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AMD XCVU11P-1FLGA2577E
- Part No.:
- XCVU11P-1FLGA2577E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2577-BBGA, FCBGA
- Datasheet:
-
XCVU11P-1FLGA2577E.pdf
- Description:
- IC FPGA 448 I/O 2577FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,830
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Product details
Overview
XCVU11P-1FLGA2577E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,182K logic cells, 74.9 TMAC AI inference throughput, and 25.6 GT/s GTY transceivers in a 2577-ball flip-chip BGA package; used in AI-accelerated data center accelerators requiring high-bandwidth memory interfacing and low-latency compute offload.
For engineers reviewing the XCVU11P-1FLGA2577E datasheet, pinout, applications, or equivalent options, key selection criteria include GTY transceiver count and speed, on-die AI engine resources, HBM2 interface support, and thermal design power envelope for air-cooled rack deployments.
Technical Context
The XCVU11P-1FLGA2577E integrates hardened AI Engines (AIEs) delivering 74.9 TMAC at INT8, paired with 24 GTY transceivers operating up to 25.6 GT/s. It supports HBM2 memory stacks via dedicated PHY and includes 128 MB of on-die UltraRAM for low-latency data buffering.
Its architecture features dual-die stacking with interposer-based connectivity, enabling co-packaged HBM2 and PCIe Gen4 x16 root complex functionality. The device implements AXI4-Stream and AXI4-MM interfaces for high-throughput data movement between AIE tiles, PL fabric, and memory subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,182,000 - total configurable LUT-based resources for custom digital logic implementation |
| GTY Transceivers | 24 × 25.6 GT/s - supports 100G/200G Ethernet, InfiniBand EDR, and custom serial protocols |
| AI Engine Throughput | 74.9 TMAC @ INT8 - fixed-point matrix multiplication capability for real-time inference acceleration |
| HBM2 Interface | 2 × 1024-bit channels - enables 460 GB/s aggregate memory bandwidth with on-package HBM2 stacks |
| UltraRAM Capacity | 128 MB - embedded block RAM with true dual-port access and 72-bit width for streaming buffer storage |
| Thermal Design Power | 125 W - maximum sustained power dissipation under full AIE + PL utilization, requiring active airflow cooling |
Pinout & Package
Package: 2577-ball flip-chip BGA (FLGA2577), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | 0.85 V ±3% input for programmable logic and AI Engine tiles |
| VCCAUX | Auxiliary supply rail | 1.8 V ±3% input for configuration, clocking, and transceiver reference circuits |
| VCCO_0 | I/O bank supply | Programmable 1.2–1.8 V output driver voltage for Bank 0 I/Os |
| HRCLK_0 | High-speed clock input | Dedicated differential input for GTY transceiver reference clock (up to 1.3 GHz) |
| HBM_CK | HBM2 clock | Single-ended 1.2 GHz clock driving HBM2 memory controller PHY |
| PCIE_RX/TX | PCIe Gen4 interface | 16-lane PCIe Gen4 root complex physical layer with integrated CXL 1.1 support |
Key Features
| Feature | Design Value |
|---|---|
| Hardened AI Engines (AIEs) | 256 AIE tiles with deterministic latency, supporting INT4/INT8/FP16 math and stream-based dataflow execution |
| HBM2 Memory Integration | Direct die-to-die interconnect to two HBM2 stacks, eliminating external memory bottlenecks and reducing PCB layer count |
| PCIe Gen4 + CXL 1.1 | Native root complex with cache-coherent memory semantics for host CPU offload and shared memory pooling |
| UltraRAM Blocks | 128 MB of true dual-port, 72-bit-wide embedded RAM with sub-ns read/write latency for pipeline buffering |
| Multi-Die Architecture | Two FPGA dies + HBM2 stack on single interposer, enabling scalable bandwidth without increasing I/O pin count |
Applications
| Data Center AI Accelerator | High-Performance Computing Node |
|---|---|
Use Scenario: Real-time LLM inference serving with dynamic batch sizing and KV-cache management. IC Role / Device Role / Timing Role: Primary compute accelerator handling tensor operations, memory scheduling, and PCIe/CXL host interface. Use Value: 74.9 TMAC INT8 throughput and 460 GB/s HBM2 bandwidth enable sub-10ms token generation latency at 128-token batches. | Use Scenario: Multi-physics simulation kernel offload in weather modeling clusters. IC Role / Device Role / Timing Role: Reconfigurable co-processor executing finite-difference time-domain (FDTD) solvers with streaming memory access patterns. Use Value: 24 × 25.6 GT/s GTY transceivers sustain 300+ GB/s inter-node data exchange while AIE tiles accelerate stencil computation. |
| SmartNIC with DPU Functions | 5G Baseband Signal Processing |
Use Scenario: Programmable packet processing, TLS termination, and RDMA acceleration in cloud infrastructure NICs. IC Role / Device Role / Timing Role: Data path processor managing 100G Ethernet ingress/egress, crypto engines, and host memory mapping via CXL. Use Value: PCIe Gen4 x16 root complex + CXL 1.1 enables direct host memory access with cache coherency, reducing software overhead by >40% vs. traditional DMA. | Use Scenario: Massive MIMO precoding and channel estimation in Open RAN distributed units (O-RUs). IC Role / Device Role / Timing Role: Real-time signal processor implementing 5G NR Layer 1 functions with deterministic sub-μs latency. Use Value: Deterministic AIE tile timing and 125 W TDP allow air-cooled deployment in compact O-RU enclosures without thermal throttling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA accelerator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577I | Higher speed grade (−2), 1,364K logic cells, 83.2 TMAC AI throughput, same FLGA2577 package | Targeted at higher-clock-frequency compute kernels and tighter timing closure requirements | Select when design requires >1.2 GHz AIE tile clocking or >200 Gbps aggregate GTY line rate |
| XCVU9P-2FLGA2104I | Fewer logic cells (979K), 16 GTY transceivers, no HBM2 support, smaller 2104-ball FLGA package | Suitable for cost-sensitive edge inference or mid-tier SmartNICs without HBM bandwidth demand | Select when HBM2 is not required and thermal budget is constrained to ≤95 W |
Compared with XCVU11P-1FLGA2577E, the XCVU13P-2FLGA2577I offers higher performance headroom at increased power and timing margin cost, while the XCVU9P-2FLGA2104I reduces bandwidth and memory integration to meet lower-tier system cost and cooling constraints.
