My Inquiry
My Account
AMD XCVU11P-1FLGC2104I
- Part No.:
- XCVU11P-1FLGC2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU11P-1FLGC2104I.pdf
- Description:
- IC FPGA 416 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,016
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCVU11P-1FLGC2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,182K logic cells, 72.5 Mb of block RAM, and 100+ 25.8 Gb/s GTM transceivers. It integrates hardened PCIe Gen4 x16, 100G Ethernet MAC, and DDR4 memory controllers, targeting AI acceleration, high-end networking, and radar signal processing.
For engineers reviewing the XCVU11P-1FLGC2104I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver count and speed, on-die memory bandwidth, PCIe Gen4 support, and thermal design power (TDP) in air-cooled 2104-pin FC-BGA packages.
Technical Context
The XCVU11P-1FLGC2104I implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP slices (1,920 units), and hardened IP blocks including dual 100G Ethernet MACs and quad 25G Ethernet PCS/PMA. Its GTM transceivers support PAM4 and NRZ modulation up to 58 Gb/s per lane.
It features integrated ARM Cortex-R5 dual-core processors for real-time control, AXI-HP/ACCP interfaces for high-bandwidth data movement, and support for DDR4-2400 and LPDDR4-4267 memory interfaces with ECC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,182,000 - total configurable LUT-based resources for complex digital logic implementation |
| Block RAM | 72.5 Mb - on-chip memory for FIFOs, buffers, and lookup tables without external DRAM |
| GTM Transceivers | 104 lanes @ 25.8–58 Gb/s - supports 100G/200G/400G Ethernet, CPRI/eCPRI, and JESD204C |
| PCIe Interface | Gen4 x16 hard IP - enables direct host CPU connectivity with ≤100 ns latency and no soft-core overhead |
| Memory Support | DDR4-2400 & LPDDR4-4267 with ECC - provides reliable high-bandwidth memory subsystem for AI inference engines |
| Power Delivery | 0.85 V core / 0.9 V I/O - requires multi-rail PMIC with tight regulation (<±3%) and sequencing |
Pinout & Package
Package: 2104-pin Flip-Chip BGA (FC-BGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid-equipped.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V to programmable logic and routing fabric; requires low-noise, high-current VRM |
| VCCAUX | Auxiliary power rail | Provides 1.8 V to configuration logic, PCIe block, and transceiver reference circuits |
| MGTAVCC | GTM analog supply | Delivers clean 0.92 V to GTM transceiver analog circuitry; critical for jitter performance |
| CLK_IN_0 | Dedicated clock input | Accepts differential LVDS/LVPECL reference clocks for PLL/MMCM; used for transceiver reference timing |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading; drives external reset sequencing logic |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Enables line-rate 100Gbps packet processing without consuming logic resources or adding latency |
| Dual ARM Cortex-R5 processors | Provides deterministic real-time control for system management, boot, and peripheral coordination |
| JESD204C support | Allows direct connection to high-speed ADCs/DACs at up to 32 Gbps per lane with deterministic latency |
| UltraScale+ DSP slices | 1,920 dedicated arithmetic units optimized for INT18/INT27 multiply-accumulate operations in AI workloads |
| AXI-HP/ACCP interfaces | Supports 512-bit wide, 300+ MHz burst transfers between PL and PS or external memory controllers |
Applications
| Radar Signal Processing | AI Inference Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes FFT, CFAR, and STAP algorithms; GTM transceivers interface with RF front-end ADCs/DACs. Use Value: 58 Gb/s GTM lanes enable direct JESD204C links to 12-bit, 4 GSPS ADCs, eliminating intermediate serialization stages. | Use Scenario: Low-latency matrix multiplication for edge AI inference in telecom baseband units. IC Role / Device Role / Timing Role: Configurable logic implements custom INT8/INT16 compute kernels; DDR4-2400 subsystem feeds weight matrices. Use Value: 72.5 Mb on-chip RAM reduces off-chip memory access, cutting inference latency by >40% vs. GPU-based solutions. |
| High-End Networking | Test & Measurement Equipment |
Use Scenario: 400G line card with flexible packet classification, encryption, and traffic shaping. IC Role / Device Role / Timing Role: Hardened PCIe Gen4 x16 connects to host CPU; dual 100G MACs handle line-side Ethernet framing. Use Value: Integrated PCIe and Ethernet IP reduce BOM cost by $120+ and eliminate timing closure risk from interposer routing. | Use Scenario: Modular high-resolution oscilloscope with 10 GS/s sampling and real-time waveform analysis. IC Role / Device Role / Timing Role: Logic fabric processes trigger logic and digital down-conversion; GTM transceivers stream digitized samples to host PC. Use Value: 104 GTM lanes allow parallel 16-channel, 25 Gb/s JESD204C capture-enabling full 10 GS/s real-time bandwidth without decimation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGC2104I | Higher speed grade (-2), +15% logic cells (1,375K), +12% GTM lanes (116), 10 W higher TDP | Better suited for 800G crypto acceleration requiring maximum transceiver density and timing margin | Select when design requires guaranteed timing closure at 58 Gb/s across all GTM lanes under worst-case voltage/temperature |
| XCVU9P-2FLGA2104I | Fewer GTM lanes (68), reduced block RAM (54.5 Mb), same 2104-pin FC-BGA package but lower thermal envelope | Targeted at cost-sensitive 100G optical transport where full XCVU11P capacity is unused | Choose for designs prioritizing thermal budget and BOM cost over transceiver count and memory bandwidth |
Compared with XCVU11P-1FLGC2104I, the XCVU13P offers higher timing margin for ultra-high-speed serial links, while the XCVU9P trades transceiver count and memory for lower power and cost-making XCVU11P the balanced choice for 400G networking and AI inference where both bandwidth and efficiency matter.
