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AMD XCVU11P-2FLGB2104I
- Part No.:
- XCVU11P-2FLGB2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU11P-2FLGB2104I.pdf
- Description:
- IC FPGA 572 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,698
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Product details
Overview
XCVU11P-2FLGB2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,182K logic cells, 7,520 DSP slices, and 96.4 Mb of block RAM. It integrates hardened 25.8 Gb/s transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, 5G baseband processing, and high-end radar signal conditioning.
For engineers reviewing the XCVU11P-2FLGB2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal design power envelope, and configuration interface options (e.g., dual-boot QSPI).
Technical Context
The XCVU11P-2FLGB2104I implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and ultra-low-latency AXI interconnect. Its -2 speed grade guarantees timing closure at 25.8 Gb/s per transceiver lane with ≤1.5 ps RMS jitter.
It supports multi-voltage I/O banks (1.8 V, 1.5 V, 1.35 V, 1.2 V) and includes integrated system monitoring (on-die temperature, supply voltage, current). Configuration is performed via Master SPI or BPI mode using 32-bit addressable QSPI flash.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,182,000 - determines maximum combinational/sequential logic capacity for custom datapaths |
| DSP Slices | 7,520 - enables parallel fixed/floating-point computation for matrix operations and filtering |
| Block RAM | 96.4 Mb - supports large on-chip buffering for video frame stores or packet queues |
| Transceivers | 64 lanes @ 25.8 Gb/s - delivers 164.5 Gb/s aggregate serial bandwidth for optical or backplane interfaces |
| I/O Pins | 832 user I/O - provides high-density connectivity with support for MIPI, LVDS, and SSTL standards |
| Speed Grade | -2 - ensures guaranteed timing performance at highest operating frequencies and worst-case process corners |
| Configuration Interface | Master SPI / BPI - enables secure, field-upgradable bitstream loading from QSPI flash |
Pinout & Package
This device is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 × 35 mm body size and 0.8 mm pitch. Thermal and mechanical data comply with JEDEC MO-271AC.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-Function I/O | Configurable as GPIO, SDIO, UART, SPI, or CAN FD controller pins for peripheral interfacing |
| HP[0:63] | High-Performance I/O Bank | Supports 1.8 V/1.5 V/1.35 V/1.2 V signaling with programmable slew rate and termination |
| GTYP[0:63] | Transceiver Quad | Each group contains 4 transceiver lanes with shared reference clock and power domains |
| VRP/VRN | Reference Voltage Pairs | Provide precision internal reference for differential input receivers in HP banks |
| CONFIG_IO | Configuration Control | Active-low pin that initiates fallback configuration from secondary QSPI image on boot failure |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Controller | Reduces RTL integration effort and guarantees compliance with ECN-based protocol extensions |
| UltraScale+ Memory Controller | Supports DDR4-2400 and LPDDR4-4266 with ECC, enabling reliable memory subsystems up to 512 GB |
| Integrated 100G Ethernet MAC | Offloads MAC-layer processing from CPU, reducing latency for time-sensitive networking stacks |
| Partial Reconfiguration Support | Allows dynamic logic swapping without system reset, critical for mission-critical reconfigurable systems |
| Secure Boot with AES-GCM Decryption | Ensures authenticated and encrypted bitstream loading to prevent IP theft or malicious firmware injection |
Applications
| AI Inference Acceleration | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time inference on vision transformer models deployed in edge servers. IC Role / Device Role / Timing Role: Programmable accelerator fabric executing custom tensor operators with deterministic low-latency response. Use Value: Delivers >2.1 TOPS/W efficiency using INT8 quantization and on-chip memory hierarchy optimized for sparse activation patterns. | Use Scenario: Digital pre-distortion (DPD) and channel estimation in active antenna units. IC Role / Device Role / Timing Role: Real-time signal processor implementing adaptive FIR filters and FFT/IFFT pipelines synchronized to RF sampling clocks. Use Value: Achieves <−55 dBc ACLR with 100 MHz bandwidth signals using 25.8 Gb/s transceivers and 7,520 DSP slices. |
| Phased Array Radar Processing | High-Fidelity Test Equipment |
Use Scenario: Beamforming and pulse-Doppler processing in ground-based surveillance radars. IC Role / Device Role / Timing Role: Coherent processing unit managing 128-channel ADC/DAC synchronization and STAP algorithms. Use Value: Enables sub-nanosecond inter-channel skew control across 832 I/O pins and deterministic latency under 8 ns for feedback loops. | Use Scenario: High-speed digital pattern generation and analysis in automated test systems. IC Role / Device Role / Timing Role: Reconfigurable logic engine generating multi-gigabit stimulus waveforms and performing real-time error detection. Use Value: Supports 25.8 Gb/s PRBS pattern generation with <1.5 ps RMS jitter, meeting IEEE 1149.6 AC-coupled boundary-scan requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGB2104I | 1,422K logic cells, 10,240 DSP slices, same package and transceiver spec | Higher compute density required for larger-scale AI model partitioning | Select when additional logic and DSP resources are needed without changing PCB layout |
| XCVU9P-2FLGB2104I | 979K logic cells, 6,240 DSP slices, identical pinout and speed grade | Lower-cost alternative for mid-tier 5G fronthaul or imaging subsystems | Choose when application fits within reduced resource budget and thermal envelope |
Compared with XCVU11P-2FLGB2104I, the XCVU13P-2FLGB2104I offers higher logic and DSP capacity for scaling compute-intensive workloads, while the XCVU9P-2FLGB2104I reduces cost and power at the expense of resource headroom-both retain identical packaging and transceiver compatibility.
