AMD XCVU11P-2FLGB2104E

Overview

XCVU11P-2FLGB2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,182K logic cells, 7,520 DSP slices, and 96.4 Mb of block RAM; it supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces for data center acceleration and high-end networking applications.

For engineers reviewing the XCVU11P-2FLGB2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count (64), I/O voltage support (1.2V/1.35V/1.8V), thermal design power (TDP) of 75W, and FLGB2104 package compatibility with high-density interconnect PCBs.

Technical Context

The XCVU11P-2FLGB2104E implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and ultra-low-latency transceivers operating up to 25.78125 Gb/s. It integrates 128 GTY transceiver quads and supports PAM4 signaling in select configurations.

Configuration is performed via dual BPI NOR flash or JTAG, with bitstream encryption using AES-256 and HMAC-SHA-256. The device includes integrated system monitoring (temperature, voltage, current) and supports partial reconfiguration for dynamic function swapping.

Key Specifications

Pinout & Package

The XCVU11P-2FLGB2104E is housed in a 2104-ball flip-chip BGA (FLGB2104) package with 0.8 mm ball pitch, designed for high-speed routing, low-inductance power delivery, and thermal management in dense compute modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA acceleration applications.

Compared with XCVU11P-2FLGB2104E, the XCVU13P offers greater compute headroom for future-proofing in harsh environments, while the XCVU9P reduces cost and power at the expense of transceiver count and DSP capacity-both require validation of timing closure and thermal margin in final design.

Availability

XCVU11P-2FLGB2104E is available at Aetrix Electronics and suitable for data center acceleration, 5G infrastructure, and high-frequency trading systems requiring stable component supply and long-term production continuity.

Supply support for XCVU11P-2FLGB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms, including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.

The Virtex UltraScale+ family delivers high-bandwidth, low-latency programmable logic for infrastructure acceleration, targeting applications demanding hardened connectivity, memory bandwidth, and security features.

FAQ

What is the maximum transceiver data rate supported by the XCVU11P-2FLGB2104E?

The XCVU11P-2FLGB2104E supports GTY transceivers operating up to 25.78125 Gb/s per lane. This rate enables compliance with PCIe Gen4, 100G Ethernet (4×25G), and CPRI/eCPRI protocols. Actual achievable data rates depend on PCB stackup, channel loss, and reference clock stability. The XCVU11P-2FLGB2104E datasheet specifies this limit under standard operating conditions with recommended power delivery and thermal management.

Does the XCVU11P-2FLGB2104E include hardened PCIe Gen4 controllers?

Yes, the XCVU11P-2FLGB2104E integrates hardened PCIe Gen4 root port and endpoint controllers supporting x16 lane width. These blocks handle physical layer signaling, link training, and power management (ASPM) without consuming programmable logic resources. The XCVU11P-2FLGB2104E uses these controllers for direct CPU-FPGA interconnect in acceleration cards and smart NICs.

What package type and ball count does the XCVU11P-2FLGB2104E use?

The XCVU11P-2FLGB2104E uses the FLGB2104 package: a 2104-ball flip-chip BGA with 0.8 mm pitch. This package supports high-speed signal routing, thermal dissipation via solder bumps and thermal vias, and mechanical reliability in high-vibration environments. The XCVU11P-2FLGB2104E FLGB2104 footprint is distinct from FLGA2104 and requires specific land pattern and stencil design.

Can the XCVU11P-2FLGB2104E perform partial reconfiguration?

Yes, the XCVU11P-2FLGB2104E supports partial reconfiguration, allowing dynamic replacement of logic modules while the rest of the design remains operational. This capability is implemented through dedicated configuration logic and frame-based bitstream addressing. The XCVU11P-2FLGB2104E enables runtime adaptation in radar systems, protocol gateways, and multi-standard wireless base stations without system reset.

What security features are implemented in the XCVU11P-2FLGB2104E?

The XCVU11P-2FLGB2104E includes AES-256 bitstream encryption, HMAC-SHA-256 authentication, and secure boot with eFUSE key storage. These features protect intellectual property and ensure trusted configuration. The XCVU11P-2FLGB2104E leverages on-die security monitors to detect tampering and enforce secure update policies in financial and defense applications.