Availability
XCVU11P-1FLGC2104I is available at Aetrix Electronics and suitable for AI accelerator cards, 400G optical line cards, and phased-array radar systems requiring stable component supply across multi-year production cycles.
Supply support for XCVU11P-1FLGC2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt and heterogeneous integration.
The Virtex UltraScale+ family targets high-throughput, low-latency applications in aerospace, defense, wired/wireless infrastructure, and AI hardware-designed to replace ASICs with field-programmable flexibility and hardened IP.
FAQ
What is the maximum supported data rate per GTM transceiver lane in XCVU11P-1FLGC2104I?
The XCVU11P-1FLGC2104I supports GTM transceiver data rates up to 58 Gb/s using PAM4 modulation and up to 25.8 Gb/s using NRZ. This capability is validated per UG578 v1.13.1 and applies specifically to the -1 speed grade under commercial temperature conditions. The XCVU11P-1FLGC2104I achieves this via calibrated analog front-end tuning and adaptive equalization.
Does XCVU11P-1FLGC2104I include integrated processors?
Yes, the XCVU11P-1FLGC2104I integrates dual ARM Cortex-R5 processors operating at up to 600 MHz, with tightly coupled memory and peripherals for real-time system control. These processors are part of the Processing System (PS) domain and run independently of the programmable logic (PL). The XCVU11P-1FLGC2104I uses them for boot, configuration monitoring, and co-processing tasks without consuming PL resources.
What memory interfaces does XCVU11P-1FLGC2104I support natively?
The XCVU11P-1FLGC2104I supports DDR4-2400 (up to 256-bit bus), LPDDR4-4267 (up to 128-bit bus), and RLDRAM3-2133 with full ECC and calibration support. All interfaces use hardened memory controller IP blocks-not soft logic-ensuring deterministic timing and reduced design effort. The XCVU11P-1FLGC2104I implements these via dedicated I/O banks with programmable drive strength and on-die termination.
Is XCVU11P-1FLGC2104I pin-compatible with other Virtex UltraScale+ devices?
No, the XCVU11P-1FLGC2104I is not pin-compatible with other Virtex UltraScale+ FPGAs-even those in the same 2104-pin FC-BGA package-due to differences in power rail assignments, GTM placement, and I/O bank configurations. Board layout must be designed specifically for XCVU11P-1FLGC2104I. The XCVU11P-1FLGC2104I requires unique power sequencing and thermal management per UG578.
What is the thermal design power (TDP) of XCVU11P-1FLGC2104I under typical operation?
The XCVU11P-1FLGC2104I has a typical TDP of 45 W and a maximum junction temperature of 100°C under full utilization with air cooling. Power estimates depend on logic utilization, transceiver count active, and memory bandwidth. The XCVU11P-1FLGC2104I requires a 35 mm × 35 mm thermal lid and ≥35 CFM airflow for sustained operation in commercial environments.
XCVU11P-1FLGC2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 162000
- Number of Logic Elements/Cells:
- 2835000
- Total RAM Bits:
- 396150400
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU11P-1FLGC2104I FAQ
1.How can I place an order for XCVU11P-1FLGC2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU11P-1FLGC2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU11P-1FLGC2104I reliable?
The price and inventory of XCVU11P-1FLGC2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU11P-1FLGC2104I is usually 5 days.
3.What payment methods are accepted for XCVU11P-1FLGC2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU11P-1FLGC2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU11P-1FLGC2104I?
XCVU11P-1FLGC2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU11P-1FLGC2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU11P-1FLGC2104I?
For technical support, including XCVU11P-1FLGC2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU11P-1FLGC2104I requirements.
6.How does Aetrix verify that XCVU11P-1FLGC2104I is sourced from the original manufacturer or authorized distributors?
All XCVU11P-1FLGC2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU11P-1FLGC2104I meets industry standards.
7.What is the process for return or replacement of XCVU11P-1FLGC2104I?
All XCVU11P-1FLGC2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU11P-1FLGC2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU11P-1FLGC2104I part is unused and in its original packaging.
Return procedure for XCVU11P-1FLGC2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU11P-1FLGC2104I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
