AMD XCVU11P-2FLGC2104E

Overview

XCVU11P-2FLGC2104E from Xilinx is a high-performance Virtex UltraScale+ FPGA featuring 3.6M system logic cells, 38 TOP/s DSP compute performance, and support for 58G PAM4 transceivers up to 48 lanes - enabling multi-terabit data center interconnects, 100G+ Ethernet packet processing, and waveform-intensive RF signal chains.

For engineers reviewing the XCVU11P-2FLGC2104E datasheet, pinout, applications, or equivalent options, key selection criteria include HBM Gen2 integration capability, PCIe Gen3 x16 block availability, KR4-FEC-enabled 100G Ethernet MAC, SmartConnect interconnect optimization, and 16nm FinFET+ process-based power efficiency.

Technical Context

The XCVU11P-2FLGC2104E implements the ASIC-class UltraScale+ architecture with monolithic 16nm FinFET+ die, delivering 1.6× fabric performance over Virtex-7 and supporting VCXO + fractional PLL clocking for jitter-sensitive timing domains. It integrates hardened 100G Ethernet MACs with KR4-FEC and 150G Interlaken cores for deterministic packet processing.

Its SmartConnect technology performs automatic AXI interface bridging and interconnect optimization, while optional HBM Gen2 (up to 8GB) provides 460GB/s memory bandwidth - eliminating discrete DRAM bottlenecks in AI inference acceleration and high-throughput baseband processing.

Key Specifications

Pinout & Package

The XCVU11P-2FLGC2104E is housed in a 2104-pin Flip-Chip BGA (FLGC2104) package with 1.0 mm ball pitch, optimized for high-speed signal integrity and thermal dissipation in dense compute modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth FPGA applications.

Compared with XCVU11P-2FLGC2104E, the XCVU13P offers higher performance headroom at increased cost and board area, while the XCVU9P provides a lower-cost, pin-compatible alternative lacking HBM and PAM4 - making the XCVU11P the optimal balance of bandwidth, logic capacity, and integration for terabit-scale infrastructure.

Availability

XCVU11P-2FLGC2104E is available at Aetrix Electronics and suitable for 5G infrastructure, data center smartNICs, radar signal processing, and high-frequency trading systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for XCVU11P-2FLGC2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic and adaptive computing, delivering FPGA, ACAP, and SoC solutions for high-performance, low-latency, and power-efficient systems.

The Virtex UltraScale+ product line targets infrastructure-grade applications demanding ASIC-level performance with FPGA flexibility - specifically engineered for terabit networking, AI inference acceleration, and real-time signal processing in mission-critical environments.

FAQ

What is the maximum supported transceiver data rate for XCVU11P-2FLGC2104E?

The XCVU11P-2FLGC2104E supports up to 58 Gb/s using PAM4 signaling across 48 transceiver lanes, or 32.75 Gb/s using NRZ signaling across 128 lanes. These rates are validated per Xilinx DS923 and UG578 documentation, and require proper PCB stackup, controlled impedance routing, and compliance with IEEE 802.3cd for PAM4 operation. The XCVU11P-2FLGC2104E transceiver architecture includes built-in decision feedback equalization and adaptive linear equalization to maintain signal integrity at these speeds.

Does XCVU11P-2FLGC2104E include integrated high-bandwidth memory (HBM)?

Yes, the XCVU11P-2FLGC2104E integrates HBM2 memory - up to 8 GB in-package - delivering 460 GB/s of memory bandwidth. This HBM2 stack is physically and electrically integrated within the FLGC2104 package and is accessible via AXI4-HBM master interfaces. The XCVU11P-2FLGC2104E does not require external memory controllers or PHYs, and its HBM2 implementation complies with JEDEC JESD235B standards.

What PCIe generation and lane count does XCVU11P-2FLGC2104E support?

The XCVU11P-2FLGC2104E includes hardened PCIe Gen3 x16 endpoints with full root complex and endpoint capability, supporting 128 GT/s aggregate bandwidth. It also supports CCIX 1.1 cache-coherent extensions for CPU-FPGA memory sharing. The XCVU11P-2FLGC2104E PCIe blocks are fully compliant with PCI-SIG specifications and validated in Xilinx UG578 and PG194 documentation.

Is XCVU11P-2FLGC2104E pin-compatible with other Virtex UltraScale+ devices?

No, the XCVU11P-2FLGC2104E uses the FLGC2104 package, which is unique to this device variant and not shared with other Virtex UltraScale+ FPGAs. While XCVU9P-2FLGA2104I shares the same 2104-ball count, it uses FLGA2104 - a different package with distinct ball map, power delivery structure, and thermal characteristics. The XCVU11P-2FLGC2104E requires its specific footprint and cannot be substituted without PCB redesign.

What clocking resources are integrated into XCVU11P-2FLGC2104E?

The XCVU11P-2FLGC2104E integrates multiple clock management resources including MMCMs, PLLs, and a VCXO interface block. It supports fractional-N PLLs for fine-grained frequency synthesis and jitter attenuation, and includes dedicated clock routing networks with <50 ps skew across the die. The XCVU11P-2FLGC2104E also supports external VCXO inputs for ultra-low-jitter reference clocks required in 100G Ethernet and radar timing applications.