body size, and thermal lid for industrial-grade thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O bank | Configurable as GPIO, SDIO, SPI, UART, or CAN-FD controller interface |
| GTYP[0:23] | GTY transceiver quad | Each pair supports independent 16.3 Gb/s serial lanes with built-in clock/data recovery |
| VRP/VRN | Reference voltage pins | Provide termination reference for differential I/O standards in adjacent banks |
| CONFIG_IO | Configuration I/O | Carries configuration data during master SPI or BPI boot mode |
| VCCINT | Core supply | Supplies 0.85 V ±3% to programmable logic and routing fabric |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 endpoint | Reduces RTL integration effort and guarantees compliance with PCIe Base Spec 3.1 |
| UltraScale+ GTY transceivers | Deliver 16.3 Gb/s line rate with <1.5 ps RMS jitter for deterministic serial link timing |
| Partial Reconfiguration Support | Enables dynamic hardware updates without full device reset or system interruption |
| AES-256 Bitstream Encryption | Prevents unauthorized readback and cloning of configured logic functionality |
| Industrial Temperature Range | Validated operation from -40°C to +100°C ambient for deployment in avionics and defense platforms |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT, CFAR, and STAP algorithms; GTY transceivers handle ADC/DAC data streaming at 12 Gb/s. Use Value: Achieves sub-microsecond latency for adaptive waveform generation and target tracking decisions. | Use Scenario: Digital pre-distortion (DPD) and uplink/downlink channel processing in 5G NR macro base stations. IC Role / Device Role / Timing Role: Configurable logic implements wideband DPD engines; PCIe Gen3 x16 connects to host CPU for control plane coordination. Use Value: Supports 8×8 MIMO with 100 MHz carrier aggregation while maintaining EVM <2.5% at 3.5 GHz. |
| High-Performance Computing Acceleration | Test & Measurement Equipment |
Use Scenario: Offloading matrix multiplication and sparse graph analytics in edge AI inference servers. IC Role / Device Role / Timing Role: Logic fabric runs custom accelerator kernels; DDR4-2400 interfaces feed high-bandwidth data streams from NVMe storage. Use Value: Delivers 2.1 TOPS/W efficiency for INT8 workloads versus GPU-based alternatives. | Use Scenario: Real-time protocol analysis and jitter measurement in 100G Ethernet test instruments. IC Role / Device Role / Timing Role: GTY transceivers recover embedded clock from 100GBASE-KR4 signals; logic fabric performs PRBS error counting and eye diagram sampling. Use Value: Enables <100 fs RMS jitter measurement resolution with sub-bit-period alignment accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FFVD1760E | 1,322K logic cells, 7,200 DSP slices, 84.5 Mb BRAM, same FFVD package footprint but larger die area | Higher compute density required for 400G crypto offload and AI training acceleration | Select when >1.2M LC and >7K DSP are needed; requires revised thermal layout |
| XCVU065-2FFVA1156E | 663K logic cells, 3,600 DSP slices, 44.3 Mb BRAM, 1156-pin FCBGA package with different pinout | Lower-cost radar subsystems where 100G serial bandwidth is not required | Choose for cost-sensitive designs with reduced I/O count and no GTY transceiver requirement |
Compared with XCVU095-2FFVD1517E, the XCVU13P offers higher logic and DSP capacity at increased power and thermal cost, while the XCVU065 reduces I/O count and transceiver capability for compact, lower-bandwidth deployments.
Availability
XCVU095-2FFVD1517E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband infrastructure, and high-performance computing acceleration requiring stable component supply across long product lifecycles.
Supply support for XCVU095-2FFVD1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for data centers, embedded systems, and client devices.
The Virtex UltraScale family targets mission-critical infrastructure applications demanding deterministic latency, high serial bandwidth, and long-term reliability in aerospace, defense, and communications equipment.
FAQ
What is the maximum supported DDR4 memory interface speed for XCVU095-2FFVD1517E?
The XCVU095-2FFVD1517E supports DDR4 memory interfaces up to 2400 MT/s with hardened memory controller IP. This speed is validated under industrial temperature conditions and requires proper PCB stackup design with controlled impedance and matched trace lengths. The XCVU095-2FFVD1517E memory controller supports dual-rank, 64-bit-wide configurations with ECC capability for mission-critical applications.
Does XCVU095-2FFVD1517E support partial reconfiguration?
Yes, XCVU095-2FFVD1517E fully supports partial reconfiguration through its ICAP and PCAP interfaces. This allows dynamic swapping of logic modules without resetting the entire device or disrupting active I/O operations. The XCVU095-2FFVD1517E implementation requires Vivado Design Suite 2022.1 or later and adheres to Xilinx UG909 guidelines for secure, timing-closed reconfigurable partitions.
What transceiver protocols are natively supported by XCVU095-2FFVD1517E GTY blocks?
The XCVU095-2FFVD1517E GTY transceivers natively support 100G Ethernet (KR4), CPRI v6.1, JESD204B/C, and PCIe Gen3 protocols via hardened PHY logic. Each GTY quad includes independent TX/RX PMA and PCS layers with programmable encoding schemes. Protocol selection is configured at runtime using the XCVU095-2FFVD1517E's transceiver wizard in Vivado.
What configuration modes does XCVU095-2FFVD1517E support?
XCVU095-2FFVD1517E supports master SPI, slave serial, BPI x16, and JTAG configuration modes. Dual BPI NOR flash is the recommended industrial method for secure, fast boot. The XCVU095-2FFVD1517E also supports fallback configuration and multi-boot images stored in external flash, enabling field-upgradable firmware with rollback capability.
Is XCVU095-2FFVD1517E qualified for automotive applications?
No, XCVU095-2FFVD1517E is specified for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. It is intended for aerospace, defense, and communications infrastructure-not automotive ECUs. For automotive use, AMD recommends the Xilinx Automotive (XA) Virtex UltraScale+ family, which undergoes additional qualification testing beyond the standard XCVU095-2FFVD1517E specification.
XCVU095-2FFVD1517E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 67200
- Number of Logic Elements/Cells:
- 1176000
- Total RAM Bits:
- 62259200
- Number of I/O:
- 338
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCVU095-2FFVD1517E FAQ
1.How can I place an order for XCVU095-2FFVD1517E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU095-2FFVD1517E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU095-2FFVD1517E reliable?
The price and inventory of XCVU095-2FFVD1517E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU095-2FFVD1517E is usually 5 days.
3.What payment methods are accepted for XCVU095-2FFVD1517E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU095-2FFVD1517E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU095-2FFVD1517E?
XCVU095-2FFVD1517E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU095-2FFVD1517E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU095-2FFVD1517E?
For technical support, including XCVU095-2FFVD1517E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU095-2FFVD1517E requirements.
6.How does Aetrix verify that XCVU095-2FFVD1517E is sourced from the original manufacturer or authorized distributors?
All XCVU095-2FFVD1517E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU095-2FFVD1517E meets industry standards.
7.What is the process for return or replacement of XCVU095-2FFVD1517E?
All XCVU095-2FFVD1517E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU095-2FFVD1517E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU095-2FFVD1517E part is unused and in its original packaging.
Return procedure for XCVU095-2FFVD1517E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU095-2FFVD1517E Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

