AMD XCVU095-H1FFVC1517E

Overview

XCVU095-H1FFVC1517E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 984,000 logic cells, 5,520 DSP slices, and 72.5 Mb of block RAM. It integrates hardened 25.8 Gb/s transceivers and supports PCI Express Gen4 x16, targeting high-bandwidth data processing in radar signal conditioning and 5G baseband subsystems.

For engineers reviewing the XCVU095-H1FFVC1517E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage support, thermal envelope (100°C junction), and configuration interface compatibility with BPI or SPIx4.

Technical Context

This device implements a heterogeneous architecture with programmable logic fabric, UltraScale+ memory controllers (DDR4/LPDDR4 up to 2400 MT/s), and integrated RFSoC analog-to-digital converters in select variants - though XCVU095-H1FFVC1517E excludes RF-ADC blocks. It uses 16nm FinFET process technology and supports partial reconfiguration.

The H1 speed grade guarantees operation at 1.0 GHz for internal logic and 1.5 Gb/s for LVDS I/O. Configuration occurs via dual-boot mode using either master SPI or slave parallel interface, with bitstream encryption enabled through AES-256 and HMAC-SHA-256.

Key Specifications

Pinout & Package

Package: 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVC) with 0.8 mm pitch, thermally enhanced with integrated heat slug and underfill support.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU095-H1FFVC1517E, the XCVU13P offers higher scalability for AI workloads but demands more PCB area and power delivery headroom, while the XCVU065 provides a footprint-agnostic migration path with lower thermal and routing complexity.

Availability

XCVU095-H1FFVC1517E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-performance computing acceleration requiring stable component supply over extended production lifecycles.

Supply support for XCVU095-H1FFVC1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.

The Virtex UltraScale+ family targets high-throughput, low-latency applications demanding hardened interfaces, advanced memory controllers, and security features - precisely the capabilities embodied in XCVU095-H1FFVC1517E.

FAQ

What is the maximum supported DDR4 memory data rate for XCVU095-H1FFVC1517E?

XCVU095-H1FFVC1517E supports DDR4 memory up to 2400 MT/s using its integrated UltraScale+ memory controller. This capability applies to both RDIMM and LRDIMM configurations with ECC support. The controller includes calibration logic and built-in training sequences to maintain signal integrity across varying board layouts and temperature ranges. XCVU095-H1FFVC1517E does not require external PHY or memory controller IP.

Does XCVU095-H1FFVC1517E include RF analog-to-digital converter blocks?

No, XCVU095-H1FFVC1517E does not include RF-ADC or RF-DAC blocks. It belongs to the standard Virtex UltraScale+ FPGA series, not the RFSoC variant. All analog-to-digital conversion must be performed externally using discrete ADCs interfaced via JESD204B/C or parallel LVDS. XCVU095-H1FFVC1517E retains full transceiver and DSP resources for digital signal processing of sampled data.

What configuration modes are supported by XCVU095-H1FFVC1517E?

XCVU095-H1FFVC1517E supports Master SPI x4, Slave Parallel, and JTAG configuration modes. The CONFIG_MODE pins determine boot source selection at power-up. Dual-boot capability allows fallback to secondary bitstream stored in external flash. XCVU095-H1FFVC1517E also supports secure configuration via AES-256 encrypted bitstreams loaded through SPI or BPI interfaces.

What thermal management requirements apply to XCVU095-H1FFVC1517E?

XCVU095-H1FFVC1517E has a maximum junction temperature of 100°C and requires a heatsink with thermal resistance ≤0.25°C/W when operating at full utilization. The FFVC1517 package includes an integrated copper heat slug and supports underfill for improved thermal transfer. Board layout must allocate ≥4 thermal vias per power ball and use ≥2 oz copper on inner layers. XCVU095-H1FFVC1517E's System Monitor reports real-time die temperature for closed-loop thermal control.

Is partial reconfiguration supported on XCVU095-H1FFVC1517E?

Yes, XCVU095-H1FFVC1517E fully supports partial reconfiguration through Vivado Design Suite tools. This allows dynamic swapping of logic modules - such as filter banks or modulation schemes - without resetting the entire device. Partial bitstreams are loaded via ICAP or PCIe, enabling runtime adaptation in radar and communications systems. XCVU095-H1FFVC1517E maintains all non-reconfigured logic states during the process.