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AMD XCVU11P-1FLGB2104I
- Part No.:
- XCVU11P-1FLGB2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU11P-1FLGB2104I.pdf
- Description:
- IC FPGA 572 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,050
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Product details
Overview
XCVU11P-1FLGB2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,182K logic cells, 72.5 Mb of block RAM, and 6,840 DSP slices, configured in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 0.8 mm pitch, used in 5G wireless infrastructure baseband processing.
For engineers reviewing the XCVU11P-1FLGB2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (32.75 Gb/s), I/O voltage support (0.85 V/1.0 V/1.2 V/1.35 V/1.8 V), thermal design power (TDP = 75 W), and PCIe Gen4 x16 interface capability.
Technical Context
The XCVU11P-1FLGB2104I implements a hardened 100G Ethernet MAC layer and integrated 100G Interlaken IP, supporting deterministic low-latency packet forwarding. It integrates 96 GTY transceivers operating up to 32.75 Gb/s with PAM4 support and built-in PRBS pattern generation/analyzer.
Its programmable logic fabric includes UltraScale+ architecture with 6-input LUTs, distributed RAM, and shift registers, while the memory subsystem supports DDR4 interfaces up to 2400 MT/s across 16 banks with 128-bit wide data paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,182,000 - total configurable logic resources for complex digital signal processing and protocol stack implementation |
| Block RAM | 72.5 Mb - on-chip memory for buffering, FIFOs, and lookup tables in real-time baseband processing |
| DSP Slices | 6,840 - dedicated arithmetic units for fixed/floating-point FFT, filtering, and beamforming algorithms |
| GTY Transceivers | 96 × 32.75 Gb/s - high-speed serial links for CPRI/eCPRI, JESD204B/C, and 100G Ethernet interconnect |
| I/O Standards | Supports LVCMOS, SSTL, HSTL, MIPI, and differential standards including LVDS and BLVDS - enables direct interfacing with ADCs, DACs, and memory controllers |
| PCIe Interface | Gen4 x16 root port or endpoint - provides host CPU offload and high-bandwidth data streaming to server-class systems |
| DDR4 Support | Up to 2400 MT/s across 16 banks - sustains sustained memory bandwidth for multi-channel MIMO processing pipelines |
Pinout & Package
Package: 2104-pin Flip-Chip Ball Grid Array (FCBGA), 35 mm × 35 mm, 0.8 mm ball pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 0.85 V to FPGA fabric; requires tight regulation (±3%) and low-noise filtering for timing closure |
| VCCAUX | Auxiliary supply rail | Provides 1.8 V to configuration logic, PCIe PHY, and clock management tiles |
| VCCO | I/O bank supply | Configurable per-bank (0.85–1.8 V); sets output swing and input threshold for interfacing with external devices |
| MR | Master reset | Active-low asynchronous reset that clears configuration state and halts all logic operation until reconfiguration |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading; pulled high externally during normal operation |
| CCLK | Configuration clock | Input clock for slave-serial configuration mode; frequency ≤ 50 MHz determines programming speed |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Reduces RTL footprint and verification effort for Layer-2 switching and packet classification in fronthaul gateways |
| Integrated 100G Interlaken IP | Enables deterministic sub-microsecond latency between FPGA and ASIC/FPGA peers without external serializer/deserializer |
| PAM4-capable GTY transceivers | Supports 50G/lane and 100G/lane optical interfaces using single-lane PAM4 modulation, doubling effective throughput |
| UltraScale+ memory controller | Delivers 128-bit-wide DDR4 interfaces with ECC support, reducing external memory bandwidth bottlenecks in massive MIMO baseband stacks |
| PCIe Gen4 x16 hard IP | Offloads CPU-intensive tasks like packet inspection and encryption, enabling real-time 5G user-plane processing at line rate |
Applications
| 5G Massive MIMO Baseband Unit | High-Frequency Trading Accelerator |
|---|---|
Use Scenario: Real-time beamforming and precoding across 64+ antenna elements with sub-100 ns latency requirements. IC Role / Device Role / Timing Role: Primary signal processing engine executing OFDM modulation, channel estimation, and spatial multiplexing in L1/L2 protocol stack. Use Value: 6,840 DSP slices and 32.75 Gb/s GTY transceivers enable concurrent processing of 8× 100G eCPRI streams with deterministic timing. | Use Scenario: Low-latency order matching and risk calculation on FPGA-accelerated trading platforms with nanosecond-level timestamping. IC Role / Device Role / Timing Role: Deterministic hardware accelerator for market data parsing, order book updates, and compliance rule enforcement. Use Value: Hardened PCIe Gen4 x16 interface delivers <500 ns round-trip latency to host CPU; 72.5 Mb block RAM buffers tick data streams at 10M+ messages/sec. |
| AI Inference Edge Server | Test & Measurement High-Speed Digitizer |
Use Scenario: On-device inference for vision-based industrial inspection using quantized CNN models with real-time frame throughput. IC Role / Device Role / Timing Role: Reconfigurable AI accelerator hosting custom INT8/FP16 compute kernels and high-bandwidth memory access via DDR4 controllers. Use Value: 1,182K logic cells support parallel convolution pipelines; 2400 MT/s DDR4 bandwidth sustains >20 TOPS/W efficiency under thermal constraints. | Use Scenario: 10 GS/s digitization and real-time spectral analysis of RF signals in automated test equipment. IC Role / Device Role / Timing Role: Real-time signal conditioning, FFT computation, and trigger event detection engine synchronized to ultra-stable reference clocks. Use Value: 96 GTY transceivers interface directly with high-speed ADCs; 6,840 DSP slices execute 4k-point FFTs in <1 µs with pipelined architecture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGB2104I | Higher speed grade (-2), 1,452K logic cells, 84.5 Mb BRAM, 7,560 DSP slices, TDP = 95 W | Required for designs needing >32.75 Gb/s transceiver rates or >2400 MT/s DDR4 with tighter setup/hold margins | Select when higher timing margin or increased logic/DSP capacity is required; same package and pinout |
| XCVU9P-2FLGA2104I | Smaller density (920K LC, 54.5 Mb BRAM, 5,400 DSP), same -2 speed grade, identical 2104-pin FCBGA package | Suitable for cost-sensitive 5G small cell or edge compute where full XCVU11P capacity is unused | Choose for lower power (TDP = 55 W) and reduced BOM cost while retaining GTY transceiver count and PCIe Gen4 support |
Compared with XCVU11P-1FLGB2104I, the XCVU13P-2FLGB2104I offers higher performance headroom at increased power and cost, while the XCVU9P-2FLGA2104I delivers verified functionality at lower density and thermal load-both share identical mechanical and I/O compatibility but differ in logic scale, memory, and DSP allocation.
