AMD XCVU11P-1FLGC2104E

Overview

XCVU11P-1FLGC2104E from Xilinx is a high-performance Virtex UltraScale+ FPGA featuring 3.6M system logic cells, 38 TOP/s DSP compute performance, and support for up to 48× 58 Gb/s PAM4 transceivers - enabling multi-terabit packet processing in data center accelerators and wired communications infrastructure.

For engineers reviewing the XCVU11P-1FLGC2104E datasheet, pinout, applications, or equivalent options, key selection criteria include HBM Gen2 integration capability, PCIe Gen3 x16 block availability, 100G Ethernet MAC with KR4-FEC, SmartConnect interconnect optimization, and 16nm FinFET+ process-based power efficiency.

Technical Context

The XCVU11P-1FLGC2104E implements the ASIC-class UltraScale+ architecture with monolithic 16nm FinFET+ process technology, delivering 1.6× higher fabric performance than Virtex-7 and supporting VCXO/fractional PLL integration for clocking subsystem simplification. It includes hardened 100G Ethernet MAC and 150G Interlaken cores, plus integrated PCI Express Gen3 x16 blocks with CCIX cache-coherent ports.

SmartConnect IP interconnect optimization automatically bridges AXI interfaces and matches optimal interconnect topology to design requirements, yielding 20–30% additional performance-per-watt. The device supports DDR4 at 2666 Mb/s and offers up to 460 GB/s HBM Gen2 bandwidth when configured with integrated memory.

Key Specifications

Pinout & Package

The XCVU11P-1FLGC2104E is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm ball pitch, optimized for high-speed signal integrity and thermal dissipation in dense compute modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU11P-1FLGC2104E, the XCVU13P-2FLGA2577E provides headroom for future bandwidth scaling, while the XCVU9P-2FLGA2104I trades performance for environmental robustness - both require board redesign due to non-identical pinouts and power delivery requirements.

Availability

XCVU11P-1FLGC2104E is available at Aetrix Electronics and suitable for data center acceleration, 5G baseband processing, and multi-terabit optical transport systems requiring stable component supply and long-term lifecycle assurance.

Supply support for XCVU11P-1FLGC2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic and adaptive computing solutions, delivering FPGA, ACAP, and SoC platforms since 1984.

The Virtex UltraScale+ product line targets high-bandwidth, low-latency infrastructure applications including cloud acceleration, wired/wireless communications, and defense signal processing - co-optimized with Vivado Design Suite for rapid system integration.

FAQ

What is the maximum supported transceiver data rate for XCVU11P-1FLGC2104E?

XCVU11P-1FLGC2104E supports up to 58 Gb/s per lane using PAM4 signaling across its 48 dedicated transceiver quads. In NRZ mode, it operates at up to 32.75 Gb/s per lane. These rates are validated under the -1 speed grade and require proper PCB stackup, controlled impedance routing, and reference clock jitter below 500 fs RMS.

Does XCVU11P-1FLGC2104E include integrated high-bandwidth memory (HBM)?

XCVU11P-1FLGC2104E does not integrate HBM Gen2 memory - that option is available only on the XCVU11P-H1FLGC2104E variant. The standard XCVU11P-1FLGC2104E retains all other UltraScale+ features including hardened 100G Ethernet MAC, PCIe Gen3 x16, and SmartConnect, but relies on external DDR4 or LPDDR4 memory interfaces.

What package type and pin count does XCVU11P-1FLGC2104E use?

XCVU11P-1FLGC2104E uses a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm ball pitch and thermal lid. This package supports high-speed I/O, thermal dissipation up to 75 W typical, and is compatible with industry-standard reflow profiles for automated assembly.

Can XCVU11P-1FLGC2104E implement PCIe Gen4 interfaces?

No, XCVU11P-1FLGC2104E includes only hardened PCIe Gen3 x16 blocks. It does not support native Gen4 signaling. Achieving Gen4 speeds would require external retimers or SerDes bridging ICs, which add latency and power overhead - unlike newer Versal ACAP devices that natively support PCIe Gen5.

What clocking resources are available in XCVU11P-1FLGC2104E?

XCVU11P-1FLGC2104E integrates multiple Mixed-Mode Clock Managers (MMCMs) and Phase-Locked Loops (PLCs), including fractional-N PLLs and VCXO support. These provide jitter cleaning, frequency synthesis, and phase alignment for transceivers, memory interfaces, and logic fabric - all accessible via Vivado's clocking wizard without external components.