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AMD XCVU11P-2FLGF1924I
- Part No.:
- XCVU11P-2FLGF1924I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XCVU11P-2FLGF1924I.pdf
- Description:
- IC FPGA 624 I/O 1924FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,920
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Product details
Overview
XCVU11P-2FLGF1924I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,182K logic cells, 7,520 DSP slices, and 84.2 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCI Express Gen4 x16, targeting high-bandwidth data center acceleration and 5G wireless infrastructure.
For engineers reviewing the XCVU11P-2FLGF1924I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (40 GTY), I/O voltage support (1.8 V / 1.2 V / 0.85 V), and thermal design power (TDP) of 55 W under typical configuration.
Technical Context
The XCVU11P-2FLGF1924I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and ultra-low-latency memory interfaces. It supports multi-chip module (MCM) integration via silicon interposer technology for scalable compute density.
Configuration is performed via dual-mode JTAG or PCIe-based partial reconfiguration. The device uses 16 nm FinFET process technology and includes integrated system monitoring (temperature, voltage, current) with on-die sensors and I²C interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,182,000 - determines maximum combinational/sequential logic capacity for custom datapath implementation |
| DSP Slices | 7,520 - enables parallel high-throughput arithmetic (INT27/FMA32) for AI inference or signal processing |
| Block RAM | 84.2 Mb - provides on-chip memory for buffering, FIFOs, or lookup tables without external DRAM latency |
| GTY Transceivers | 40 lanes @ 25.8 Gb/s - supports 100G Ethernet (4×25G), CPRI/eCPRI, and high-speed serial backplane links |
| I/O Standards | Supports LVDS, SSTL, HSTL, MIPI, and sub-1V banks - enables direct interfacing to DDR4, QSFP28, and image sensors |
| TDP | 55 W (typical) - defines thermal envelope for heatsink sizing and airflow planning in 1U server or O-RAN radio units |
Pinout & Package
The XCVU11P-2FLGF1924I is housed in a 1924-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 1.0 mm ball pitch and 42.5 mm × 42.5 mm body size. Thermal pad on underside requires solder paste stencil design per AMD UG570.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as SDIO, UART, SPI, I²C, or GPIO - used for boot configuration and peripheral control |
| HP[0:63] | High-Performance I/O Bank | Supports 1.8 V / 1.2 V / 0.85 V - connects to DDR4 memory or high-speed SerDes peripherals |
| HR[0:47] | High-Density I/O Bank | 1.8 V / 2.5 V tolerant - interfaces with legacy FMC mezzanine cards or industrial sensors |
| GTYTXN/GTYTXP | Differential Transmitter | 40 pairs for 25.8 Gb/s serial output - routed with controlled impedance (85 Ω differential) and length matching |
| GTYRXN/GTYRXP | Differential Receiver | 40 pairs for 25.8 Gb/s serial input - requires AC coupling capacitors and common-mode voltage biasing |
| VCCINT/VCCAUX | Core/Auxiliary Supply | 0.85 V core, 1.8 V auxiliary - demands low-noise, phase-matched VRMs with <10 mV ripple |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Root Port | Reduces host CPU overhead by enabling direct DMA access to FPGA memory-mapped regions |
| UltraScale+ Memory Controller (DDR4/LPDDR4) | Delivers up to 128 GB/s memory bandwidth with ECC support for mission-critical workloads |
| Partial Reconfiguration Support | Allows dynamic swapping of logic partitions without system reset - critical for runtime protocol adaptation |
| Integrated System Monitor (XADC) | Provides real-time die temperature, supply voltage, and current telemetry via I²C or JTAG |
| Security Boot with AES-256 & SHA-3 | Ensures authenticated bitstream loading - prevents unauthorized firmware execution in secure edge deployments |
Applications
| Data Center Acceleration | 5G Radio Unit (RU) |
|---|---|
Use Scenario: Offloading L1/L2 baseband processing (FFT, LDPC, channel estimation) in Open RAN compliant radios. IC Role / Device Role / Timing Role: Real-time signal processor with deterministic sub-100 ns latency for symbol-level scheduling. Use Value: Enables 4× carrier aggregation at 100 MHz bandwidth using 40 GTY lanes and 7,520 DSP slices. | Use Scenario: High-throughput fronthaul transport between DU and RU using eCPRI over 25G optical links. IC Role / Device Role / Timing Role: Protocol mapper and packetizer with precise timestamp alignment across multiple RF chains. Use Value: Achieves <±2 ns timing skew across 8 eCPRI streams via deterministic clock domain crossing and hardened 25.8 Gb/s transceivers. |
| AI Inference Server | Test & Measurement Equipment |
Use Scenario: Custom CNN accelerator for low-latency video analytics in edge servers with NVMe storage backend. IC Role / Device Role / Timing Role: Co-processor tightly coupled to x86 host via PCIe Gen4 x16, managing DMA and memory coherence. Use Value: Delivers 21 TOPS INT8 throughput using 1,182K logic cells and 84.2 Mb block RAM for weight caching. | Use Scenario: High-resolution oscilloscope front-end with 10 GS/s sampling and real-time FFT analysis. IC Role / Device Role / Timing Role: Digital signal conditioner and trigger engine synchronized to analog ADC clocks. Use Value: Supports 16-bit resolution at 1 GS/s using DDR4 memory controller and 128 GB/s bandwidth for deep waveform capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577I | 1,422K logic cells, 52 GTY lanes, 102.4 Mb BRAM, TDP = 65 W | Higher transceiver count and memory bandwidth for 400G Ethernet line cards | Select when >40 GTY lanes or >84 Mb BRAM required; larger package (2577-ball) increases PCB routing complexity |
| XCVU9P-2FLGA2104I | 979K logic cells, 32 GTY lanes, 64.8 Mb BRAM, TDP = 45 W | Lower cost and power for mid-scale 5G DU or AI inference edge nodes | Choose for reduced thermal budget and smaller form factor where 40 GTY lanes are not needed |
Compared with XCVU11P-2FLGF1924I, the XCVU13P offers higher scalability at increased power and layout cost, while the XCVU9P trades transceiver count and logic density for lower TDP and footprint - making XCVU11P the balanced choice for 100G–200G systems requiring optimal I/O-to-power ratio.