Availability
XCVU11P-2FLGB2104I is available at Aetrix Electronics and suitable for AI inference accelerators, 5G massive MIMO baseband units, and phased array radar systems requiring stable component supply across extended production lifecycles.
Supply support for XCVU11P-2FLGB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and aerospace applications.
The Virtex UltraScale+ family targets high-throughput, low-latency signal and packet processing in infrastructure-grade systems where deterministic timing and hardened IP integration are critical.
FAQ
What is the maximum supported transceiver data rate for XCVU11P-2FLGB2104I?
The XCVU11P-2FLGB2104I supports transceiver data rates up to 25.8 Gb/s per lane, validated across all 64 GTY transceiver quads. This rating applies under -2 speed grade conditions with specified power supply ripple and board-level signal integrity compliance per AMD UG578 v1.15.2.
Does XCVU11P-2FLGB2104I support partial reconfiguration?
Yes, XCVU11P-2FLGB2104I fully supports partial reconfiguration through Vivado Design Suite v2023.2+. This capability allows dynamic swapping of logic modules without resetting the entire device, enabling runtime adaptation in radar beamforming and protocol-aware test equipment.
What configuration modes are supported by XCVU11P-2FLGB2104I?
XCVU11P-2FLGB2104I supports Master SPI, Slave Serial, and BPI configuration modes. Dual-image fallback is enabled via CONFIG_IO pin assertion, allowing automatic recovery from corrupted primary bitstreams stored in QSPI flash.
Is XCVU11P-2FLGB2104I qualified for automotive applications?
No, XCVU11P-2FLGB2104I is not AEC-Q100 qualified and is intended for industrial, aerospace, and communications infrastructure use. Its I-grade temperature range (−40°C to +100°C) meets extended commercial requirements but excludes automotive qualification testing.
What DDR memory standards does XCVU11P-2FLGB2104I support?
XCVU11P-2FLGB2104I supports DDR4-2400 and LPDDR4-4266 with built-in ECC and calibration logic. The memory controller complies with JEDEC JESD79-4 and JESD209-4 specifications and requires external PHY-less DIMMs or discrete DRAM components.
XCVU11P-2FLGB2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 162000
- Number of Logic Elements/Cells:
- 2835000
- Total RAM Bits:
- 396150400
- Number of I/O:
- 572
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU11P-2FLGB2104I FAQ
1.How can I place an order for XCVU11P-2FLGB2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU11P-2FLGB2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU11P-2FLGB2104I reliable?
The price and inventory of XCVU11P-2FLGB2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU11P-2FLGB2104I is usually 5 days.
3.What payment methods are accepted for XCVU11P-2FLGB2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU11P-2FLGB2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU11P-2FLGB2104I?
XCVU11P-2FLGB2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU11P-2FLGB2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU11P-2FLGB2104I?
For technical support, including XCVU11P-2FLGB2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU11P-2FLGB2104I requirements.
6.How does Aetrix verify that XCVU11P-2FLGB2104I is sourced from the original manufacturer or authorized distributors?
All XCVU11P-2FLGB2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU11P-2FLGB2104I meets industry standards.
7.What is the process for return or replacement of XCVU11P-2FLGB2104I?
All XCVU11P-2FLGB2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU11P-2FLGB2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU11P-2FLGB2104I part is unused and in its original packaging.
Return procedure for XCVU11P-2FLGB2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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