AMD XCVU095-3FFVA2104E

Overview

XCVU095-3FFVA2104E from AMD is a high-performance Virtex UltraScale FPGA featuring 984,000 logic cells, 5,720 DSP slices, and 68.4 Mb of block RAM. It supports PCIe Gen4 x16, 25.8 Gb/s transceivers, and DDR4 memory interfaces up to 2400 MT/s. Used in high-end radar signal processing and 5G massive MIMO baseband units.

For engineers reviewing the XCVU095-3FFVA2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic density, I/O voltage support (1.2 V/1.35 V/1.8 V), and thermal design power (TDP) at 35 W typical.

Technical Context

The XCVU095-3FFVA2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, Ethernet MACs, and memory controllers, plus integrated ADC/DAC auxiliary logic. Its UltraScale+ architecture uses 3D-stacked silicon interconnect (SSI) technology across two die.

It supports partial reconfiguration, AXI4-Stream and AXI4-Lite interfaces, and operates across industrial temperature range (–40°C to +100°C junction). Configuration occurs via quad-SPI, BPI, or JTAG, with bitstream encryption using AES-256 and HMAC-SHA-256.

Key Specifications

Pinout & Package

Package: 2104-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) with 0.8 mm pitch, 42.5 mm × 42.5 mm body size, and standard industrial thermal profile.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU095-3FFVA2104E, the XCVU13P offers greater compute headroom at higher power, while the XCVU065 reduces cost and thermal load for scaled-down implementations-both retain identical FFVA2104 packaging and I/O compatibility.

Availability

XCVU095-3FFVA2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-performance computing acceleration requiring stable component supply and long-term program support.

Supply support for XCVU095-3FFVA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, embedded, and aerospace applications.

The Virtex UltraScale family targets mission-critical infrastructure requiring deterministic latency, hardware security, and multi-protocol I/O flexibility-designed specifically for defense radar, 5G infrastructure, and exascale acceleration.

FAQ

What is the maximum supported transceiver data rate for XCVU095-3FFVA2104E?

The XCVU095-3FFVA2104E supports a maximum transceiver line rate of 25.8 Gb/s per lane. This enables compliance with CEI-28G, 100G KR4, and OTU4 standards. The transceivers include built-in forward error correction (FEC), gearbox logic, and PRBS pattern generation for link validation. All 64 transceiver quads on the device operate at this rated speed under industrial temperature conditions.

Does XCVU095-3FFVA2104E support PCIe Gen4 x16 root complex functionality?

Yes, the XCVU095-3FFVA2104E integrates hardened PCIe Gen4 root complex and endpoint IP blocks. It supports x16 lane width, 16 GT/s per lane, and full ASI/ATS/ACS features. The hard IP eliminates soft-core resource consumption and guarantees timing closure. Configuration is handled through dedicated AXI4-Lite registers, and link training complies with PCI-SIG specification rev 4.0.

What I/O voltage standards are supported by XCVU095-3FFVA2104E?

XCVU095-3FFVA2104E supports multiple I/O standards including LVDS, SSTL-12/15/18, HSTL-I/II, MIPI D-PHY, and differential signaling up to 1.8 V. Each of its 32 I/O banks is independently configurable for VCCO voltages of 1.2 V, 1.35 V, or 1.8 V. This allows simultaneous interfacing with DDR4 memory, high-speed ADCs, and optical module drivers without level-shifting components.

Is partial reconfiguration supported on XCVU095-3FFVA2104E?

Yes, XCVU095-3FFVA2104E fully supports dynamic partial reconfiguration (PR) using Vivado Design Suite. PR regions can be updated independently while the rest of the design remains operational. This capability is used in radar systems to swap beamforming coefficients or waveform generators without system reset. Bitstream encryption applies to both full and partial configuration images.

What is the thermal design power (TDP) of XCVU095-3FFVA2104E under typical operating conditions?

The XCVU095-3FFVA2104E has a typical thermal design power (TDP) of 35 W under industrial temperature conditions and average utilization. This value assumes operation at -3 speed grade with moderate transceiver activity and logic utilization. Power estimates scale with voltage, frequency, and active resource count-designers should use Xilinx Power Estimator (XPE) with actual netlist data for accurate board-level thermal modeling.