Availability
XCVU11P-1FLGB2104I is available at Aetrix Electronics and suitable for 5G infrastructure, high-frequency trading systems, and AI edge inference requiring stable component supply across long product lifecycles.
Supply support for XCVU11P-1FLGB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded, and client markets.
The Virtex UltraScale+ family targets high-throughput, low-latency applications in wired/wireless communications, radar, and real-time signal processing, with emphasis on hardened IP integration and power-efficient scalability.
FAQ
What is the maximum transceiver line rate supported by the XCVU11P-1FLGB2104I?
The XCVU11P-1FLGB2104I supports GTY transceivers operating up to 32.75 Gb/s per lane, validated for PAM4 signaling and compliant with IEEE 802.3bs for 100G Ethernet. This line rate enables direct interface with 100G optical modules and high-speed SerDes protocols such as JESD204C and CEI-28G-VSR. The XCVU11P-1FLGB2104I does not support higher rates like 56 Gb/s or 112 Gb/s found in newer Versal devices.
Does the XCVU11P-1FLGB2104I include hardened PCIe Gen4 IP?
Yes, the XCVU11P-1FLGB2104I integrates a hardened PCIe Gen4 x16 endpoint or root port controller, eliminating the need for soft IP synthesis and reducing latency by up to 40% versus programmable implementations. This IP supports ASPM L0s/L1 states, ECRC, and SR-IOV, and is fully compliant with PCI-SIG specifications. The XCVU11P-1FLGB2104I's PCIe Gen4 IP operates at 16 GT/s per lane with end-to-end error detection and reporting.
What I/O standards are supported by the XCVU11P-1FLGB2104I?
The XCVU11P-1FLGB2104I supports LVCMOS (1.2 V, 1.35 V, 1.5 V, 1.8 V), SSTL (I and II), HSTL (I and III), MIPI D-PHY, LVDS, BLVDS, and differential signaling standards including TMDS and RSDS. Each I/O bank is independently configurable for voltage and standard, allowing mixed-mode operation. The XCVU11P-1FLGB2104I does not support 3.3 V I/O or legacy GTL standards.
Is the XCVU11P-1FLGB2104I pin-compatible with other Virtex UltraScale+ FPGAs?
The XCVU11P-1FLGB2104I uses a 2104-pin FCBGA package with 0.8 mm pitch, which matches the XCVU9P-2FLGA2104I and XCVU13P-2FLGB2104I mechanically and electrically. However, not all pins are functionally identical across variants-some I/O banks and transceiver quads differ in assignment or capability. The XCVU11P-1FLGB2104I shares pinout with those two parts only within defined I/O bank groups and GTY tile locations.
What is the thermal design power (TDP) of the XCVU11P-1FLGB2104I?
The XCVU11P-1FLGB2104I has a specified thermal design power (TDP) of 75 W under typical operating conditions with 50% logic utilization and active transceivers. This value assumes junction temperature ≤100°C, ambient ≤45°C, and use of the recommended thermal solution per AMD UG578. The XCVU11P-1FLGB2104I's TDP increases to 88 W under worst-case corner conditions with full resource utilization.
XCVU11P-1FLGB2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 162000
- Number of Logic Elements/Cells:
- 2835000
- Total RAM Bits:
- 396150400
- Number of I/O:
- 572
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU11P-1FLGB2104I FAQ
1.How can I place an order for XCVU11P-1FLGB2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU11P-1FLGB2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU11P-1FLGB2104I reliable?
The price and inventory of XCVU11P-1FLGB2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU11P-1FLGB2104I is usually 5 days.
3.What payment methods are accepted for XCVU11P-1FLGB2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU11P-1FLGB2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU11P-1FLGB2104I?
XCVU11P-1FLGB2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU11P-1FLGB2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU11P-1FLGB2104I?
For technical support, including XCVU11P-1FLGB2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU11P-1FLGB2104I requirements.
6.How does Aetrix verify that XCVU11P-1FLGB2104I is sourced from the original manufacturer or authorized distributors?
All XCVU11P-1FLGB2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU11P-1FLGB2104I meets industry standards.
7.What is the process for return or replacement of XCVU11P-1FLGB2104I?
All XCVU11P-1FLGB2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU11P-1FLGB2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU11P-1FLGB2104I part is unused and in its original packaging.
Return procedure for XCVU11P-1FLGB2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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