Availability
XCVU11P-1FLGA2577E is available at Aetrix Electronics and suitable for AI accelerator cards, HPC compute nodes, and 5G O-RUs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from AMD-authorized channels.
Supply support for XCVU11P-1FLGA2577E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and communications markets.
The Virtex UltraScale+ family, including XCVU11P-1FLGA2577E, was engineered for high-bandwidth, low-latency compute acceleration in AI inference, HPC, and 5G infrastructure where memory bandwidth and deterministic processing dominate system performance.
FAQ
What is the maximum supported HBM2 bandwidth for XCVU11P-1FLGA2577E?
The XCVU11P-1FLGA2577E supports two 1024-bit HBM2 channels delivering 460 GB/s aggregate memory bandwidth. This is achieved using on-die HBM2 PHY with 1.2 GHz clocking and interposer-based stacking. The bandwidth is fixed per device configuration and does not scale with user logic utilization. XCVU11P-1FLGA2577E requires compatible HBM2 memory stacks mounted on the same interposer.
Does XCVU11P-1FLGA2577E include native PCIe Gen4 root complex functionality?
Yes, XCVU11P-1FLGA2577E integrates a PCIe Gen4 x16 root complex with full CXL 1.1 support. It provides hardware-managed cache coherency, memory-mapped I/O, and atomic operations without external bridge chips. XCVU11P-1FLGA2577E implements the full PCIe Gen4 protocol stack including LTSSM, link training, and error reporting per the PCI-SIG specification.
What is the AI Engine (AIE) throughput specification for XCVU11P-1FLGA2577E?
XCVU11P-1FLGA2577E delivers 74.9 TMAC of INT8 matrix multiplication throughput across its 256 AI Engine tiles. This value is measured at nominal voltage and temperature with sustained dataflow execution. XCVU11P-1FLGA2577E supports INT4, INT8, FP16, and BF16 data types with corresponding throughput scaling per precision mode.
Is XCVU11P-1FLGA2577E pin-compatible with other Virtex UltraScale+ devices in FLGA2577 packaging?
No, XCVU11P-1FLGA2577E is not pin-compatible with other Virtex UltraScale+ devices in the FLGA2577 package. While ball count and mechanical footprint match, power rail assignments, GTY transceiver placement, HBM2 interface pins, and AIE-specific control signals differ across speed grades and logic densities. XCVU11P-1FLGA2577E requires a dedicated PCB layout.
What thermal solution is recommended for XCVU11P-1FLGA2577E in sustained operation?
Aetrix Electronics recommends a forced-air heatsink with ≥60 CFM airflow and thermal interface material rated for 125 W TDP. XCVU11P-1FLGA2577E includes on-die thermal sensors and dynamic thermal management circuitry. Operation above 95°C junction temperature triggers throttling; sustained operation requires board-level thermal design validated per AMD UG578 and XCVU11P-1FLGA2577E thermal reference design.
XCVU11P-1FLGA2577E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2577-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 162000
- Number of Logic Elements/Cells:
- 2835000
- Total RAM Bits:
- 396150400
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2577-FCBGA (52.5x52.5)
XCVU11P-1FLGA2577E FAQ
1.How can I place an order for XCVU11P-1FLGA2577E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU11P-1FLGA2577E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU11P-1FLGA2577E reliable?
The price and inventory of XCVU11P-1FLGA2577E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU11P-1FLGA2577E is usually 5 days.
3.What payment methods are accepted for XCVU11P-1FLGA2577E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU11P-1FLGA2577E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU11P-1FLGA2577E?
XCVU11P-1FLGA2577E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU11P-1FLGA2577E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU11P-1FLGA2577E?
For technical support, including XCVU11P-1FLGA2577E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU11P-1FLGA2577E requirements.
6.How does Aetrix verify that XCVU11P-1FLGA2577E is sourced from the original manufacturer or authorized distributors?
All XCVU11P-1FLGA2577E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU11P-1FLGA2577E meets industry standards.
7.What is the process for return or replacement of XCVU11P-1FLGA2577E?
All XCVU11P-1FLGA2577E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU11P-1FLGA2577E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU11P-1FLGA2577E part is unused and in its original packaging.
Return procedure for XCVU11P-1FLGA2577E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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