AMD XCVU095-H1FFVA2104E

Overview

XCVU095-H1FFVA2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 984,000 logic cells, 5,720 DSP slices, and 68.4 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, 5G baseband processing, and high-throughput data center offload applications.

For engineers reviewing the XCVU095-H1FFVA2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal performance in air-cooled rack environments, and support for partial reconfiguration in dynamic workloads.

Technical Context

The XCVU095-H1FFVA2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and ultra-low-latency memory interfaces. It supports multi-voltage I/O banks (1.2 V to 1.8 V) and operates across extended temperature range (–40°C to +100°C junction).

Its H1 speed grade guarantees timing closure at 25.8 Gb/s on GTY transceivers and supports 32-bit AXI4 interface widths for high-bandwidth memory-mapped transactions. The device uses stacked-die interposer packaging to integrate logic and memory dies within a single FFVA2104 package.

Key Specifications

Pinout & Package

The XCVU095-H1FFVA2104E is housed in a 2104-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) package with 35 × 35 mm body size and 0.8 mm ball pitch. Thermal design requires exposed thermal lid and six-layer PCB stackup with dedicated power/ground planes.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU095-H1FFVA2104E, the H2 variant trades higher test cost for timing headroom, while the XCVU13P offers greater scale at the expense of power efficiency and board-level thermal management complexity.

Availability

XCVU095-H1FFVA2104E is available at Aetrix Electronics and suitable for AI acceleration, 5G infrastructure, and high-frequency trading systems requiring stable component supply over multi-year production cycles.

Supply support for XCVU095-H1FFVA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA technologies for data center, communications, and embedded markets.

The Virtex UltraScale+ family delivers scalable FPGA platforms with hardened transceivers and memory controllers for deterministic, high-bandwidth system acceleration in telecom and AI infrastructure.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCVU095-H1FFVA2104E?

The XCVU095-H1FFVA2104E supports GTY transceivers up to 25.8 Gb/s per lane, validated across all 64 lanes in the H1 speed grade. This rate enables compliance with 100G Ethernet (4×25G), CPRI Option 10, and PCIe Gen4 specifications. Operation above 25.8 Gb/s requires the H2 speed grade variant.

Does the XCVU095-H1FFVA2104E support DDR4 memory interfaces?

Yes, the XCVU095-H1FFVA2104E includes a hardened DDR4 memory controller supporting up to DDR4-2400 (1200 MHz) with 72-bit data bus width and ECC. It provides automatic calibration, write-leveling, and read-leveling sequences, and has been verified with JEDEC-compliant DIMMs in industrial temperature environments.

Is partial reconfiguration supported on the XCVU095-H1FFVA2104E?

Yes, the XCVU095-H1FFVA2104E fully supports partial reconfiguration through Vivado Design Suite, enabling dynamic module swapping without resetting the entire device. This capability is used in 5G baseband systems to switch between different waveform configurations while maintaining continuous RF link operation.

What thermal management is required for sustained operation of the XCVU095-H1FFVA2104E?

The XCVU095-H1FFVA2104E requires an active heatsink with ≥40 CFM airflow and thermal interface material (TIM) contacting the exposed thermal lid. Board layout must include 6-layer stackup with internal power/ground planes, and thermal vias under the package footprint to maintain junction temperature ≤100°C under full GTY and logic utilization.

How many PCIe Gen4 lanes does the XCVU095-H1FFVA2104E support?

The XCVU095-H1FFVA2104E integrates a hardened PCIe Gen4 x16 endpoint/root port controller. It supports full x16 configuration at 16 GT/s per lane, delivering 32 GB/s bidirectional bandwidth. Lane splitting (e.g., x8+x8 or x4+x4+x4+x4) is supported via configuration space programming in the PCIe hard IP block.