Availability
XCVU11P-2FLGF1924I is available at Aetrix Electronics and suitable for data center acceleration, 5G radio unit deployment, and AI inference server development requiring stable component supply and long-term lifecycle assurance.
Supply support for XCVU11P-2FLGF1924I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and client applications.
The Virtex UltraScale+ family targets high-performance, high-bandwidth systems demanding hardened connectivity, memory, and security - especially in 5G infrastructure, cloud acceleration, and test equipment.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCVU11P-2FLGF1924I?
The XCVU11P-2FLGF1924I supports GTY transceivers operating up to 25.8 Gb/s per lane. This rate is validated for protocols including 100G Ethernet (4×25G), CPRI, and eCPRI. Operation at full speed requires proper PCB stack-up, AC coupling, and reference clock jitter below 500 fs RMS, as specified in AMD UG578.
Does the XCVU11P-2FLGF1924I support PCIe Gen4 x16 root complex functionality?
Yes, the XCVU11P-2FLGF1924I includes a hardened PCIe Gen4 x16 root port IP block. It supports link training, ASPM, AER, and MSI-X natively. The XCVU11P-2FLGF1924I can act as a host-facing endpoint or root complex depending on configuration, with full compliance to PCIe Base Spec 4.0 and CEM 4.0 mechanical requirements.
What I/O standards are supported in the HP I/O banks of the XCVU11P-2FLGF1924I?
The HP I/O banks of the XCVU11P-2FLGF1924I support 0.85 V, 1.2 V, and 1.8 V operation with standards including SSTL-18, HSTL-I, LVDS, MIPI D-PHY, and sub-1V differential signaling. These banks are optimized for DDR4 memory interfaces and high-speed SerDes peripherals, with programmable output drive strength and input termination.
How is configuration performed for the XCVU11P-2FLGF1924I?
Configuration of the XCVU11P-2FLGF1924I can be performed via JTAG (IEEE 1149.1), PCIe-based configuration (using Configuration Space Access), or master SPI/BPI mode from external flash. Dual-boot capability allows fallback to secondary bitstream if primary fails, enhancing field reliability in unattended deployments of XCVU11P-2FLGF1924I.
What thermal management guidance applies to the XCVU11P-2FLGF1924I in a 1U server environment?
The XCVU11P-2FLGF1924I has a typical TDP of 55 W. In a 1U server, AMD recommends a copper heat spreader with ≥40 W/m·K thermal interface material, forced airflow ≥200 LFM, and board-level thermal vias under the thermal pad. Junction temperature must remain ≤100°C per UG570, requiring thermal simulation before final mechanical design of XCVU11P-2FLGF1924I systems.
XCVU11P-2FLGF1924I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 162000
- Number of Logic Elements/Cells:
- 2835000
- Total RAM Bits:
- 396150400
- Number of I/O:
- 624
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1924-FCBGA (45x45)
XCVU11P-2FLGF1924I FAQ
1.How can I place an order for XCVU11P-2FLGF1924I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU11P-2FLGF1924I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU11P-2FLGF1924I reliable?
The price and inventory of XCVU11P-2FLGF1924I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU11P-2FLGF1924I is usually 5 days.
3.What payment methods are accepted for XCVU11P-2FLGF1924I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU11P-2FLGF1924I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU11P-2FLGF1924I?
XCVU11P-2FLGF1924I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU11P-2FLGF1924I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU11P-2FLGF1924I?
For technical support, including XCVU11P-2FLGF1924I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU11P-2FLGF1924I requirements.
6.How does Aetrix verify that XCVU11P-2FLGF1924I is sourced from the original manufacturer or authorized distributors?
All XCVU11P-2FLGF1924I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU11P-2FLGF1924I meets industry standards.
7.What is the process for return or replacement of XCVU11P-2FLGF1924I?
All XCVU11P-2FLGF1924I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU11P-2FLGF1924I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU11P-2FLGF1924I part is unused and in its original packaging.
Return procedure for XCVU11P-2FLGF1924I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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